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Light emitting diode devices, method of manufacture, uses thereof

  • US 9,821,523 B2
  • Filed: 10/25/2013
  • Issued: 11/21/2017
  • Est. Priority Date: 10/25/2012
  • Status: Active Grant
First Claim
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1. A light emitting diode device comprisinga light emitting diode, anda device component, wherein the device component comprises a polycarbonate composition comprisinga bisphenol A polycarbonate;

  • and2,2′

    -(1,4-phenylene)bis(4H-3,1-benzoxazin-4-one) in an amount effective to provide a composition wherein a molded sample of the composition hasa UL94 rating of V-2 or better at a thickness of 0.9 mm;

    an absorbance of less than 2 a.u. in the region of 370 to 380 nanometers; and

    for a molded sample of the composition having a thickness of 2.5 mm, an increase in yellowness index (Δ

    YI) of 12 or less after heat aging at 130°

    C. for 5,000, as measured by ASTM D1925,wherein the bisphenol A polycarbonate comprises less than or equal to 150 ppm free hydroxyl groups and less than or equal to 2 ppm sulfur as measured by a Total Sulfur Analysis based on combustion and coulometric detection, and a molded sample of the bisphenol A polycarbonate has;

    a yellowness index of 1.5 or less measured by ASTM D1925, and an increase in yellowness index of less than 3 after 2,000 hours of heat aging at 130°

    C. as measured by ASTM D 1925.

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