High current, low equivalent series resistance printed circuit board coil for power transfer application

• US 9,818,527 B2
• Filed: 12/30/2014
• Issued: 11/14/2017
• Est. Priority Date: 02/20/2012
• Status: Active Grant

• Current Assignee: Futurewei Technologies Incorporated (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Futurewei Technologies Incorporated (Huawei Investment & Holding Co., Ltd.)
• Inventors: Zabaco, Jorge
• Primary Examiner(s): Lian, Mangtin
• Application Number:
  US14/586,384
• Publication Number:
  US 20150115732A1
• Time in Patent Office: 1,050 Days
• Field of Search: 336200, 336147, 336232, 307104, 320108
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/002 Details of via holes for interconnecting the layers
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H02J 50/12 of the resonant type
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

An apparatus for a multilayer printed circuit board (PCB) coil, comprising: a first coil layer of a PCB; a plurality of vias coupled to and distributed to cover substantially the surface of the first coil layer within the PCB; and a second coil layer of the PCB and coupled to the vias to cover substantially the surface of the second coil layer, wherein the vias are positioned between the first coil layer and the second coil layer and enable substantially high current and low equivalent series resistance (ESR) for the multilayer PCB coil.

Claims

1. A handheld apparatus, comprising:

a housing;

a touchscreen;

an antenna circuit a battery; and

a wireless charging circuit including a multilayer printed circuit board (PCB) coil, wherein the multilayer PCB coil includes;

a first coil trace of a PCB, and

a second coil trace of the PCB,

wherein a plurality of vias conductively connecting the first coil trace and the second coil trace, and wherein thickness of the apparatus is less than 1 centimeter, wherein a size of a first via of the plurality of vias is different from a size of a second via of the plurality of vias.

2. The apparatus of claim 1 further comprising one or more other circuit components integrated with the first coil trace and the second coil trace on the PCB.

3. The apparatus of claim 1, wherein the plurality of vias have a cylindrical shape and are vertical with respect to the surfaces of the first coil trace and the second coil trace.