Semiconductor device and manufacturing method thereof
First Claim
1. A method for manufacturing a semiconductor device comprising:
- forming an oxide semiconductor film over a substrate;
forming a gate insulating film over the oxide semiconductor film; and
forming a gate electrode including a tungsten oxide film by a sputtering method over the gate insulating film,wherein a work function of the gate electrode is higher than or equal to 4.9 eV and lower than or equal to 5.6 eV,wherein a thickness of the gate electrode is greater than or equal to 10 nm.
1 Assignment
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Accused Products
Abstract
To manufacture a transistor whose threshold voltage is controlled without using a backgate electrode, a circuit for controlling the threshold voltage, and an impurity introduction method. To manufacture a semiconductor device having favorable electrical characteristics, high reliability, and low power consumption using the transistor. A gate electrode including a tungsten oxide film whose composition is controlled is used. The composition or the like is adjusted by a film formation method of the tungsten oxide film, whereby the work function can be controlled. By using the tungsten oxide film whose work function is controlled as part of the gate electrode, the threshold of the transistor can be controlled. Using the transistor whose threshold voltage is controlled, a semiconductor device having favorable electrical characteristics, high reliability, and low power consumption can be manufactured.
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Citations
18 Claims
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1. A method for manufacturing a semiconductor device comprising:
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forming an oxide semiconductor film over a substrate; forming a gate insulating film over the oxide semiconductor film; and forming a gate electrode including a tungsten oxide film by a sputtering method over the gate insulating film, wherein a work function of the gate electrode is higher than or equal to 4.9 eV and lower than or equal to 5.6 eV, wherein a thickness of the gate electrode is greater than or equal to 10 nm. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for manufacturing a semiconductor device comprising:
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forming an oxide semiconductor film over a substrate; forming a gate insulating film over the oxide semiconductor film; and forming a gate electrode including a film including tungsten and oxygen by a sputtering method over the gate insulating film, wherein a work function of the gate electrode is higher than or equal to 4.9 eV and lower than or equal to 5.6 eV, wherein a thickness of the gate electrode is greater than or equal to 10 nm. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification