Semiconductor packages and other circuit modules with porous and non-porous stabilizing layers

• US 9,799,626 B2
• Filed: 09/14/2015
• Issued: 10/24/2017
• Est. Priority Date: 09/15/2014
• Status: Active Grant

• Current Assignee: Adeia Semiconductor Technologies LLC (f/k/a Invensas Corporation) (Adeia Inc.)
• Original Assignee: Adeia Semiconductor Technologies LLC (f/k/a Invensas Corporation) (Adeia Inc.)
• Inventors: Uzoh, Cyprian, Katkar, Rajesh
• Primary Examiner(s): Chambliss, Alonzo
• Application Number:
  US14/852,855
• Publication Number:
  US 20160079138A1
• Time in Patent Office: 771 Days
• CPC Class Codes: H01L 21/32133 by chemical means only
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/822 the substrate being a semiconductor, using silicon technology H01L21/8258 takes precedence
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/32013 the layer connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/81007 involving a permanent auxiliary member being left in the finished device, e.g. aids for holding or protecting the bump connector during or after the bonding process
• CPC Class Codes: H01L 2224/83007 involving a permanent auxiliary member being left in the finished device, e.g. aids for holding or protecting the layer connector during or after the bonding process
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/147 Semiconductor insulating substrates semiconductor conductive substrates H01L23/4926
• CPC Class Codes: H01L 23/15 Ceramic or glass substrates H01L23/142, H01L23/145, H01L23/147 take precedence
• CPC Class Codes: H01L 23/3128 : the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/3135 : Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/3142 : Sealing arrangements between parts, e.g. adhesion promotors
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49827 : Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/5384 : Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/072 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/115 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07025 : Polyimide
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/3511 : Warping

Abstract

Integrated circuits (ICs 110) are attached to a wafer (120W). A stabilization layer (404) is formed over the wafer to strengthen the structure for further processing. Unlike a conventional mold compound, the stabilization layer is separated from at least some wafer areas around the ICs by one or more gap regions (450) to reduce the thermo-mechanical stress on the wafer and hence the wafer warpage. Alternatively or in addition, the stabilization layer can be a porous material having a low horizontal elastic modulus to reduce the wafer warpage, but having a high flexural modulus to reduce warpage and otherwise strengthen the structure for further processing. Other features and advantages are also provided.

Claims

1. A fabrication process comprising:

(1) obtaining an assembly comprising;

one or more first modules each of which comprises circuitry comprising one or more contact pads;

a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;

wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure; and

then

(2) forming a first layer over the first structure, the first layer adhering to the one or more first modules and comprising an organic polymeric layer strengthening the assembly, the organic polymeric layer overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the organic polymeric layer being separated from the one or more areas by one or more gap regions underlying the first layer;

wherein forming the first layer comprises;

laminating a film comprising organic material over the first structure, the film being separated from the one or more areas and covering a top of each first module;

curing the film to form the organic polymeric layer; and

before or after completion of said curing, thinning the film to expose the top of at least one first module.

2. The fabrication process of claim 1 wherein the one or more gap regions form a continuous gap region surrounding each first module.

3. The fabrication process of claim 1 wherein the one or more first modules are a plurality of first modules.

4. The fabrication process of claim 3 wherein each first module has a sidewall surface exposed in the one or more gap regions.

5. The fabrication process of claim 1 wherein each first module comprises a semiconductor integrated circuit.

6. A fabrication process comprising:

(1) obtaining an assembly comprising;

one or more first modules each of which comprises circuitry comprising one or more contact pads;

a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;

wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure;

then

(2) forming a first layer over the first structure, the first layer adhering to the one or more first modules and overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the first layer being separated from the one or more areas by one or more gap regions underlying the first layer;

wherein the first layer adheres to a sidewall of at least one first module but does not cover the entire sidewall of the at least one first module; and

wherein forming the first layer comprises;

forming the first layer to cover a top of at least one first module; and

then

thinning the first layer to expose the top of said at least one first module.

7. A fabrication process comprising:

(1) obtaining an assembly comprising;

one or more first modules each of which comprises circuitry comprising one or more contact pads;

a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;

wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure; and

then

(2) forming a first layer over the first structure, the first layer adhering to the one or more first modules and overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the first layer being separated from the one or more areas by one or more gap regions underlying the first layer;

wherein at least one first module has a sidewall having a first part exposed in the one or more gap regions and having a second part overlying the first part, the second part adhering to the first layer; and

wherein forming the first layer comprises;

forming the first layer to cover a top of at least one first module; and

then

thinning the first layer to expose the top of said at least one first module.

