Systems and apparatus having MEMS acoustic sensors and other MEMS sensors and methods of fabrication of the same

• US 9,809,448 B2
• Filed: 02/10/2015
• Issued: 11/07/2017
• Est. Priority Date: 03/13/2013
• Status: Active Grant

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: Lim, Martin, Assaderaghi, Fariborz
• Primary Examiner(s): GEBREMARIAM, SAMUEL A
• Application Number:
  US14/618,251
• Publication Number:
  US 20150158722A1
• Time in Patent Office: 1,001 Days
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: G01L 23/125 by changing capacitance
• CPC Class Codes: H04R 19/005 using semiconductor materials

Abstract

A micro electro-mechanical system (MEMS) device is provided. The MEMS device includes: a substrate having a first surface and a second surface and wherein the first surface is exposed to an environment outside the MEMS device; and a MEMS microphone disposed at a first location on the second surface of the substrate and having a diaphragm positioned such that acoustic waves received at the MEMS microphone are incident on the diaphragm. The MEMS device also includes: a first integrated circuit disposed at a second location of the substrate, wherein the first integrated circuit is electrically coupled to the MEMS microphone; and a MEMS measurement device at a third location, wherein the MEMS measurement device comprises a motion sensor and a pressure sensor.

Claims

1. A micro electro-mechanical system (MEMS) device, comprising:

a substrate having a first surface and a second surface, wherein the first surface is exposed to an environment outside the MEMS device;

a MEMS microphone disposed at a first location on the second surface of the substrate and having a diaphragm positioned such that acoustic waves received at the MEMS microphone are incident on the diaphragm;

an integrated circuit disposed at a second location on the second surface of the substrate, wherein the integrated circuit is electrically coupled to the MEMS microphone; and

a MEMS measurement device disposed at a third location, wherein the first location and the second location are distinct locations on the second surface of the substrate, wherein the MEMS microphone is located distinct from the integrated circuit on the second surface of the substrate, and wherein the MEMS measurement device comprises a motion sensor.

2. The MEMS device of claim 1, wherein the integrated circuit is positioned on the second surface.

3. The MEMS device of claim 1, wherein the integrated circuit and the MEMS measurement device are stacked.

4. The MEMS device of claim 1, wherein the substrate comprises a first port disposed through the substrate and configured to receive the acoustic waves.

5. The MEMS device of claim 1, further comprising:

a lid mounted to the second surface of the substrate and forming a package enclosing the MEMS microphone, the integrated circuit and the MEMS measurement device.

6. The MEMS device of claim 1, further comprising a processor disposed on the second surface of the substrate.

7. The MEMS device of claim 6, wherein the processor is disposed between the integrated circuit and the substrate.

8. The MEMS device of claim 1, wherein the MEMS measurement device further comprises a magnetometer.

9. The MEMS device of claim 1, further comprising a pressure sensor.

10. The MEMS device of claim 9, wherein the MEMS microphone is configured to perform detection of the acoustic waves and wherein the MEMS measurement device is configured to perform pressure sensing.

11. The MEMS device of claim 5, wherein the lid is comprised of metal.

12. The MEMS device of claim 1, wherein the motion sensor is at least one of a gyroscope or an accelerometer.

13. A micro electro-mechanical system (MEMS) device, comprising:

a package having a port through the package and exposed to an environment;

a MEMS microphone disposed at a first location on a surface within the package, wherein the MEMS microphone includes a diaphragm positioned such that acoustic waves received at the port of the package are incident on the diaphragm; and

a MEMS detection structure enclosed within the package, wherein the MEMS detection structure comprises;

a processor provided at a second location on the surface within the package;

an integrated circuit coupled to the processor; and

a MEMS measurement device coupled to the integrated circuit, wherein the MEMS measurement device comprises a three-axis accelerometer, a three-axis gyroscope and a pressure sensor, wherein the first location and the second location are distinct locations on the surface within the package, and wherein the MEMS microphone is located distinct from the processor on the surface within the package.

14. The MEMS device of claim 13, wherein the MEMS measurement device further comprises a magnetometer.

15. The MEMS device of claim 13, wherein the package comprises more than one laminate substrate.

16. A micro electro-mechanical system (MEMS) device, comprising:

a substrate having a first surface and a second surface, wherein the first surface is exposed to an environment outside the MEMS device;

a MEMS microphone disposed at a first location on the second surface of the substrate and having a diaphragm positioned such that acoustic waves received at the MEMS microphone are incident on the diaphragm;

an integrated circuit disposed at a second location on the second surface of the substrate, wherein the integrated circuit is electrically coupled to the MEMS microphone; and

a MEMS measurement device disposed at a third location, wherein the MEMS measurement device comprises a pressure sensor, wherein the first location and the second location are distinct locations on the second surface of the substrate, and wherein the MEMS microphone is located distinct from the integrated circuit on the second surface of the substrate.