Gap waveguide structures for THz applications

• US 9,806,393 B2
• Filed: 06/18/2013
• Issued: 10/31/2017
• Est. Priority Date: 06/18/2012
• Status: Active Grant

• Current Assignee: Gapwaves AB
• Original Assignee: Gapwaves AB
• Inventors: Kildal, Per-Simon, Haasl, Sjoerd, Enoksson, Peter
• Primary Examiner(s): Pascal, Robert
• Assistant Examiner(s): GLENN, KIMBERLY E
• Application Number:
  US14/409,344
• Publication Number:
  US 20150194718A1
• Time in Patent Office: 1,596 Days
• Field of Search: 333137
• CPC Class Codes: H01P 1/022 in waveguides of polygonal cross-section H01P1/065 takes precedence
• CPC Class Codes: H01P 1/042 Hollow waveguide joints
• CPC Class Codes: H01P 1/2005 Electromagnetic photonic bandgaps [EPB], or photonic bandgaps [PBG]
• CPC Class Codes: H01P 1/207 Hollow waveguide filters H01P1/212, H01P1/213, H01P1/215, H01P1/219 take precedence
• CPC Class Codes: H01P 11/002 Manufacturing hollow waveguides
• CPC Class Codes: H01P 11/007 Manufacturing frequency-selective devices resonators H01P11/008
• CPC Class Codes: H01P 3/12 Hollow waveguides H01P3/20 takes precedence
• CPC Class Codes: H01P 5/12 Coupling devices having more than two ports H01P5/04 takes precedence
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

A microwave/millimeter device having a narrow gap between two parallel surfaces of conducting material by using a texture or multilayer structure on one of the surfaces is disclosed. The fields are mainly present inside the gap, and not in the texture or layer structure itself, so the losses are small. The microwave/millimeter wave device further includes one or more conducting elements, such as a metallized ridge or a groove in one of the two surfaces, or a metal strip located in a multilayer structure between the two surfaces. The waves propagate along the conducting elements. At least one of the surfaces is provided with means to prohibit the waves from propagating in other directions between them than along the ridge, groove or strip. At very high frequency, the gap waveguides and gap lines may be realized inside an IC package or inside the chip itself.

Claims

1. A scalable production method for fabrication of a microwave/millimeter wave device, said microwave/millimeter wave device operating at frequencies in the entire range of or one or more subranges of the frequency range between 1 GHz and 100 THz, and comprising the step of providing a metamaterial on a surface of said microwave/millimeter wave device, wherein the step of providing said metamaterial on said surface of the microwave/millimeter wave device involves the use of at least one polymer to fabricate a high-resolution structure, and subsequent metallization of the high-resolution structure.

2. The method of claim 1, wherein the microwave/millimeter wave device comprises two opposing surfaces of conducting material arranged to form a narrow gap there between, wherein at least one of the surfaces is provided with at least one conducting element, and wherein at least one of the surfaces is provided with said metamaterial, thereby stopping wave propagation in other directions inside the gap than along said conducting element.

4. The method of claim 1, wherein the at least one polymer comprises a patterned photosensitive high-aspect ratio polymer.

5. The method of claim 1, wherein at least one of said at least one polymers is formed by at least one of:

a micromolding process or hot embossing.

6. The method of claim 1, wherein the metallization is applied by at least one of sputtering, evaporation and chemical vapor deposition.

7. The method of claim 6, wherein the metallization is subsequently improved by at least one of electroplating and electroless plating.

8. The method of claim 1, wherein one fabricated part of the microwave/millimeter wave device is a lid.

9. The method of claim 1, wherein the metamaterial is formed on a flange on said microwave/millimeter wave device.

10. The method of claim 1, wherein the microwave/millimeter wave device is at least one of:

a waveguide, a transmission line, a waveguide circuit, a transmission line circuit, a resonator/filter, a flange, a splitter, a shielding and a packaging.

11. The method of claim 2, wherein the at least one conducting element is selected from the group consisting of:

a conducting ridge provided on the surface, a groove with conducting walls provided on the surface, and a conducting strip arranged within a multilayer structure of the surface.

21. The method of claim 1, wherein said microwave/millimeter wave device operates in a the frequency range above 100 GHz.

3. A microwave/millimeter wave device, said microwave/millimeter wave device operating at frequencies in the entire range of or one or more subranges of the frequency range between 1 GHz and 100 THz, wherein the microwave/millimeter wave device comprises a metamaterial arranged on at least one surface thereof, said metamaterial being based on mushroom-shaped or inverted-pyramid-shaped pillars, wherein the metamaterial acts as a perfect magnetic conductor in the operating frequency range.

16. The device of claim 3, wherein the at least one conducting element is selected from the group consisting of:

a conducting ridge provided on the surface, a groove with conducting walls provided on the surface, and a conducting strip arranged within a multilayer structure of the surface.

17. The device of claim 3, wherein the microwave/millimeter wave device comprises two opposing surfaces of conducting material arranged to form a narrow gap there between, wherein at least one of the surfaces is provided with at least one conducting element, and wherein at least one of the surfaces is provided with said metamaterial, thereby stopping wave propagation in other directions inside the gap than along said conducting element.

18. The device of claim 3, wherein the metamaterial is provided on a flange of said microwave/millimeter wave device.

19. The device of claim 3, wherein the microwave/millimeter wave device is at least one of:

a waveguide, a transmission line, a waveguide circuit, a transmission line circuit, a resonator/filter, a flange, a splitter, a shielding and a packaging.

20. The device of claim 3, wherein said device is produced in accordance with a scalable production method for fabrication of a microwave/millimeter wave device, comprising the step of providing the metamaterial on a surface of said microwave/millimeter wave device.

12. A scalable production method for fabrication of a microwave/millimeter wave device, said microwave/millimeter wave device operating at frequencies in the entire range of or one or more subranges of the frequency range between 1 GHz and 100 THz, and comprising the step of providing a metamaterial on a surface of said microwave/millimeter wave device, wherein the step of providing said metamaterial on said surface of the microwave/millimeter wave device involves a Lithographie, Galvanoformung, Abformung (Lithography, Electroplating and Molding, LIGA) process.

13. A scalable production method for fabrication of a microwave/millimeter wave device, said microwave/millimeter wave device operating at frequencies in the entire range of or one or more subranges of the frequency range between 1 GHz and 100 THz, and comprising the step of providing a metamaterial on a surface of said microwave/millimeter wave device, wherein at least one part of said microwave/millimeter wave device is fabricated using freeforming or 3D forming in metals or other conducting material or metalized non-metals.

14. The method of claim 13, wherein the fabrication using freeforming or 3D forming in metals or other conducting material or metalized non-metals is applied by at least one of sputtering, evaporation and chemical vapor deposition.

15. The method of claim 14, wherein the fabrication using freeforming or 3D forming in metals or other conducting material or metalized non-metals is improved by electroplating or electroless plating.