Temperature compensation system for an electronic device

• US 9,797,619 B2
• Filed: 03/14/2014
• Issued: 10/24/2017
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: Ademco Inc. (Resideo Technologies, Inc.)
• Original Assignee: Honeywell International Inc.
• Inventors: Aljabari, Mohammad, Lunacek, Michael
• Primary Examiner(s): Hann, Jay B
• Application Number:
  US14/214,446
• Publication Number:
  US 20140277770A1
• Time in Patent Office: 1,320 Days
• CPC Class Codes: F24F 11/30 for purposes related to the operation of the system, e.g. for safety or monitoring
• CPC Class Codes: F24F 11/32 Responding to malfunctions or emergencies
• CPC Class Codes: F24F 11/52 Indication arrangements, e.g. displays
• CPC Class Codes: G01K 7/42 Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
• CPC Class Codes: G02F 1/133308 Support structures for LCD panels, e.g. frames or bezels
• CPC Class Codes: G02F 1/133314 Back frames
• CPC Class Codes: G05D 23/1904 variable in time
• CPC Class Codes: G05D 23/1905 associated with tele control
• CPC Class Codes: G05D 23/32 with provision for adjustment of the effect of the auxiliary heating device, e.g. a function of time
• CPC Class Codes: H01R 4/34 Conductive members located under head of screw
• CPC Class Codes: H02G 3/10 for surface mounting on a wall
• CPC Class Codes: H02G 3/14 Fastening of cover or lid to box
• CPC Class Codes: H02H 9/005 avoiding undesired transient conditions
• CPC Class Codes: H02H 9/04 responsive to excess voltage lightning arrestors H01C7/12, H01C8/04, H01G9/18, H01T
• CPC Class Codes: H05F 3/00 Carrying-off electrostatic charges from shoes A43B7/36; from living beings A61N1/14; from tyres B60C19/08; from vehicles B60R16/06; from aircraft B64D45/02; from large containers B65D90/46
• CPC Class Codes: H05K 1/0254 High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection electrostatic discharge protection for electric apparatus in general H05K9/0067, H05K9/0079; Arrangements for regulating voltages or for using plural voltages
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 13/0015 Orientation; Alignment; Positioning
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 5/0017 : with operator interface units
• CPC Class Codes: H05K 5/0018 : having an electronic display
• CPC Class Codes: H05K 7/1422 : Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
• CPC Class Codes: H05K 7/1427 : Housings
• CPC Class Codes: H05K 9/0037 : Housings with compartments containing a PCB, e.g. partitioning walls
• CPC Class Codes: H05K 9/0054 : specially adapted for display applications
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49826 : Assembling or joining

Abstract

Systems and methods herein include features for compensating a temperature reading of a thermostat. The thermostat may include a housing and one or more temperature sensors within the housing. The thermostat may sense a temperature using one or more of the temperature sensors. A processor and/or memory of the thermostat may be capable of and/or configured to compensate the sensed temperature with a first temperature compensation model and compensate the sensed temperature with a second temperature compensation model. During compensation of the sensed temperature, the system may transition from compensating the sensed temperature with the first temperature compensation model to compensating the sensed temperature with the second temperature compensation model over time and independent of the sensed temperature.

Claims

1. A method of compensating a temperature reading of a thermostat that is configured to control a heating, ventilation, and air conditioning (HVAC) system of a building, wherein the thermostat has a housing and one or more temperature sensors for sensing a temperature within the housing, the method comprising:

sensing a temperature using the one or more temperature sensors of the thermostat;

compensating the sensed temperature with a first temperature compensation model;

compensating the sensed temperature with a second temperature compensation model; and

transitioning from compensating the sensed temperature with the first temperature compensation model to compensating the sensed temperature with the second temperature compensation model over time by weighting the first temperature compensation model and the second temperature compensation model with respect to one another to determine a compensated sensed temperature, wherein one or more weights applied to the first temperature compensation model and one or more weights applied to the second temperature compensation model are each a function of time; and

sending control signals to the HVAC system of the building to control an ambient temperature about the thermostat in accordance with the compensated sensed temperature.

2. The method of claim 1, wherein the one or more weights applied to the first temperature compensation model and the one or more weights applied to the second temperature compensation model are each a linear function of time.

3. The method of claim 1, further comprising:

applying a weight that is a function of time to the first temperature compensation model, wherein the weight applied to the first temperature compensation model has a greater weight at a time of power up of the thermostat than at a time of power up plus a period of time.

