Optical backplane mirror

• US 9,810,843 B2
• Filed: 06/10/2013
• Issued: 11/07/2017
• Est. Priority Date: 06/10/2013
• Status: Active Grant

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Inventors: Stephens, Tab A., Pelley, Perry H., McShane, Michael B.
• Primary Examiner(s): BLEVINS, JERRY M
• Application Number:
  US13/914,178
• Publication Number:
  US 20140363120A1
• Time in Patent Office: 1,611 Days
• Field of Search: 385 14, 438478
• CPC Class Codes: G02B 2006/12061 Silicon
• CPC Class Codes: G02B 2006/12104 Mirror; Reflectors or the like
• CPC Class Codes: G02B 6/125 Bends, branchings or intersections
• CPC Class Codes: G02B 6/131 by using epitaxial growth epitaxial growth for semiconductors H01L21/02365
• CPC Class Codes: G02B 6/136 by etching
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Abstract

An integrated circuit optical backplane die and associated semiconductor fabrication process are described for forming optical backplane mirror structures for perpendicularly deflecting optical signals out of the plane of the optical backplane die by selectively etching an optical waveguide semiconductor layer (103) on an optical backplane die wafer using an orientation-dependent anisotropic wet etch process to form a first recess opening (107) with angled semiconductor sidewall surfaces (106) on the optical waveguide semiconductor layer, where the angled semiconductor sidewall surfaces (106) are processed to form an optical backplane mirror (116) for perpendicularly deflecting optical signals to and from a lateral plane of the optical waveguide semiconductor layer.

Claims

1. A semiconductor fabrication process comprising:

providing a wafer comprising an optical waveguide semiconductor structure;

selectively etching the optical waveguide semiconductor structure with an anisotropic wet etch process to form an angled semiconductor sidewall surface on the optical waveguide semiconductor structure; and

processing the angled semiconductor sidewall surface on the optical waveguide semiconductor structure to form a mirror for deflecting optical signals into and out of a lateral plane that is parallel to a major wafer substrate surface,

where the wafer comprises a semiconductor-on-insulator (SOI) substrate with an optical through-semiconductor via structure formed in the SOI substrate in optical alignment with the mirror.

2. The process of claim 1, where providing the wafer comprises providing a semiconductor-on-insulator substrate comprising an optical waveguide silicon layer formed over a buried oxide layer.

3. The process of claim 1, where the optical waveguide semiconductor structure comprises a silicon layer located over a buried oxide layer.

4. The process of claim 1, where the anisotropic wet etch process comprises an etchant having high crystallographic plane selectivity, said etchant including at least one of the group consisting of KOH, EDP, TMAH, N₂H₄, and CsOH.

5. The process of claim 1, where the anisotropic wet etch process comprises a silicon orientation-dependent wet etch process that produces a first recess opening with 45 degree angled semiconductor sidewall surfaces.

6. The process of claim 1, where processing the angled semiconductor sidewall surface comprises:

selectively forming one or more patterned oxidation protection layers on the angled semiconductor sidewall surface of the optical waveguide semiconductor structure to expose a first portion of the optical waveguide semiconductor structure defining a first angled semiconductor sidewall surface and to cover a second portion of the optical waveguide semiconductor structure;

oxidizing the first portion of the optical waveguide semiconductor structure with a semiconductor oxidation process to produce an oxide layer with an angled oxide sidewall surface substantially parallel to where the first angled semiconductor sidewall surface was located prior to oxidation;

removing at least the one or more patterned oxidation protection layers to form a recess opening in the wafer; and

growing an epitaxial semiconductor layer in the recess opening from at least the second portion of the optical waveguide semiconductor structure to form the mirror at an interface between the epitaxial semiconductor layer and the angled oxide sidewall surface.

7. The process of claim 6, where oxidizing the first portion of the optical waveguide semiconductor structure comprises performing a LOCal Oxidation of Silicon (LOCOS) process to thermally oxidize the first portion of the optical waveguide semiconductor structure.

8. The process of claim 1, where processing the angled semiconductor sidewall surface comprises:

selectively forming one or more patterned oxidation protection layers to cover a first angled semiconductor sidewall surface of the optical waveguide semiconductor structure and to expose a second angled semiconductor sidewall surface of the optical waveguide semiconductor structure;

oxidizing the second angled semiconductor sidewall surface with a semiconductor oxidation process to produce an oxide mirror layer substantially parallel to the second angled semiconductor sidewall surface was located prior to oxidation;

removing at least the one or more patterned oxidation protection layers to form a recess opening in the wafer which exposes the first angled semiconductor sidewall surface; and

growing an epitaxial semiconductor layer in the recess opening from at least the first angled semiconductor sidewall surface of the optical waveguide semiconductor structure to form the mirror at an interface between the epitaxial semiconductor layer and the oxide mirror layer.

9. The process of claim 1, where processing the angled semiconductor sidewall surface comprises:

selectively forming one or more patterned dielectric mirror layers to directly cover a first angled semiconductor sidewall surface of the optical waveguide semiconductor structure which is aligned with the optical through-semiconductor via formed in the substrate, and to expose a second angled semiconductor sidewall surface of the optical waveguide semiconductor structure; and

forming a planarized optical semiconductor layer over the one or more patterned dielectric mirror layers on the first angled semiconductor sidewall surface by growing an epitaxial semiconductor layer from at least the exposed second angled semiconductor sidewall surface of the optical waveguide semiconductor structure.

10. The process of claim 1, where processing the angled semiconductor sidewall surface comprises forming a mirror for perpendicularly deflecting optical signals into and out of the lateral plane.

