Electronic modules having grounded electromagnetic shields

• US 9,807,890 B2
• Filed: 05/31/2013
• Issued: 10/31/2017
• Est. Priority Date: 05/31/2013
• Status: Active Grant

• Current Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Original Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Inventors: Dang, Thong, Haji-Rahim, Mohsen, Bullis, Joseph Byron
• Primary Examiner(s): Sinclair, David M
• Assistant Examiner(s): Brown, Robert
• Application Number:
  US13/906,892
• Publication Number:
  US 20140355222A1
• Time in Patent Office: 1,614 Days
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48095 Kinked
• CPC Class Codes: H01L 2224/48229 the bond pad protruding from the surface of the item
• CPC Class Codes: H01L 2224/48235 connecting the wire to a via metallisation of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/1421 RF devices
• CPC Class Codes: H01L 2924/1434 Memory
• CPC Class Codes: H01L 2924/15159 Side view
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15313 : being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/1533 : the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 : by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/144 : Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/0367 : Metallic bump or raised conductor not used as solder bump solder materials or compositions and methods of application thereof H05K3/3457
• CPC Class Codes: H05K 2201/042 : Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/10371 : Shields or metal cases
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/4007 : Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: Y10T 29/4902 : Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.

Abstract

The present disclosure is related to electronic modules for electronic components and methods for manufacturing the same. In one embodiment, an electronic module is formed using a first substrate having a first component area and a second substrate having a second component area. One or more electronic components may be attached to both the first component area and the second component area. The second substrate is mounted over the first substrate such that the second component area faces the first component area. An overmold covers the first component area and the second component area so as to cover the electronic components on both the first component area and the second component area. In this manner, the number of electronic components within the electronic module that can be mounted on an area of a printed circuit board (PCB) is increased.

Claims

1. An electronic module comprising:

a first substrate having a first component area, wherein one or more electronic components are mounted on the first component area;

a second substrate having a second component area, wherein one or more electronic components are mounted on the second component area and the second substrate is mounted over the first substrate such that the second component area faces the first component area;

an overmold that fills a gap between the first component area and the second component area so as to cover the one or more electronic components on the first component area and the one or more electronic components on the second component area; and

a support structure that extends through the overmold and comprises;

a first support member that extends from the first component area towards the second component area; and

a second support member that extends from the second component area towards the first component area, wherein the first support member is attached to the second support member to provide structural support that mounts the second substrate over the first substrate.

2. The electronic module of claim 1 wherein:

the first support member comprises a first conductive pillar;

the second support member comprises a second conductive pillar; and

the first conductive pillar is soldered to the second conductive pillar.

5. The electronic module of claim 1 wherein the overmold is formed from an insulating material.

6. The electronic module of claim 1 further comprising an electromagnetic shield formed over the second substrate and the first substrate so as to enclose the first component area and the second component area.

7. The electronic module of claim 6 wherein the first substrate further comprises a metallic structure that is attached to the electromagnetic shield and extends through the first substrate to connect the electromagnetic shield to ground.

3. An electronic module comprising:

a first substrate having a first component area, wherein one or more electronic components are mounted on the first component area;

a second substrate having a second component area, wherein one or more electronic components are mounted on the second component area and the second substrate is mounted over the first substrate such that the second component area faces the first component area;

an overmold that fills a gap between the first component area and the second component area so as to cover the one or more electronic components on the first component area and the one or more electronic components on the second component area;

a surface feature on the second component area; and

a support structure that extends from the first component area, through the overmold, and onto the surface feature, wherein the support structure is attached to the surface feature so as to provide structural support that mounts the second substrate over the first substrate.

4. The electronic module of claim 3 wherein:

the surface feature comprises a conductive feature;

the support structure comprises a conductive pillar; and

the conductive pillar is soldered to the conductive feature.

23. The electronic module of claim 3 further comprising an electromagnetic shield formed over the second substrate and the first substrate so as to enclose the first component area and the second component area.

24. The electronic module of claim 23 wherein the first substrate further comprises a metallic structure that is attached to the electromagnetic shield and extends through the first substrate to connect the electromagnetic shield to ground.

8. A method of manufacturing an electronic module comprising:

providing a first substrate having a first component area;

attaching one or more electronic components to the first component area;

providing a second substrate having a second component area;

attaching one or more electronic components to the second component area;

mounting the second substrate over the first substrate such that the second component area faces the first component area; and

covering the first component area and the second component area with an overmold such that the overmold covers the one or more electronic components on the first component area and the one or more electronic components on the second component area.

9. The method of claim 8 further comprising:

forming a first support member that extends from the first component area towards the second component area prior to mounting the second substrate over the first substrate; and

forming a second support member that extends from the second component area towards the first component area prior to mounting the second substrate over the first substrate.

10. The method of claim 9 wherein mounting the second substrate over the first substrate comprises attaching the first support member to the second support member.

11. The method of claim 8 further comprising:

forming a support member that extends from the first component area prior to mounting the second substrate over the first substrate;

wherein mounting the first substrate over the second substrate comprises attaching the support member to a surface feature on the second component area.

12. The method of claim 11 wherein:

the surface feature comprises a conductive feature; and

the support member comprises a conductive pillar.

13. The method of claim 12 wherein attaching the support member to the surface feature comprises soldering the conductive feature to the conductive pillar.

14. The method of claim 8 wherein the overmold is formed from an insulating material.

15. The method of claim 8 wherein:

mounting the second substrate over the first substrate defines a gap between the first component area and the second component area; and

covering the first component area and the second component area with an overmold comprises injecting the overmold to fill the gap.

16. The method of claim 8 further comprising forming an electromagnetic shield over the second substrate and the first substrate so as to enclose the first component area and the second component area.

17. The method of claim 16 wherein providing the first substrate further comprises providing a metallic structure that extends through the first substrate to provide a connection to ground.

18. The method of claim 17 wherein forming the electromagnetic shield comprises attaching the electromagnetic shield to the metallic structure.

19. The method of claim 17 further comprising forming an opening through at least the second substrate and the overmold to expose a section of the metallic structure prior to forming the electromagnetic shield.

20. The method of claim 19 wherein forming the electromagnetic shield comprises applying an electromagnetic shield material within the opening to attach the electromagnetic shield to the section of the metallic structure.

21. The method of claim 20 wherein forming the electromagnetic shield further comprises applying the electromagnetic shield material over the second substrate.

22. An electronic module comprising:

a first substrate having a first component area, wherein one or more electronic components are mounted on the first component area;

a second substrate having a second component area, wherein one or more electronic components are mounted on the second component area and the second substrate is mounted over the first substrate such that the second component area faces the first component area;

a support structure that structurally supports the mounting of the second substrate over the first substrate; and

an overmold that covers the first component area and the second component area so as to cover the one or more electronic components on the first component area and the one or more electronic components on the second component area; and

an electromagnetic shield formed over the second substrate and the first substrate so as to enclose the first component area and the second component area.

25. The electronic module of claim 22 wherein the overmold fills a gap between the first component area and the second component area so as to cover the one or more electronic components on the first component area and the one or more electronic components on the second component area, and the support structure extends through the overmold and between the first component area and the second component area.