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Wire bond wires for interference shielding

  • US 9,812,402 B2
  • Filed: 11/07/2016
  • Issued: 11/07/2017
  • Est. Priority Date: 10/12/2015
  • Status: Active Grant
First Claim
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1. An apparatus for a microelectronic package having protection from interference, comprising:

  • a substrate having an upper surface and a lower surface opposite the upper surface and having a ground plane;

    a microelectronic device coupled to the upper surface of the substrate;

    wire bond wires having lower ends coupled to the ground plane, the wire bond wires extending away from the upper surface of the substrate;

    the wire bond wires positioned to surround the microelectronic device to provide a shielding region for the microelectronic device with respect to the interference;

    a conductive surface positioned above the wire bond wires for covering the shielding region; and

    the wire bond wires having upper ends coupled to the conductive surface.

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