4. The method of claim 1, further comprising:

applying a weight that is a function of time to the second temperature compensation model, wherein the second temperature compensation model has a greater weight at power up plus a period of time than at power up of the thermostat.

5. The method of claim 1, wherein the first temperature compensation model is an initial condition temperature compensation model.

6. The method of claim 1, wherein the second temperature compensation model is a steady state compensation model.

7. The method of claim 1, wherein transitioning from compensating the sensed temperature with the first temperature compensation model to compensating the sensed temperature with the second temperature compensation model is performed according to the following equation:

Temp_comp=F_blend(TIME)=((T−

TIME)/T)*F_first+(TIME/T)*F_second

wherein;

T=time of transition from initial power up of the electronic assembly to steady state of the electronic assembly;

TIME=the time from initial power up, where TIME=0;

F_first=function of the first temperature compensation model;

F_second=function of the second temperature compensation model;

F_blend=Function resulting in a compensated sensed temperature at a time=TIME;

(T−

TIME)/T=Weight that is a function of time T that is applied to F_first;

TIME/T=Weight that is a function of time T that is applied to F_second; and

Temp_comp=compensated temperature for a sensed temperature.

8. The method of claim 1, wherein at one or more times the sensed temperature is compensated with a first temperature compensation model occurs simultaneously with compensating the sensed temperature with a second temperature compensation model.

9. The method of claim 1, wherein one or more of the first temperature compensation model and the second temperature compensation model are functions of one or more of a voltage level at the thermostat, an amount of time a screen of the thermostat has been lit over a period of time, a signal from one or more thermistors in the housing, a radio activity status, a light emitting diode (LED) status, and a power level at user interface buttons.

10. An electronic assembly configured to increase a sensed temperature estimation accuracy, comprising:

a housing;

a printed wiring assembly at least partially enclosed by the housing, wherein the printed wiring assembly includes a processor and memory;

a temperature sensor in communication with the printed wiring assembly for sensing a temperature;

a display in communication with the printed wiring assembly, the display configured to display a compensated sensed temperature;

wherein the printed wiring assembly calculates the compensated sensed temperature by;

compensating the sensed temperature with a first temperature compensation model;

compensating the sensed temperature with a second temperature compensation model; and

transitioning from compensating the sensed temperature with the first temperature compensation model to compensating the sensed temperature with the second temperature compensation model over time and independent of the sensed temperature by weighting the first temperature compensation model and the second temperature compensation model with respect to one another, wherein the weighting includes applying weights that are a function of time to the first temperature compensation model and to the second temperature compensation model.

11. The assembly of claim 10, wherein the first temperature compensation model and the second temperature compensation model are weighted with respect to one another as a linear function of time.

12. The assembly of claim 10, wherein calculating the compensated sensed temperature with the printed wiring assembly further includes:

applying a weight that is a function of time to the first temperature compensation model, wherein the weight applied to the first temperature compensation model has a greater weight at a time of power up of the electronic assembly than at a time of power up plus a period of time.

13. The assembly of claim 10, wherein calculating the compensated sensed temperature with the printed wiring assembly further includes:

applying a weight that is a function of time to the second temperature compensation model, wherein weight applied to the second temperature compensation model has a greater weight at power up plus a period of time than at power up of the electronic assembly.

14. The assembly of claim 10, wherein at one or more times, compensating the sensed temperature with a first temperature compensation model occurs simultaneously with compensating the sensed temperature with a second temperature compensation model.

15. The assembly of claim 10, wherein transitioning from compensating the sensed temperature with the first temperature compensation model to compensating the sensed temperature with the second temperature compensation model is performed according to the following equation:

Temp_comp=F_blend(TIME)=((T−

TIME)/T)*F_first+(TIME/T)*F_second

wherein;

T=time of transition from initial power up of the electronic assembly to steady state of the electronic assembly;

TIME=the time from initial power up, where TIME=0;

F_first=function of the first temperature compensation model;

F_second=function of the second temperature compensation model;

F_blend=Function resulting in a compensated sensed temperature at a time=TIME;

(T−

TIME)/T=Weight that is a function of time T that is applied to F_first;

TIME/T=Weight that is a function of time T that is applied to F_second; and

Temp_comp=compensated temperature for a sensed temperature.