Electronic device and shielding member production method

• US 9,807,918 B2
• Filed: 07/06/2015
• Issued: 10/31/2017
• Est. Priority Date: 03/13/2014
• Status: Active Grant

• Current Assignee: Huawei Device Company Limited (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Huawei Device Company Limited (Huawei Investment & Holding Co., Ltd.)
• Inventors: Jin, Linfang, Zou, Jie, Sun, Hao, Yang, Mingxing
• Primary Examiner(s): Dinh, Tuan T
• Application Number:
  US14/791,726
• Publication Number:
  US 20150313045A1
• Time in Patent Office: 848 Days
• Field of Search: 361752-759, 361816, 361818, 361748, 174 51, 174350-358
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29K 2995/0005 Conductive
• CPC Class Codes: B29L 2031/3481 Housings or casings incorporating or embedding electric or electronic elements
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: G06F 1/182 with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
• CPC Class Codes: H05K 9/0022 of components mounted on printed circuit boards [PCB] shields integrated within component packages H01L23/552; shields integrated within PCB H05K1/0218
• CPC Class Codes: H05K 9/0049 being metallic containers
• CPC Class Codes: H05K 9/0081 Electromagnetic shielding materials, e.g. EMI, RFI shielding H05K9/0003 takes precedence

Abstract

An electronic device and related method that includes a metal member, a circuit board, and a shielding member. A through hole or slot is disposed on the metal member. The shielding member is fastened on the metal member. The shielding member includes a blocking portion and an enclosing portion. The blocking portion is made of an electrically conductive plastic material. The enclosing portion is made of a metal material or an electrically conductive plastic material. The blocking portion is configured to block the through hole or slot. The enclosing portion is disposed around the electronic component. One end of the enclosing portion is electrically connected to the metal member, and the other end of the enclosing portion is electrically connected to the circuit board. The metal member, the blocking portion, the enclosing portion, and the circuit board form a shielding space, and the electronic component is located in the shielding space.

Claims

1. An electronic device, wherein the electronic device comprises:

a metal member, wherein the metal member has at least one of a through hole and a slot, and wherein the metal member is one of a stamped metal member and a forged metal member;

a circuit board, wherein an electronic component is disposed on the circuit board; and

a shielding member, wherein the shielding member comprises a blocking portion, an enclosing portion, and a fastening portion disposed on the metal member, wherein the blocking portion is made of an electrically conductive plastic material, wherein the enclosing portion is made of one of a metal material and an electrically conductive plastic material, wherein the blocking portion blocks the at least one of the through hole and the slot, wherein the enclosing portion is disposed around the electronic component, wherein one end of the enclosing portion is electrically connected to the metal member, wherein the other end of the enclosing portion is electrically connected to a ground copper of the circuit board, wherein the electronic component is located in a shielding space formed by the metal member, the enclosing portion, the circuit board, and the blocking portion, wherein the shielding member further comprises a buckling portion connected to the blocking portion, wherein the buckling portion is buckled in the through hole or slot, and wherein a size of the fastening portion is greater than a size of the through hole or slot.

2. The electronic device according to claim 1, wherein the electronic device further comprises a reinforcing portion that enhances a strength of the metal member and is fastened on the metal member.

3. The electronic device according to claim 1, wherein an electrically conductive elastic member is disposed between the enclosing portion and the circuit board.

4. The electronic device according to claim 1, wherein an electrically conductive elastic member is disposed between the enclosing portion and the metal member.

5. The electronic device according to claim 1, wherein the through hole or slot is disposed opposite to the electronic component relative to the circuit board.

6. The electronic device according to claim 1, wherein the electrically conductive plastic material is electrically and thermally conductive plastic.

7. The electronic device according to claim 1, wherein an insulation layer is disposed on a surface, away from the metal member, of the blocking portion.

8. The electronic device according to claim 1, wherein the blocking portion and the enclosing portion are integrally injection molded.

9. The electronic device according to claim 1, wherein the blocking portion, the enclosing portion, and the metal member are integrally metal injection molded.

10. The electronic device according to claim 2, wherein the reinforcing portion is disposed opposite to the electronic component.

12. The electronic device according to claim 1, wherein the blocking portion and the through hole or slot are located above the electronic component such that the electronic component is between the blocking portion and the circuit board.

13. The electronic device according to claim 1, wherein the fastening portion is coupled to the blocking portion through the through hole or slot, wherein the fastening portion is on a first surface of the metal member that is opposite a second surface of the metal member, and wherein the blocking portion is in contact with the second surface.

11. A shielding member production method, wherein the method comprises:

disposing at least one of a through hole and a slot on a metal member, wherein the metal member is one of a stamped metal member and a forged metal member;

forming a blocking portion on the metal member in an injection molding manner using an electrically conductive plastic material, wherein the blocking portion blocks the through hole or slot;

forming an enclosing portion using one of a metal material and an electrically conductive plastic material, wherein the enclosing portion is disposed around an electronic component on a circuit board, wherein one end of the enclosing portion is electrically connected to the metal member, and wherein the other end of the enclosing portion is electrically connected to a ground copper of the circuit board such that the electronic component is in an enclosed shielding space; and

forming, in the through hole or slot in an injection molding manner using a plastic material, a buckling portion and a fastening portion connected to the buckling portion, the fastening portion disposed on the metal member, wherein a size of the fastening portion is greater than a size of the through hole or slot, and wherein when the enclosing portion is made of the electrically conductive plastic material, the enclosing portion, the blocking portion, the buckling portion, and the fastening portion are formed on the metal member by means of one-off injection molding.