Imaging module, lens-attached imaging module, endoscope, method of manufacturing imaging module, and flexible wiring substrate formation apparatus

• US 9,814,371 B2
• Filed: 09/06/2013
• Issued: 11/14/2017
• Est. Priority Date: 03/30/2012
• Status: Active Grant

• Current Assignee: Fujikura Limited
• Original Assignee: Fujikura Limited
• Inventors: Segi, Takeshi, Matsuda, Yusuke, Yamagami, Katsuya, Nakatate, Kenichi
• Primary Examiner(s): WALKER, JARED T
• Application Number:
  US14/020,160
• Publication Number:
  US 20140009593A1
• Time in Patent Office: 1,530 Days
• Field of Search: 348 76
• CPC Class Codes: A61B 1/0011 Manufacturing of endoscope parts
• CPC Class Codes: A61B 1/005 Flexible endoscopes
• CPC Class Codes: A61B 1/04 combined with photographic or television appliances
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: G02B 23/2484 Arrangements in relation to a camera or imaging device processing or control of video signals generated by an endoscope H04N23/60, H04N23/70
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/1146 Plating
• CPC Class Codes: H01L 2224/13101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/532 Conductor

Abstract

An imaging module of the invention includes: an electrical cable; a solid-state image sensing device; and a flexible wiring substrate including: a device-mounted portion onto which the solid-state image sensing device is mounted; two extended portions which bend at both sides of the device-mounted portion and extend from the device-mounted portion so as to come close to each other with increasing distance from the device-mounted portion; two connection end portions extending from the two extended portions along the direction of the axis of the front end of the electrical cable on an opposite side of the device-mounted portion; and terminals which are provided on the two connection end portions and connected to the electrical cable, the flexible wiring substrate electrically connecting the solid-state image sensing device and the electrical cable.

Claims

1. An imaging module comprising:

an electrical cable;

a solid-state image sensing device comprising an imaging unit orthogonal to a direction of an axis of a front end of the electrical cable; and

a flexible wiring substrate formed in an elongated shape in plan view, the flexible wiring substrate comprising;

a device-mounted portion onto which the solid-state image sensing device is mounted, the device-mounted portion having a mount back face;

a first portion that extends from a first side of the device-mounted portion in plan view showing the flexible wiring substrate, the first portion including a first extended portion and a first connection end portion;

a second portion that extends from a second side of the device-mounted portion in plan view showing the flexible wiring substrate, the second portion including a second extended portion and a second connection end portion, wherein

the first portion is connected to the second portion so that an internal space formed by the device-mounted portion, the first extended portion, and the second extended portion is filled with resin, at least a part of the first extended portion and the second extended portion is thereby fixed, and the first connection end portion is connected to the second connection end portion,

the first extended portion bends at the first side of the device-mounted portion and extends from the device-mounted portion,

the second extended portion bends at the second side of the device-mounted portion and extends from the device-mounted portion,

the first extended portion and the second extended portion extend so as to come close to each other with increasing distance from the device-mounted portion,

the first connection end portion extends from the first extended portion along the direction of the axis of the front end of the electrical cable on an opposite side of the device-mounted portion, the first connection end portion has a first opposed face, and the first opposed face is on the same face as the mount back face; and

the second connection end portion extends from the second extended portion along the direction of the axis of the front end of the electrical cable on an opposite side of the device-mounted portion, the second connection end portion has a second opposed face opposed to the first opposed face, and the second opposed face is on the same face as the mount back face,

wherein the first opposed face and the second opposed face are in contact with each other and the first connection end portion and the second connection end portion align in the direction of the axis of the front end of the electrical cable.

2. The imaging module according to claim 1, wherein

the device-mounted portion, the first extended portion, the second extended portion, the first connection end portion, and the second connection end portion are provided only on one face of the flexible wiring substrate.

3. The imaging module according to claim 1, wherein

the solid-state image sensing device comprises:

a top face on which the imaging unit is provided;

a back face electrically connected to the device-mounted portion of the flexible wiring substrate;

wiring formed on the top face; and

wiring formed on the back face, and

the wirings formed on the top face and on the back face are electrically connected through a through-hole interconnection which is formed and penetrated though the solid-state image sensing device.

4. The imaging module according to claim 1, wherein

in a direction perpendicular to an extending direction of the first extended portion and the second extended portion, widths of the first extended portion and the second extended portion are smaller than widths of the first connection end portion and the second connection end portion extending from the first extended portion and the second extended portion, respectively.

5. The imaging module according to claim 1, wherein

the flexible wiring substrate comprises bend portions that are located at the first side and the second side of the device-mounted portion of the flexible wiring substrate and protrude from a projection range of the solid-state image sensing device in the device-mounted portion.

6. The imaging module according to claim 5, wherein

an insulation protection material does not coat the bend portion of the flexible wiring substrate so that wiring is exposed.

7. The imaging module according to claim 5, wherein

a cut-off portion is formed at the bend portion of the flexible wiring substrate.

8. The imaging module according to claim 1, further comprising an insulating tube collectively accommodating the first connection end portion and the second connection end portion of the flexible wiring substrate and covering at least part of a connection portion between the flexible wiring substrate and the electrical cable.

9. The imaging module according to claim 1, further comprising an insulating tube externally fitted onto each of the first connection end portion and the second connection end portion of the flexible wiring substrate, covering at least part of a connection portion between the flexible wiring substrate and the electrical cable.

10. The imaging module according to claim 8, wherein

the insulating tube is configured to include a half-divided structure in which a pair of tube divided bodies are connected to and integrated with each other.

11. The imaging module according to claim 9, wherein

the insulating tube is configured to include a half-divided structure in which a pair of tube divided bodies are connected to and integrated with each other.

12. The imaging module according to claim 1, wherein

the first connection end portion and the second connection end portion are fixed to each other, and

the flexible wiring substrate has a flexible portion located between a portion at which the first extended portion and the second extended portion are fixed and a portion at which the first connection end portion and the second connection end portion are fixed.

13. A lens-attached imaging module comprising a front-end imaging unit comprising:

a flexible wiring substrate and a solid-state image sensing device which constitute the imaging module according to claim 1;

a lens unit fixed to the solid-state image sensing device; and

a sleeve-shaped metal frame member accommodating the flexible wiring substrate, the solid-state image sensing device, and the lens unit.

14. An endoscope comprising:

an insertion portion; and

the lens-attached imaging module according to claim 13, housed in the insertion portion.