Display with vias for concealed printed circuit and component attachment
First Claim
Patent Images
1. An electronic device comprising:
- a housing;
a display mounted in the housing, wherein the display comprises a substrate with first and second opposing surfaces, a thin-film transistor layer formed on the first surface, a via that extends from the first surface to the second surface, and a metal contact on the second surface that is electrically coupled to the via;
a first printed circuit with conductive traces;
a display driver integrated circuit mounted to the first printed circuit, wherein the display driver integrated circuit is electrically coupled to the metal contact through the conductive traces on the first printed circuit;
a second printed circuit that is electrically coupled to the display driver integrated circuit through the conductive traces on the first printed circuit; and
electroplated metal sidewalls in the via.
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Abstract
An electronic device may include a display. The display may be an organic light-emitting diode display. The organic light-emitting diode display may have a substrate layer, a layer of organic light-emitting diode structures, and a layer of sealant. Vias may be formed in the substrate layer by laser drilling. The vias may be filled with metal using electroplating or other metal deposition techniques. The vias may be connected to contacts on the rear surface of the display. Components such as flexible printed circuits, integrated circuits, connectors, and other circuitry may be mounted to the contacts on the rear surface of the display.
140 Citations
20 Claims
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1. An electronic device comprising:
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a housing; a display mounted in the housing, wherein the display comprises a substrate with first and second opposing surfaces, a thin-film transistor layer formed on the first surface, a via that extends from the first surface to the second surface, and a metal contact on the second surface that is electrically coupled to the via; a first printed circuit with conductive traces; a display driver integrated circuit mounted to the first printed circuit, wherein the display driver integrated circuit is electrically coupled to the metal contact through the conductive traces on the first printed circuit; a second printed circuit that is electrically coupled to the display driver integrated circuit through the conductive traces on the first printed circuit; and electroplated metal sidewalls in the via. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An electronic device, comprising;
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a housing; a display mounted in the housing, wherein the display comprises a display substrate having first and second opposing surfaces, first and second conductive vias that extend from the first surface to the second surface, wherein the first and second conductive vias comprise conductive material that extends from the first surface to the second surface, and thin-film transistor circuitry that is formed on the first surface and electrically coupled to the first and second conductive vias; and a conductive path that routes signals from the first conductive via to the second conductive via. - View Dependent Claims (12, 13, 14, 15, 16)
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17. An electronic device, comprising:
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a display, comprising; a display substrate having first and second opposing surfaces; a plurality of vias that extend through the display substrate from the first surface to the second surface; and thin-film transistor circuitry formed on the first surface of the display substrate; a display driver integrated circuit that transmits signals to the thin-film transistor circuitry through a first via in the plurality of vias, wherein the second surface of the display substrate is interposed between the display driver integrated circuit and the first surface of the display substrate; and a conductive trace that routes signals between a second via in the plurality of vias and a third via in the plurality of vias, wherein the second surface of the display substrate is interposed between the conductive trace and the first surface of the display substrate. - View Dependent Claims (18, 19, 20)
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Specification