Wire bond wires for interference shielding
First Claim
1. An apparatus for a microelectronic package having protection from interference, comprising:
- a substrate having an upper surface and a lower surface opposite the upper surface and having a ground plane;
a microelectronic device coupled to the upper surface of the substrate;
wire bond wires having lower ends coupled to the ground plane, the wire bond wires extending away from the upper surface of the substrate;
the wire bond wires positioned to surround the microelectronic device to provide a shielding region for the microelectronic device with respect to the interference;
a conductive surface positioned above the wire bond wires for covering the shielding region; and
the wire bond wires having upper ends coupled to the conductive surface.
4 Assignments
0 Petitions
Accused Products
Abstract
Apparatuses relating generally to a microelectronic package having protection from interference are disclosed. In an apparatus thereof, a substrate has an upper surface and a lower surface opposite the upper surface and has a ground plane. A first microelectronic device is coupled to the upper surface of the substrate. Wire bond wires are coupled to the ground plane for conducting the interference thereto and extending away from the upper surface of the substrate. A first portion of the wire bond wires is positioned to provide a shielding region for the first microelectronic device with respect to the interference. A second portion of the wire bond wires is not positioned to provide the shielding region. A second microelectronic device is coupled to the substrate and located outside of the shielding region. A conductive surface is over the first portion of the wire bond wires for covering the shielding region.
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Citations
20 Claims
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1. An apparatus for a microelectronic package having protection from interference, comprising:
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a substrate having an upper surface and a lower surface opposite the upper surface and having a ground plane; a microelectronic device coupled to the upper surface of the substrate; wire bond wires having lower ends coupled to the ground plane, the wire bond wires extending away from the upper surface of the substrate; the wire bond wires positioned to surround the microelectronic device to provide a shielding region for the microelectronic device with respect to the interference; a conductive surface positioned above the wire bond wires for covering the shielding region; and the wire bond wires having upper ends coupled to the conductive surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An apparatus for a microelectronic package having protection from interference, comprising:
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a substrate having an upper surface and a lower surface opposite the upper surface and having a ground plane; a microelectronic device coupled to the upper surface of the substrate; wire bond wires bonded to and extending away from the upper surface of the substrate; the wire bond wires positioned proximate to and around the microelectronic device for providing a shielding region for the microelectronic device with respect to the interference, the wire bond wires coupled to the ground plane for conducting the interference thereto; a conductive surface over the wire bond wires for covering the shielding region; and upper ends of the wire bond wires mechanically coupled to the conductive surface and extending above a top surface of the microelectronic device. - View Dependent Claims (11, 12, 13, 14)
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15. An apparatus for a microelectronic package having protection from interference, comprising:
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a substrate having an upper surface and a lower surface opposite the upper surface and having a ground plane; a first microelectronic device coupled to the upper surface of the substrate; lower ends of wire bond wires coupled to the ground plane for conducting the interference thereto; the wire bond wires extending away from the upper surface of the substrate; the wire bond wires positioned to provide a shielding region for the first microelectronic device with respect to the interference; a second microelectronic device coupled to the substrate and located outside of the shielding region; and a conductive surface having upper ends of the wire bond wires coupled thereto, the conductive surface covering the shielding region. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification