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Semiconductor packages and other circuit modules with porous and non-porous stabilizing layers

  • US 9,799,626 B2
  • Filed: 09/14/2015
  • Issued: 10/24/2017
  • Est. Priority Date: 09/15/2014
  • Status: Active Grant
First Claim
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1. A fabrication process comprising:

  • (1) obtaining an assembly comprising;

    one or more first modules each of which comprises circuitry comprising one or more contact pads;

    a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;

    wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure; and

    then(2) forming a first layer over the first structure, the first layer adhering to the one or more first modules and comprising an organic polymeric layer strengthening the assembly, the organic polymeric layer overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the organic polymeric layer being separated from the one or more areas by one or more gap regions underlying the first layer;

    wherein forming the first layer comprises;

    laminating a film comprising organic material over the first structure, the film being separated from the one or more areas and covering a top of each first module;

    curing the film to form the organic polymeric layer; and

    before or after completion of said curing, thinning the film to expose the top of at least one first module.

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