Method for aligning micro-electronic components

• US 9,799,632 B2
• Filed: 03/13/2017
• Issued: 10/24/2017
• Est. Priority Date: 12/19/2013
• Status: Active Grant

• Current Assignee: IMEC International, Katholieke Universiteit Leuven
• Original Assignee: IMEC International, Katholieke Universiteit Leuven KU Leuven R&D
• Inventors: Dubey, Vikas, De Wolf, Ingrid, Beyne, Eric
• Primary Examiner(s): Lebentritt, Michael
• Application Number:
  US15/457,744
• Publication Number:
  US 20170186733A1
• Time in Patent Office: 225 Days
• Field of Search: None
• CPC Class Codes: H01L 2223/54426 for alignment
• CPC Class Codes: H01L 2224/0213 Alignment aids
• CPC Class Codes: H01L 2224/0214 Structure of the auxiliary member
• CPC Class Codes: H01L 2224/02145 Shape of the auxiliary member
• CPC Class Codes: H01L 2224/0217 Alignment aids
• CPC Class Codes: H01L 2224/02175 Flow barrier
• CPC Class Codes: H01L 2224/0218 Structure of the auxiliary member
• CPC Class Codes: H01L 2224/02185 Shape of the auxiliary member
• CPC Class Codes: H01L 2224/0224 Alignment aids
• CPC Class Codes: H01L 2224/0225 Structure of the auxiliary member
• CPC Class Codes: H01L 2224/02255 Shape of the auxiliary member
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/08145 the bodies being stacked
• CPC Class Codes: H01L 2224/08225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/0903 Bonding areas having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/10135 Alignment aids
• CPC Class Codes: H01L 2224/10145 Flow barriers
• CPC Class Codes: H01L 2224/10165 Alignment aids
• CPC Class Codes: H01L 2224/10175 Flow barriers
• CPC Class Codes: H01L 2224/13147 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/16145 : the bodies being stacked
• CPC Class Codes: H01L 2224/16147 : the bump connector connecting to a bonding area disposed in a recess of the surface
• CPC Class Codes: H01L 2224/16148 : the bump connector connecting to a bonding area protruding from the surface
• CPC Class Codes: H01L 2224/16225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 : the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16237 : the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/1703 : Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/80004 : being a removable or sacrificial coating
• CPC Class Codes: H01L 2224/80007 : involving a permanent auxiliary member being left in the finished device, e.g. aids for protecting the bonding area during or after the bonding process
• CPC Class Codes: H01L 2224/80121 : Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
• CPC Class Codes: H01L 2224/8013 : using marks formed on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/80132 : using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
• CPC Class Codes: H01L 2224/80143 : Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
• CPC Class Codes: H01L 2224/80203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/80894 : Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
• CPC Class Codes: H01L 2224/80895 : between electrically conductive surfaces, e.g. copper-copper direct bonding, surface activated bonding
• CPC Class Codes: H01L 2224/80896 : between electrically insulating surfaces, e.g. oxide or nitride layers
• CPC Class Codes: H01L 2224/80907 : Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step
• CPC Class Codes: H01L 2224/81002 : being a removable or sacrificial coating
• CPC Class Codes: H01L 2224/81007 : involving a permanent auxiliary member being left in the finished device, e.g. aids for holding or protecting the bump connector during or after the bonding process
• CPC Class Codes: H01L 2224/81121 : Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
• CPC Class Codes: H01L 2224/8113 : using marks formed on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81132 : using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
• CPC Class Codes: H01L 2224/81141 : Guiding structures both on and outside the body
• CPC Class Codes: H01L 2224/81143 : Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/81894 : Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
• CPC Class Codes: H01L 2224/81907 : Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step
• CPC Class Codes: H01L 2224/83143 : Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
• CPC Class Codes: H01L 2225/06513 : Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06517 : Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06541 : Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 2225/06593 : Mounting aids permanently on device; arrangements for alignment use of temporary supports H01L21/6835
• CPC Class Codes: H01L 23/3157 : Partial encapsulation or coating mask layer used as insulation layer H01L21/31
• CPC Class Codes: H01L 23/3192 : Multilayer coating
• CPC Class Codes: H01L 23/528 : Geometry or layout of the interconnection structure H01L27/0207 takes precedence; algorithms G06F30/00
• CPC Class Codes: H01L 23/544 : Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/02 : Bonding areas on insulating substrates, e.g. chip carriers, H01L23/49816, H01L23/49838, H01L23/5389; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/08 : of an individual bonding area
• CPC Class Codes: H01L 24/09 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/33 : of a plurality of layer connectors
• CPC Class Codes: H01L 24/80 : Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/3511 : Warping

