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Magnetic field sensor integrated circuit with integral ferromagnetic material

  • US 9,812,588 B2
  • Filed: 01/24/2013
  • Issued: 11/07/2017
  • Est. Priority Date: 03/20/2012
  • Status: Active Grant
First Claim
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1. A magnetic field sensor comprising:

  • a lead frame having a first surface and a second opposing surface;

    a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second opposing surface attached to the first surface of the lead frame;

    a non-conductive mold material enclosing the die and at least a portion of the lead frame; and

    a ferromagnetic mold material secured to a portion of the non-conductive mold material, wherein the ferromagnetic mold material comprises a central aperture having a surface extending from the non-conductive mold material to an outer peripheral surface of the ferromagnetic mold material, wherein the surface of the central aperture comprises a bend at an intermediate location such that the surface of the central aperture has a first slope from the non-conductive mold material to the bend and a second slope different than the first slope from the bend to the outer peripheral surface of the ferromagnetic mold material.

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