Smartcard with coupling frame and method of increasing activation distance of a transponder chip module

• US 9,798,968 B2
• Filed: 09/22/2014
• Issued: 10/24/2017
• Est. Priority Date: 01/18/2013
• Status: Active Grant

• Current Assignee: AmaTech Group Limited (Paragon Group Limited)
• Original Assignee: Féinics AmaTech Teoranta (Paragon Group Limited)
• Inventors: Finn, David, Lotya, Mustafa, Molloy, Darren
• Primary Examiner(s): FRANKLIN, JAMARA ALZAIDA
• Application Number:
  US14/492,113
• Publication Number:
  US 20150021403A1
• Time in Patent Office: 1,128 Days
• Field of Search: 235492
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence
• CPC Class Codes: B23K 26/362 Laser etching
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07794 the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A conductive coupling frame (CF) having two ends, forming an open loop having two ends or a discontinuous metal layer disposed surrounding and closely adjacent a transponder chip module (TCM, 610), and substantially coplanar with an antenna structure (AS, CES, LES) in the transponder chip module (TCM). A metal card body (MCB, CB) or a transaction card with a discontinuous metal layer having a slit (S) or a non-conductive strip (NCS, 1034) extending from a module opening (MO) to a periphery of the card body to function as a coupling frame (CF). The coupling frame (CF) may be thick enough to be non-transparent to RF at frequencies of interest. A switch (SW) may be provided to connect ends of the coupling frame (CF) across the slit (S, 630). A reinforcing structure (RS) may be provided to stabilize the coupling frame (CF) and card body (CB). The transponder chip module (TCM) may comprise an antenna structure which may be a laser-etched antenna structure (LES) or a chemical-etched antenna structure (CES), and may comprise and a non-perforated contact pad (CP) arrangement. A coupling frame (CF) may be incorporated onto the module tape (MT, CCT) for a transponder chip module (TCM).

Claims

1. A coupling frame (CF) for a smartcard (SC), comprising:

a metal layer (ML) having an opening (MO) for receiving a transponder chip module;

and a discontinuity, comprising a slit (S) or a non-conductive stripe (NCS), extending from the opening to a periphery of the metal layer.

2. The coupling frame of claim 1, wherein:

the coupling frame is substantially coplanar with an antenna structure (AS) in the transponder chip module.

3. The coupling frame of claim 1, wherein:

at least a portion of the coupling frame overlaps at least a portion of an antenna structure (AS) in the transponder chip module (TCM).

4. The coupling frame (CF) of claim 1, wherein:

the transponder chip module (TCM) comprises an etched antenna structure (AS, LES); and

the module opening (MO) is spaced from 50 μ

m to 300 μ

m from the antenna structure.

5. The coupling frame (CF) of claim 1, wherein:

the metal layer (ML) has a thickness greater than a transparency threshold for a material of the metal layer (ML).

6. A method of enhancing coupling of a transponder chip module (TCM) with an external reader, wherein the transponder chip module is disposed in a card body (CB, MCB) of a smart card having a metal layer (ML) and comprises an antenna structure (AS), characterized by:

forming the metal layer as a coupling frame (CF) closely adjacent to and surrounding the transponder chip module, wherein the coupling frame has an opening for receiving the transponder chip module and a slit (S) or a non-conductive stripe (NCS), extending from the opening to a periphery of the metal layer.

7. The method of claim 6, wherein:

the coupling frame is substantially coplanar with the antenna structure (AS).

8. A smartcard comprising:

a transponder chip module comprising an RFID chip and an antenna; and

a coupling frame, comprising;

a metal layer;

an opening in the metal layer for receiving the transponder chip module; and

a discontinuity, comprising a slit or a non-conductive stripe, extending from the opening to a periphery of the metal layer;

wherein the coupling frame is disposed coplanar with the transponder chip module.

9. The smartcard of claim 8, wherein, when the transponder chip module is disposed in the opening, the smartcard is characterized by at least one of:

the coupling frame is disposed closely adjacent to the transponder chip module; and

a portion of the coupling frame overlaps a portion of an antenna structure (AS) in the transponder chip module.

10. The smartcard of claim 8, wherein the smartcard is characterized by at least one of:

the coupling frame extends over substantially the entire area of the smartcard;

the metal layer comprises a metal card body (MCB) of a metal smartcard.

11. The smartcard of claim 8, wherein the slit is characterized by at least one of:

the slit extends completely through the metal layer;

the slit extends only partially through the metal layer, and remaining material of the metal layer below the slit has a thickness below a transparency threshold for the metal layer;

the slit has a width which is smaller than the opening;

the slit is at least partially filled with an electrically non-conducting material selected from the group consisting of polymer and epoxy resin, reinforced epoxy resin; and

a reinforcing structure (RS) disposed at a location of the slit (S) to reinforce the metal layer (ML).

12. The smartcard of claim 8, wherein the metal layer comprises a material having a thickness selected from the group consisting of:

a thickness greater than a transparency threshold for absorbing electromagnetic waves at a frequency of interest;

a thickness greater than a skin depth for conducting electricity at a frequency of interest;

a thickness greater than 1 μ

m;

a thickness greater than 30 μ

m; and

a thickness up to the total normal thickness of a smartcard.

13. The smartcard of claim 8, wherein the metal layer is characterized by at least one of:

the metal layer comprises a material selected from the group consisting of copper, aluminum, brass, titanium, tungsten, stainless steel, silver, graphene, silver nanowires and conductive carbon ink;

the metal layer is disposed on a non-conductive layer by a process selected from the group consisting of silk screen printing and vapor deposition;

the metal layer comprises a mesh; and

the metal layer comprises an engraving, embossing, or stamped feature/logo/ID which serves as a security feature for the smartcard.

14. The smartcard of claim 8, wherein a gap between an inner edge of the coupling frame and an outer feature of an antenna structure (AS) in the transponder chip module is characterized by at least one of:

the gap is less than 300 μ

m; and

the gap is approximately 50 μ

m.

15. The smartcard of claim 8, wherein:

the metal layer (ML) is substantially coplanar with an antenna structure (AS) in the transponder chip module.

16. The smartcard of claim 8, wherein:

an antenna structure (AS) in the transponder chip module comprises a substantially planar, etched structure having a number of tracks separated by spaces.

17. The smartcard of claim 16, wherein the spaces between tracks are at least one of:

less than 100 μ

m;

less than 75 μ

m;

less than 50 μ

m;

less than 25 μ

m; and

less than the width of a laser beam.

18. The smartcard of claim 8, wherein

an activation distance for a transponder chip module disposed in the opening of the coupling frame is at least one of:

at least 20 mm;

at least 25 mm;

at least 30 mm;

at least 35 mm; and

at least 40 mm.

19. The smartcard of claim 8, further comprising at least one of:

a switch (SW) connected across ends of the coupling frame (CF); and

an LED connected across ends of the coupling frame (CF).