11. The process of claim 1, where the mirror is positioned to deflect optical signals between the optical waveguide semiconductor structure in the lateral plane and the optical through-semiconductor via structure below.

12. The process of claim 1, where the mirror comprises a half mirror.

13. The process of claim 1, where the mirror comprises a full mirror.

14. A semiconductor fabrication process comprising:

providing a wafer comprising an optical waveguide semiconductor structure;

selectively etching the optical waveguide semiconductor structure with an anisotropic silicon orientation-dependent wet etch process to form an angled semiconductor sidewall surface on the optical waveguide semiconductor structure by etching a first recess opening with 45 degree angled semiconductor sidewall surfaces; and

processing the angled semiconductor sidewall surface on the optical waveguide semiconductor structure to form a mirror for deflecting optical signals into and out of a lateral plane that is parallel to a major wafer substrate surface,

where the wafer comprises a semiconductor-on-insulator (SOI) substrate with an optical through-semiconductor via structure formed in the SOI substrate in optical alignment with the mirror.

15. The process of claim 14, where providing the wafer comprises providing a semiconductor-on-insulator substrate comprising an optical waveguide silicon layer formed over a buried oxide layer.

16. The process of claim 14, where the optical waveguide semiconductor structure comprises a silicon layer located over a buried oxide layer.

17. The process of claim 14, where the anisotropic wet etch process comprises an etchant having high crystallographic plane selectivity, said etchant including at least one of the group consisting of KOH, EDP, TMAH, N2H4, and CsOH.

18. A semiconductor fabrication process comprising:

providing a wafer comprising an optical waveguide semiconductor structure;

selectively etching the optical waveguide semiconductor structure with an anisotropic wet etch process to form an angled semiconductor sidewall surface on the optical waveguide semiconductor structure;

selectively forming one or more patterned oxidation protection layers on the angled semiconductor sidewall surface of the optical waveguide semiconductor structure to expose a first portion of the optical waveguide semiconductor structure defining a first angled semiconductor sidewall surface and to cover a second portion of the optical waveguide semiconductor structure;

oxidizing the first portion of the optical waveguide semiconductor structure with a semiconductor oxidation process to produce an oxide layer with an angled oxide sidewall surface substantially parallel to where the first angled semiconductor sidewall surface was located prior to oxidation;

removing at least the one or more patterned oxidation protection layers to form a recess opening in the wafer; and

growing an epitaxial semiconductor layer in the recess opening from at least the second portion of the optical waveguide semiconductor structure to form a mirror at an interface between the epitaxial semiconductor layer and the angled oxide sidewall surface for deflecting optical signals into and out of a lateral plane that is parallel to a major wafer substrate surface;

where the wafer comprises a semiconductor-on-insulator (SOI) substrate with an optical through-semiconductor via structure formed in the SOI substrate in optical alignment with the mirror.

19. The process of claim 18, where oxidizing the first portion of the optical waveguide semiconductor structure comprises performing a LOCal Oxidation of Silicon (LOCOS) process to thermally oxidize the first portion of the optical waveguide semiconductor structure.

20. A semiconductor fabrication process comprising:

providing a wafer comprising an optical waveguide semiconductor structure;

selectively etching the optical waveguide semiconductor structure with an anisotropic wet etch process to form an angled semiconductor sidewall surface on the optical waveguide semiconductor structure;

selectively forming one or more patterned oxidation protection layers to cover a first angled semiconductor sidewall surface of the optical waveguide semiconductor structure and to expose a second angled semiconductor sidewall surface of the optical waveguide semiconductor structure;

oxidizing the second angled semiconductor sidewall surface with a semiconductor oxidation process to produce an oxide mirror layer substantially parallel to the second angled semiconductor sidewall surface was located prior to oxidation;

removing at least the one or more patterned oxidation protection layers to form a recess opening in the wafer which exposes the first angled semiconductor sidewall surface; and

growing an epitaxial semiconductor layer in the recess opening from at least the first angled semiconductor sidewall surface of the optical waveguide semiconductor structure to form a mirror at an interface between the epitaxial semiconductor layer and the oxide mirror layer for deflecting optical signals into and out of a lateral plane that is parallel to a major wafer substrate surface;

where the wafer comprises a semiconductor-on-insulator (SOI) substrate with an optical through-semiconductor via structure formed in the SOI substrate in optical alignment with the mirror.

21. A semiconductor fabrication process comprising:

providing a wafer comprising an optical waveguide semiconductor structure;

selectively etching the optical waveguide semiconductor structure with an anisotropic wet etch process to form an angled semiconductor sidewall surface on the optical waveguide semiconductor structure; and

processing the angled semiconductor sidewall surface on the optical waveguide semiconductor structure to form a mirror for deflecting optical signals into and out of a lateral plane that is parallel to a major wafer substrate surface by;

selectively forming one or more patterned dielectric mirror layers to directly cover a first angled semiconductor sidewall surface of the optical waveguide semiconductor structure which is aligned with the optical through-semiconductor via formed in the substrate, and to expose a second angled semiconductor sidewall surface of the optical waveguide semiconductor structure; and

forming a planarized optical semiconductor layer over the one or more patterned dielectric mirror layers on the first angled semiconductor sidewall surface by growing an epitaxial semiconductor layer from at least the exposed second angled semiconductor sidewall surface of the optical waveguide semiconductor structure;

where the wafer comprises a semiconductor-on-insulator (SOI) substrate with an optical through-semiconductor via structure formed in the SOI substrate in optical alignment with the mirror.