8. A fabrication process comprising:

(1) obtaining an assembly comprising;

one or more first modules each of which comprises circuitry comprising one or more contact pads;

a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;

wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure; and

then

(2) forming a first layer over the first structure, the first layer adhering to the one or more first modules and overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the first layer being separated from the one or more areas by one or more gap regions underlying the first layer;

removing a bottom portion of the first structure while the first layer adheres to one or more first modules.

9. A fabrication process comprising:

(1) obtaining an assembly comprising;

one or more first modules each of which comprises circuitry comprising one or more contact pads;

a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;

wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure; and

then

(2) forming a first layer over the first structure, the first layer adhering to the one or more first modules and comprising an organic polymeric layer strengthening the assembly, the organic polymeric layer overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the organic polymeric layer being separated from the one or more areas by one or more gap regions underlying the first layer;

wherein forming the first layer comprises;

laminating a film comprising organic material over the first structure, the film being separated from the one or more areas; and

after laminating the film, curing the film to form the organic polymeric layer;

(3) after forming the first layer, dicing the first structure and the first layer to form a plurality of pieces each of which comprises at least one first module, a diced portion of the first structure, and a diced portion of the first layer.

10. The fabrication process of claim 9 further comprising attaching at least one said piece to a wiring substrate.

11. A structure comprising:

one or more first modules each of which comprises circuitry comprising one or more contact pads;

a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;

wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure; and

a first layer over the first structure, the first layer being an organic polymeric layer strengthening the structure, the first layer adhering to the one or more first modules and overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the first layer being separated from the one or more areas by one or more gap regions underlying the first layer;

wherein the first layer does not cover a top of at least one first module.

12. The structure of claim 11 wherein the one or more gap regions form a continuous gap region surrounding each first module.

13. The structure of claim 11 wherein the one or more first modules are a plurality of first modules.

14. The structure of claim 13 wherein each first module has a sidewall surface exposed in the one or more gap regions.

15. The structure of claim 11 wherein each first module comprises a semiconductor integrated circuit.

16. A structure comprising:

one or more first modules each of which comprises circuitry comprising one or more contact pads;

a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;

wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure; and

a first layer over the first structure, the first layer adhering to the one or more first modules and overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the first layer being separated from the one or more areas by one or more gap regions underlying the first layer;

wherein the first layer adheres to a sidewall of at least one first module but does not cover the entire sidewall of the at least one first module;

wherein the first layer does not cover a top of at least one first module.

17. A structure comprising:

one or more first modules each of which comprises circuitry comprising one or more contact pads;

a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;

wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure; and

a first layer over the first structure, the first layer adhering to the one or more first modules and overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the first layer being separated from the one or more areas by one or more gap regions underlying the first layer;

wherein at least one first module has a sidewall having a first part exposed in the one or more gap regions and having a second part overlying the first part, the second part adhering to the first layer;

wherein the first layer has a polished top surface and does not cover a top of at least one first module.

18. A fabrication process comprising:

(1) obtaining an assembly comprising;

one or more first modules each of which comprises circuitry comprising one or more contact pads;

a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;

wherein the one or more first modules are attached to the top side of the first structure, wherein the one or more contact pads of the one or more first modules being attached to the one or more contact pads of the first structure; and

then

(2) forming a first layer over the first structure, the first layer adhering to the one or more first modules, the first layer being porous and extending substantially along a first plane, the first layer having a lower elastic modulus along the first plane than a flexural modulus in a direction perpendicular to the first plane;

wherein the first layer consists essentially of a polyimide aerogel.

19. A structure comprising:

one or more first modules each of which comprises circuitry comprising one or more contact pads;

a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;

wherein the one or more first modules are attached to the top side of the first structure, the one or more contact pads of the one or more first modules being attached to the one or more contact pads of the first structure; and

a first layer over the first structure, the first layer adhering to the one or more first modules, the first layer being porous and extending substantially along a first plane, the first layer having a lower elastic modulus along the first plane than a flexural modulus in a direction perpendicular to the first plane;

wherein the first layer consists essentially of a polyimide aerogel.