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Interfacing application programs and motion sensors of a device

  • US 9,811,174 B2
  • Filed: 04/28/2015
  • Issued: 11/07/2017
  • Est. Priority Date: 01/18/2008
  • Status: Active Grant
First Claim
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1. A sensor package, comprising:

  • a first substrate including a three-axis microelectromechanical system (MEMS) gyroscope and a three-axis MEMS accelerometer; and

    a second substrate including a first processor, the second substrate connectively coupled to the first substrate, the three-axis MEMS gyroscope configured to generate raw gyroscope data at a first rate and the first processor configured to receive the raw gyroscope data at the first rate and integrate the raw gyroscope data with respect to time,wherein the sensor package is configured to transmit the integrated gyroscope data at a second rate, wherein the second rate is lower than the first rate, and wherein the sensor package is configured to transmit the integrated gyroscope data and the three-axis MEMS accelerometer data to a second processor at the second rate for fusion of the integrated gyroscope data and the three-axis MEMS accelerometer data by the second processor.

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