LED package with multiple element light source and encapsulant having planar surfaces
First Claim
1. An emitter package, comprising:
- first and second solid state light sources on a submount;
a conversion material layer covering said first solid state light source and substantially all the top surface of said submount, wherein said conversion material layer conformally coats said first solid state light source;
an encapsulant over said conversion material layer, said encapsulant comprising two or more planar surfaces;
wherein said second solid state light source is uncovered by said conversion material layer.
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Accused Products
Abstract
LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with a plurality of LEDs, which emit different colors of light, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material to be absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. The LED package can have a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package provides unique dimensional relationships between the features and LED package ratios, enabling more flexibility with different applications.
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Citations
94 Claims
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1. An emitter package, comprising:
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first and second solid state light sources on a submount; a conversion material layer covering said first solid state light source and substantially all the top surface of said submount, wherein said conversion material layer conformally coats said first solid state light source; an encapsulant over said conversion material layer, said encapsulant comprising two or more planar surfaces; wherein said second solid state light source is uncovered by said conversion material layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94)
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37. An emitter package, comprising:
- multiple solid state light sources on a submount;
an encapsulant on said submount, said encapsulant comprising one or more planar surfaces; and a blanket conversion material layer over substantially all of said submount and which conformally coats a plurality of surfaces of at least some of said solid state light sources, said blanket conversion material layer between said submount and said encapsulant; wherein at least one of said multiple solid state light sources is not covered by said blanket conversion material layer. - View Dependent Claims (38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 82, 83)
- multiple solid state light sources on a submount;
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66. An emitter package, comprising:
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a plurality of solid state light sources on a submount, at least two of said plurality of solid state light sources emitting different colors of light, wherein said different emitting solid state light sources are separately controllable to control the emission intensity; a conversion material layer which conformally coats at least some of said solid state light sources and on substantially all of said submount wherein at least one of said plurality of solid state light sources is not covered by said conversion material layer; and an encapsulant on said submount, said encapsulant comprising a plurality of planar surfaces; wherein at least some light is emitted from said plurality of planar surfaces of said encapsulant when at least one of said solid state light sources is operating. - View Dependent Claims (67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79)
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80. An emitter package, comprising:
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multiple solid state light sources on a submount; an encapsulant on said submount, said encapsulant comprising a plurality of planar surfaces; and a blanket conversion material layer over substantially all of said submount and which conformally coats at least some of said solid state light sources, wherein at least one of said multiple solid state light sources is not covered by said blanket conversion material layer, said blanket conversion material layer between said submount and said encapsulant, wherein said blanket conversion material layer comprises a maximum thickness of 100 microns or less; wherein at least some light is emitted from said plurality of planar surfaces of said encapsulant when at least one of said solid state light sources is operating.
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81. A solid state luminaire, comprising:
a solid state light source comprising a plurality of emitter packages, one or more of said packages comprising; first and second solid state light sources on a submount; a blanket conversion material layer on substantially all of said submount and which conformally coats said first solid state light source; and an encapsulant over said blanket conversion material layer, said encapsulant comprising two or more planar surfaces; wherein said second solid state light source is uncovered by said blanket conversion material layer.
Specification