Multiple MLCC modules

• US 9,805,872 B2
• Filed: 12/09/2015
• Issued: 10/31/2017
• Est. Priority Date: 12/09/2015
• Status: Active Grant

• Current Assignee: Kemet Electronics Corporation (Yageo Corporation)
• Original Assignee: Kemet Electronics Corporation (Yageo Corporation)
• Inventors: Miller, Galen W., McConnell, John E., Bultitude, John, Renner, Garry L.
• Primary Examiner(s): FERGUSON, DION
• Application Number:
  US14/963,766
• Publication Number:
  US 20170169955A1
• Time in Patent Office: 692 Days
• CPC Class Codes: H01G 2/106 Fixing the capacitor in a housing
• CPC Class Codes: H01G 4/224 Housing; Encapsulation
• CPC Class Codes: H01G 4/228 Terminals
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01G 4/38 Multiple capacitors, i.e. structural combinations of fixed capacitors

Abstract

An improved module is provided. The module comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first lead is connected to the first longitudinal edge by a first interconnect and a second lead is connected to the second longitudinal edge by a second interconnect.

Claims

1. A module comprising:

a multiplicity of electronic components wherein each electronic component of said electronic components comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge;

a first lead connected to each said first longitudinal edge by a first interconnect;

a second lead connected to said second longitudinal edge by a second interconnect.

2. The module of claim 1 wherein said first lead is connected to each first longitudinal edge by said first interconnect.

3. The module of claim 1 wherein said first lead is a flat plated lead with at least one said electronic component on each side of said flat plated lead.

4. The module of claim 1 wherein said first lead comprises an offset.

5. The module of claim 4 wherein said offset is selected from laterally offset and horizontally offset.

6. The module of claim 1 wherein said first lead is selected from a round lead frame and a flat lead.

7. The module of claim 6 wherein said first lead comprises at least one flattened region.

8. The module of claim 1 wherein said first lead is selected from a through-hole lead, surface mount lead and a compliant pin lead.

9. The module of claim 8 further comprising a through-hole assembly stand-off feature.

10. The module of claim 1 wherein said first lead comprises a material selected from a ferrous material and a non-ferrous material.

11. The module of claim 1 wherein at least one of said first interconnect or said second interconnect is selected from the group consisting of a transient liquid phase sintering conductive interconnect material, a conductive epoxy, polymer solder and a solder.

12. The module of claim 1 wherein each said electronic component is independently selected from the group consisting of a capacitor, a diode, a resistor, a varistor, an inductor, a fuse and an integrated circuit.

13. The module of claim 11 wherein at least one said electronic component is a capacitor.

14. The module of claim 13 wherein each said electronic component is a capacitor.

15. The module of claim 14 wherein each said capacitor is an MLCC.

16. The module of claim 1 wherein at least two said electronic components have a different size.

17. The module of claim 1 further comprising an encapsulation.

18. The module of claim 1 comprising at least 2 electronic components to no more than 100 electronic components.

19. The module of claim 1 further comprising at least one electronic component in a second row or a second column wherein adjacent longitudinal edges are attached by an interconnect.

20. A method for forming a module comprising:

providing a multiplicity of electronic components wherein each electronic component of said electronic components comprises a first external termination with at least one first longitudinal edge and a second external termination with at least on second longitudinal edge;

placing a first lead into contact with each said first longitudinal edge with a first interconnect between said first lead and said first longitudinal edge;

placing a second lead into contact with said second longitudinal edge with a second interconnect between said second lead and said second longitudinal edge; and

heating to form a bond of said first interconnect and said second interconnect.

21. The method for forming a module of claim 20 comprising bonding said first lead to each first longitudinal edge by said first interconnect.

22. The method for forming a module of claim 20 wherein said first lead is a flat plated lead with at least one said electronic component on each side of said flat plated lead.

23. The method for forming a module of claim 20 wherein said first lead comprises an offset.

24. The method for forming a module of claim 23 wherein said offset is selected from laterally offset and horizontally offset.

25. The method for forming a module of claim 20 wherein said first lead is selected from a round lead frame and a flat lead.

26. The method for forming a module of claim 25 wherein said first lead comprises at least one flattened region.

27. The method for forming a module of claim 20 wherein said first lead is selected from a through-hole lead and a surface mount lead.

28. The method for forming a module of claim 27 further comprising a through-hole assembly stand-off feature.

29. The method for forming a module of claim 20 wherein said first lead comprises a material selected from a ferrous material and a non-ferrous material.

30. The method for forming a module of claim 20 wherein at least one of said first interconnect or said second interconnect is selected from the group consisting of a transient liquid phase sintering conductive interconnect material, a conductive epoxy, a polymer solder and a solder.

31. The method for forming a module of claim 20 wherein each said electronic component is independently selected from the group consisting of a capacitor, a diode, a resistor, a varistor, an inductor, a fuse and an integrated circuit.

32. The method for forming a module of claim 31 wherein at least one said electronic component is a capacitor.

33. The method for forming a module of claim 32 wherein each said electronic component is a capacitor.

34. The method for forming a module of claim 33 wherein each said capacitor is an MLCC.

35. The method for forming a module of claim 20 wherein at least two said electronic components have a different size.

36. The method for forming a module of claim 20 further comprising forming an encapsulation.

37. The method for forming a module of claim 20 comprising at least 2 electronic components to no more than 100 electronic components.

38. The method for forming a module of claim 20 further comprising placing at least one electronic component in a second row or a second column with an interconnect between adjacent longitudinal edges and forming a bond of said interconnect.