Mounting and environmental protection device for an IGBT module

• US 9,824,953 B1
• Filed: 05/16/2016
• Issued: 11/21/2017
• Est. Priority Date: 05/16/2016
• Status: Active Grant

• Current Assignee: Caterpillar Incorporated
• Original Assignee: Caterpillar Incorporated
• Inventors: Mische, William, Andris, Eric, Qattum, Basheer, Sergison, Daniel
• Primary Examiner(s): Vu, David
• Application Number:
  US15/156,169
• Publication Number:
  US 20170330815A1
• Time in Patent Office: 554 Days
• CPC Class Codes: H01L 2023/4087 Mounting accessories, interposers, clamping or screwing parts
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/117 Stacked arrangements of devices
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14324 comprising modular units, e.g. DIN rail mounted units

Abstract

A semiconductor module is disclosed. The semiconductor module may include a housing having a sidewall portion, a housing support plate coupled to a bottom surface of the sidewall portion such that the housing support plate and the sidewall portion define an interior space of the housing of the semiconductor module, and a semiconductor device disposed within the interior space and fixedly coupled to the housing. The semiconductor module may further include a cover member fixedly attached to a top surface of the sidewall portion such that the cover member, the housing and the housing support plate form a protective enclosure for the semiconductor device.

Claims

1. A semiconductor module, comprising:

a housing having a sidewall portion;

a housing support plate coupled to a bottom surface of the sidewall portion, the housing support plate and the sidewall portion defining an interior space of the housing of the semiconductor module;

a semiconductor device disposed within the interior space and fixedly coupled to the housing; and

a cover member fixedly attached to a top surface of the sidewall portion, such that the cover member, the housing, and the housing support plate form a protective enclosure for the semiconductor device,

wherein;

the cover member includes a first set of holes extending from a top surface of the cover member to a bottom surface of the cover member,

the housing includes a second set of holes extending from the top surface of the sidewall portion to the bottom surface of the sidewall portion,

the housing support plate includes a third set of holes formed in a top surface of the housing support plate, and

the first set of holes, the second set of holes and the third set of holes are aligned such that a fastening device being inserted into each of the first set of holes, the second set of holes, and the third set of holes fixedly attaches the cover member, the housing, and the housing support plate together.

2. The semiconductor module of claim 1, further comprising a plurality of attachment structures integrated with the sidewall portion,

wherein the plurality of attachment structures include a first set of attachment holes and the semiconductor device includes a second set of attachment holes,

the first set of attachment holes aligning with the second set of attachment holes such that a fastening device, inserted into each of the first and second set of attachment holes, secures the semiconductor device between the plurality of attachment structures and the housing support plate.

3. The semiconductor module of claim 2, wherein the fastening device is a pressure fastening device which exerts a pressure on the semiconductor device such that a bottom surface of the semiconductor device maintains contact with a top surface of the housing support plate.

4. The semiconductor module of claim 1, wherein a first sealing element is disposed between the bottom surface of the cover member and the top surface of the sidewall portion thereby forming a first seal between the cover member and the sidewall portion, and

wherein a second sealing element is disposed between the bottom surface of the sidewall portion and the top surface of the housing support plate thereby forming a second seal between the sidewall portion and the housing support plate.

5. The semiconductor module of claim 4, wherein the housing support plate includes a housing support plate aperture extending from the top surface of the housing support plate through a bottom surface of the housing support plate, and

wherein the housing support plate aperture is contained within a sealing element groove formed around a periphery of the housing support plate, such that the second seal is maintained and a semiconductor module input/output connection passes from the interior space of the housing to an exterior space of the semiconductor module.

6. The semiconductor module of claim 1, wherein the interior space of the housing is configured to accommodate a plurality of semiconductor module components arranged above the semiconductor device.

7. The semiconductor module of claim 6, wherein the sidewall portion includes a sidewall aperture extending from the interior space of the housing to an exterior space of the housing, and

wherein the plurality of semiconductor module components have an input/output connection extending through the sidewall aperture.

