Interfacing application programs and motion sensors of a device
First Claim
1. A sensor package, comprising:
- a first substrate including a three-axis microelectromechanical system (MEMS) gyroscope and a three-axis MEMS accelerometer; and
a second substrate including a first processor, the second substrate connectively coupled to the first substrate, the three-axis MEMS gyroscope configured to generate raw gyroscope data at a first rate and the first processor configured to receive the raw gyroscope data at the first rate and integrate the raw gyroscope data with respect to time,wherein the sensor package is configured to transmit the integrated gyroscope data at a second rate, wherein the second rate is lower than the first rate, and wherein the sensor package is configured to transmit the integrated gyroscope data and the three-axis MEMS accelerometer data to a second processor at the second rate for fusion of the integrated gyroscope data and the three-axis MEMS accelerometer data by the second processor.
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Abstract
Interfacing application programs and motion sensors of a device. In one aspect, a high-level command is received from an application program running on a motion sensing device, where the application program implements one of multiple different types of applications available for use on the device. The high-level command requests high-level information derived from the output of motion sensors of the device that include rotational motion sensors and linear motion sensors. The command is translated to cause low-level processing of motion sensor data output by the motion sensors, the low-level processing following requirements of the type of application and determining the high-level information in response to the command. The application program is ignorant of the low-level processing, and the high-level information is provided to the application program.
362 Citations
21 Claims
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1. A sensor package, comprising:
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a first substrate including a three-axis microelectromechanical system (MEMS) gyroscope and a three-axis MEMS accelerometer; and a second substrate including a first processor, the second substrate connectively coupled to the first substrate, the three-axis MEMS gyroscope configured to generate raw gyroscope data at a first rate and the first processor configured to receive the raw gyroscope data at the first rate and integrate the raw gyroscope data with respect to time, wherein the sensor package is configured to transmit the integrated gyroscope data at a second rate, wherein the second rate is lower than the first rate, and wherein the sensor package is configured to transmit the integrated gyroscope data and the three-axis MEMS accelerometer data to a second processor at the second rate for fusion of the integrated gyroscope data and the three-axis MEMS accelerometer data by the second processor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification