Adhesive agent composition, adhesive sheet, and electronic device and production method therefor

• US 9,809,728 B2
• Filed: 11/29/2013
• Issued: 11/07/2017
• Est. Priority Date: 11/30/2012
• Status: Active Grant

• Current Assignee: Lintec Corporation
• Original Assignee: Lintec Corporation
• Inventors: Nishijima, Kenta, Naganawa, Satoshi, Fuchi, Emi
• Primary Examiner(s): Lee, Kyoung
• Assistant Examiner(s): Mehta, Ratisha
• Application Number:
  US14/648,579
• Publication Number:
  US 20150299519A1
• Time in Patent Office: 1,439 Days
• CPC Class Codes: B32B 2307/412 Transparent
• CPC Class Codes: B32B 2457/206 Organic displays, e.g. OLED
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: B32B 37/182 one or more of the layers being plastic
• CPC Class Codes: C09J 123/22 Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
• CPC Class Codes: C09J 2203/326 for bonding electronic components such as wafers, chips or semiconductors
• CPC Class Codes: C09J 2301/414 presence of a copolymer
• CPC Class Codes: C09J 2400/10 Presence of inorganic materials
• CPC Class Codes: C09J 2409/00 Presence of diene rubber
• CPC Class Codes: C09J 2423/00 Presence of polyolefin
• CPC Class Codes: C09J 2467/005 in the release coating
• CPC Class Codes: C09J 2467/006 in the substrate
• CPC Class Codes: C09J 7/383 Natural or synthetic rubber
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/564 Details not otherwise provided for, e.g. protection against moisture getters H01L23/26
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05B 33/04 Sealing arrangements , e.g. against humidity
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 : Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

The present invention provides: an adhesive composition for sealing an electronic device, the adhesive composition comprising an isobutylene-isoprene copolymer as a main component, the isobutylene-isoprene copolymer having a content of repeating units derived from isoprene of 0.1 to 99 mol % based on total repeating units; an adhesive sheet comprising a gas barrier film, and an adhesive layer that is formed on the gas barrier film, the gas barrier film having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 0.1 g/m²/day or less, and having a total light transmittance of 80% or more, and the adhesive layer comprising an adhesive composition that comprises an isobutylene-isoprene copolymer as a main component; and an electronic device or the like in which the adhesive composition and the adhesive sheet are used as a sealant for an organic electroluminescent element or the like. According to the present invention, provided are: an adhesive composition that is useful as a material for forming an adhesive layer that exhibits an excellent water barrier capability and excellent adhesion; an adhesive sheet; and an electronic device or the like.

Claims

1. An adhesive composition for sealing an electronic device,

the adhesive composition consisting of an isobutylene-isoprene copolymer, a tackifier, and a solvent,

wherein the isobutylene-isoprene copolymer has a content of repeating units derived from isoprene of 0.1 to 99 mol % based on total repeating units,

wherein the content of the tackifier is 5 to 100 parts by mass based on 100 parts by mass of the isobutylene-isoprene copolymer, and

wherein the solvent is at least one of benzene, toluene, ethyl acetate, butyl acetate, acetone, methyl ethyl ketone, methyl isobutyl ketone, n-pentane, n-hexane, n-heptane, cyclopentane or cyclohexane.