8. A power converter system, comprising:

a plurality of semiconductor modules,

each semiconductor module, of the plurality of semiconductor modules, including a housing and a semiconductor device,

the housing, of each semiconductor module of the plurality of semiconductor modules, having a sidewall portion which includes a top surface and a bottom surface;

a semiconductor module heat sink having a plurality of module mounting locations arranged on a top surface of the semiconductor module heat sink,

each semiconductor module, of the plurality of semiconductor modules, being positioned at one of the plurality of module mounting locations and coupled to the semiconductor module heat sink along the bottom surface of the sidewall portion,

the sidewall portion of each semiconductor module of the plurality of semiconductor modules, and the top surface of the semiconductor module heat sink defining an interior space of each semiconductor module of the plurality of semiconductor modules;

a plurality of attachment structures integrated with the sidewall portion of each semiconductor module, of the plurality of semiconductor modules, and adapted to secure the semiconductor device, of each semiconductor module, within the interior space of the semiconductor module; and

a cover member attached to the top surface of the sidewall portion, of the semiconductor module, such that the cover member, the housing of the semiconductor module, and the semiconductor module heat sink form a protective enclosure for the semiconductor device of the semiconductor module.

9. The power converter system of claim 8, wherein:

the cover member, of the semiconductor module, includes a first set of holes extending from a top surface of the cover member to a bottom surface of the cover member,

the housing, of the semiconductor module, includes a second set of holes extending from the top surface of the sidewall portion, of the semiconductor module, to the bottom surface of the sidewall portion,

each module mounting location, of the plurality of module mounting locations, includes a third set of holes formed in the top surface of the semiconductor module heat sink, and

the first set of holes, the second set of holes, and the third set of holes are aligned such that a fastening device being inserted into each of the first set of holes, the second set of holes and the third set of holes fixedly attaches the cover member, the housing and the semiconductor module heat sink together.

10. The power converter system of claim 9, wherein a first sealing element is disposed between the bottom surface of the cover member and the top surface of the sidewall portion, thereby forming a first seal between the cover member and the sidewall portion, and

wherein a second sealing element is disposed between the bottom surface of the sidewall portion and the top surface of the semiconductor module heat sink thereby forming a second seal between the housing and the semiconductor module heat sink.

11. The power converter system of claim 8, wherein:

the plurality of attachment structures include a first set of attachment holes,

the semiconductor device, of the semiconductor module, includes a second set of attachment holes, and

the first set of attachment holes align with the second set of attachment holes such that a fastening device, inserted into each of the first set of attachment holes and the second set of attachment holes, positions and secures the semiconductor device between the plurality of attachment structures and the semiconductor module heat sink.

12. The power converter system of claim 11, wherein the fastening device is a pressure fastening device which exerts a pressure on the semiconductor device, of the semiconductor module, such that a bottom surface of the semiconductor device maintains contact with the top surface of the semiconductor module heat sink.

13. The power converter system of claim 8, wherein the interior space of the housing, of the semiconductor module, is configured to accommodate a plurality of semiconductor module components arranged within the housing and positioned above the semiconductor device, of the semiconductor module.

14. The power converter system of claim 13, wherein the sidewall portion, of the semiconductor module, includes a sidewall aperture extending from the interior space of the semiconductor module to an exterior space of the semiconductor module, and

wherein the plurality of semiconductor module components have an input/output connection extending through the sidewall aperture.

15. The power converter system of claim 8, wherein the semiconductor module heat sink includes a plurality of auxiliary mounting locations to accommodate a plurality of power converter system auxiliary components.

