Expanded heat sink for electronic displays

• US 9,797,588 B2
• Filed: 03/14/2016
• Issued: 10/24/2017
• Est. Priority Date: 03/03/2008
• Status: Active Grant

• Current Assignee: Manufacturing Resources International, Inc.
• Original Assignee: Manufacturing Resources International, Inc.
• Inventors: Dunn, William, Bedell, Ware, Hubbard, Tim
• Primary Examiner(s): BLEVINS, JERRY M
• Application Number:
  US15/069,154
• Publication Number:
  US 20160195254A1
• Time in Patent Office: 589 Days
• Field of Search: 349161, 362 973
• CPC Class Codes: F21V 29/502 characterised by the adaptation for cooling of specific components
• CPC Class Codes: F21V 29/503 of light sources cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H01L33/64
• CPC Class Codes: F21V 29/673 the fans being used for intake
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: G02F 1/133308 Support structures for LCD panels, e.g. frames or bezels
• CPC Class Codes: G02F 1/13332 Front frames
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133628 with cooling means
• CPC Class Codes: G02F 2201/36 Airflow channels, e.g. constructional arrangements facilitating the flow of air

Abstract

Exemplary embodiments provide an electronic display assembly. One or more heat-generating components are preferably placed in thermal communication with a plate. One or more fans are placed to draw cooling air along the plate to remove the heat removed from the component. Some embodiments may place the plate behind the electronic image assembly, so that cooling air can remove heat from the plate as well as the electronic image assembly. Exemplary embodiments have power modules in thermal communication with optional conductive ribs. Conductive thermal communication is established between the optional ribs and the components in the exemplary embodiments.

Claims

1. An electronic display assembly comprising:

a liquid crystal display having a direct LED backlight with a rear surface;

a plate having a front side facing the direct LED backlight and a rear side opposing the front side, where the plate is spaced apart from the rear surface of the LED backlight to define a channel therebetween;

an electronic component located along the rear side of the plate; and

a fan positioned to draw cooling air through the channel;

wherein the cooling air is prohibited from contacting the electronic component.

2. The electronic display assembly of claim 1 further comprising:

a plurality of thermally conductive ribs extending from the front side of the plate so as to reside within the channel between the LED backlight and the plate.

3. The electronic display assembly of claim 2 wherein:

the ribs are in conductive thermal communication with the plate and the direct LED backlight.

4. The electronic display assembly of claim 2 wherein:

the ribs are elongate metallic members having lengths parallel to the path of the cooling air.

5. The electronic display assembly of claim 2 wherein:

the plate provides a gaseous and contaminate barrier between the ribs and the electronic component.

6. The electronic display assembly of claim 2 wherein:

the ribs are positioned to absorb heat from the plate.

7. The electronic display assembly of claim 2 wherein:

the ribs have a hollow rectangular cross-section.

8. The electronic display assembly of claim 2 wherein:

the ribs have an I-beam cross-section.

9. The electronic display assembly of claim 2 wherein:

the ribs have a honeycomb cross-section.

10. The electronic display assembly of claim 2 further comprising:

an additional component attached to the plate.

11. The electronic display assembly of claim 1 wherein:

the electronic component is in conductive thermal communication with the plate.

12. The electronic display assembly of claim 2 wherein:

the plate and ribs are metallic.

13. The electronic display assembly of claim 1 wherein:

the electronic component is a power module.

14. The electronic display assembly of claim 2 further comprising:

an additional plate in thermal communication with the ribs.

15. A electronic display assembly comprising:

a liquid crystal display having a front viewing surface and a direct LED backlight placed behind the liquid crystal display;

a plate positioned behind the direct LED backlight;

an electronic component located along the plate and in conductive thermal communication with the plate; and

a fan positioned to draw cooling air between the direct LED backlight and the plate;

wherein the cooling air is prohibited from contacting the front viewing surface of the liquid crystal display or the electronic component.

16. The electronic display assembly of claim 15 wherein:

the cooling air is ambient air and the path provided for the cooling air surrounds the electronic display assembly.

17. The electronic display assembly of claim 15 wherein:

the path provided for the cooling air will allow the cooling air to remove heat from the direct LED backlight as well as the plate.

18. The electronic display assembly of claim 15 wherein:

the electronic component is electrically connected to the liquid crystal display.

19. A electronic display assembly comprising:

an electronic display having a front viewing surface and a rear surface;

a plate positioned behind the rear surface of the electronic display to define a channel therebetween;

an electronic component located along the plate but positioned outside of the channel, the electronic component in conductive thermal communication with the plate; and

a fan positioned to cause ambient air to flow through the channel;

wherein the flow of ambient air is restricted to the channel and prohibited from contact with the front viewing surface of the electronic display or the electronic component.

20. The electronic display assembly of claim 19 wherein:

the electronic component is a power module.