Abstract

Alignment of a first micro-electronic component to a receiving surface of a second micro-electronic component is realized by a capillary force-induced self-alignment, combined with an electrostatic alignment. The latter is accomplished by providing at least one first electrical conductor line along the periphery of the first component, and at least one second electrical conductor along the periphery of the location on the receiving surface of the second component onto which the component is to be placed. The contact areas surrounded by the conductor lines are covered with a wetting layer. The electrical conductor lines may be embedded in a strip of anti-wetting material that runs along the peripheries to create a wettability contrast. The wettability contrast helps to maintain a drop of alignment liquid between the contact areas so as to obtain self-alignment by capillary force. By applying appropriate charges on the conductor lines, electrostatic self-alignment is realized, which improves the alignment obtained through capillary force and maintains the alignment during evaporation of the liquid.

Claims

1. An assembly of at least two components, comprising:

a first component and a second component;

wherein each of the first component and the second component comprises a contact area covered by a wetting layer;

wherein each of the first component and the second component comprises means for containing a liquid on the respective wetting layer;

wherein each of the first component and the second component comprises one or more conductor lines running along a circumference of the respective contact area, wherein the one or more conductor lines of the first component are arranged to face the one or more conductor lines of the second component;

and wherein at least one of the first component or the second component is provided with means for applying an electrical charge to the respective one or more conductor lines.

2. The assembly according to claim 1, wherein on at least one of the first component or the second component, the means for containing a liquid on the respective wetting layer includes at least one strip of anti-wetting material running along a circumference of the respective contact area.

3. The assembly according to claim 2, wherein on at least one of the first component or the second component, the respective one or more conductor lines is embedded in or located on top of the respective at least one strip of anti-wetting material.

4. The assembly according to claim 1, wherein on at least one of the first component or the second component, the means for containing a liquid on the respective wetting layer includes the respective one or more conductor lines, which are provided with anti-wetting properties.

5. The assembly according to claim 4, wherein the one or more conductor lines provided with anti-wetting properties includes the one or more conductor lines being embedded in a hydrophobic material.

6. The assembly according to claim 1, wherein on at least one of the first component or the second component, the means for containing a liquid on the respective wetting layer includes a vertical sidewall around the respective contact area.

7. The assembly according to claim 1, wherein on at least one of the first component or the second component, the respective one or more conductor lines are embedded in a first passivation layer and are covered by a second passivation layer.

8. The assembly according to claim 7, wherein the wetting layer includes the second passivation layer.

9. The assembly according to claim 1, wherein the first component comprises a pair of conductor lines, wherein the second component comprises a single conductor line, wherein the first component is configured to apply a first electric potential to a first conductor line of the pair of conductor lines and to apply a second electric potential to a second conductor line of the pair of conductor lines, while the second component is configured to apply no electric potential to the single conductor line, and wherein the first electrical potential has an opposite electrical charge of the second electric potential.

10. The assembly according to claim 9, wherein the pair of conductor lines includes interdigitated lateral extensions.

11. The assembly according to claim 1, wherein the first component is configured to apply a first electric potential to its respective one or more conductor lines, wherein the second component is configured to apply a second electric potential to its respective one or more conductor lines, and wherein the first electric potential has an opposite electrical charge of the second electric potential.

12. The assembly according to claim 1, wherein the first component includes a first bonding structure in the respective contact area, and the second component includes a second bonding structure in the respective contact area, and wherein the first bonding structure is arranged to align with and face the second bonding structure.

13. The assembly according to claim 12, wherein at least one of first bonding structure or the second bonding structure includes a solder ball or microbump.

14. The assembly according to claim 1, wherein at least one of the first component or the second component includes a single conductor line that runs in a closed loop along a circumference of the respective contact area.

15. The assembly according to claim 1, wherein each of the first component and the second component includes a single conductor line, wherein the first component is configured to apply a first electric potential to its respective single conductor line, wherein the second component is configured to apply a second electric potential to its respective single conductor line, and wherein the first electric potential has an opposite electrical charge of the second electric potential.

16. The assembly according to claim 1, wherein the first component and the second component are micro-electronic components.

17. The assembly according to claim 1, wherein the means for applying an electrical charge includes a contact lead.

18. The assembly according to claim 1, wherein the one or more conductor lines of the first component are located in a recess running around a circumference of the respective contact area of the first component, and wherein the conductor lines of the second component extend outwardly from a surface of the second component, wherein the recess of the first component and the surface of the second component are configured to fit together in a lock and key fashion.

19. The assembly according to claim 1, wherein the one or more conductor lines of the first component are facing and aligned with the one or more conductor lines of the second component.

20. The assembly according to claim 19, further comprising the liquid disposed between the contact area of the first component and the contact area of the second component.