16. The power converter system of claim 15, further comprising an internal channel formed within the semiconductor module heat sink,

wherein;

the internal channel is configured to run along a length of the semiconductor module heat sink,

each of the plurality of module mounting locations each having a module aperture contained within a sealing element groove formed around a periphery of each of the plurality of module mounting locations,

the plurality of auxiliary mounting locations each having an auxiliary aperture, and

each of the module apertures and the auxiliary apertures extending through the top surface of the semiconductor module heat sink into the internal channel.

17. The power converter system of claim 16, wherein:

the internal channel is configured with a conductor,

each of the plurality of semiconductor modules includes an input/output connection, and

the plurality of semiconductor modules being coupled to the conductor through the input/output connection extending into the internal channel through each of the module apertures.

18. A power converter system, comprising:

a plurality of semiconductor modules,

each semiconductor module, of the plurality of semiconductor modules, including a housing, a semiconductor device, and a cover member,

the housing, of each semiconductor module of the plurality of semiconductor modules, having a sidewall portion with a top surface and a bottom surface;

a semiconductor module heat sink having a plurality of module mounting locations and a plurality of auxiliary mounting locations arranged on a top surface of the semiconductor module heat sink,

the bottom surface of the sidewall portion, of each semiconductor module of the plurality of semiconductor modules, being positioned at one of the plurality of module mounting locations, and

the top surface of the semiconductor module heat sink and the sidewall portion, of each semiconductor module of the plurality of semiconductor modules, defining an interior space of each semiconductor module of the plurality of semiconductor modules;

a plurality of attachment structures integrated with the sidewall portion of each semiconductor module, of the plurality of semiconductor modules,

the plurality of attachment structures, of each semiconductor module of the plurality of semiconductor modules, including a first set of attachment holes,

the semiconductor device, of each semiconductor module, of the plurality of semiconductor modules, including a second set of attachment holes, and

the first set of attachment holes aligning with the second set of attachment holes such that a pressure fastening device, inserted into each of the first set of attachment holes and the second set of attachment holes, exerts a pressure on the semiconductor device such that;

a bottom surface of the semiconductor device maintains contact with the top surface of the semiconductor module heat sink, and the semiconductor device, of each semiconductor module of the plurality of semiconductor modules, is secured between the plurality of attachment structures and the top surface of the semiconductor module heat sink;

a first set of holes being formed in the cover member, of each of the plurality of semiconductor modules,

the first set of holes extending from a top surface of the cover member to a bottom surface of the cover member;

a second set of holes being formed in the housing, of each of the plurality of semiconductor modules,

the second set of holes extending from the top surface of the sidewall portion to the bottom surface of the sidewall portion;

a third set of holes formed in the top surface of the semiconductor module heat sink,

the third set of holes being arranged around each of the plurality of module mounting locations, and

the first set of holes, the second set of holes, and the third set of holes being aligned such that a fastening device fixedly attaches the cover member, the housing, and the semiconductor module heat sink together,

the fastening device being inserted into each of the first set of holes, the second set of holes and the third set of holes.

19. The power converter system of claim 18, wherein a first sealing element is disposed between the bottom surface of the cover member and the top surface of the sidewall portion, of each semiconductor module, of the plurality of semiconductor modules, thereby forming a first seal between the cover member and the sidewall portion of each semiconductor module,

wherein a second sealing element is disposed between the bottom surface of the sidewall portion of each semiconductor module, of the plurality of semiconductor modules, and the top surface of the semiconductor module heat sink thereby forming a second seal between the housing, of each semiconductor module, of the plurality of semiconductor modules, and the semiconductor module heat sink,

wherein the semiconductor module heat sink includes an internal channel formed within the semiconductor module heat sink,

the internal channel is configured to run along a length of the semiconductor module heat sink,

each of the plurality of module mounting locations each having a module aperture contained within a sealing element groove formed around the periphery of each of the plurality of module mounting locations,

the plurality of auxiliary mounting locations each having an auxiliary aperture,

each of the module apertures and the auxiliary apertures extending through the top surface of the semiconductor module heat sink and into the internal channel, and the internal channel being configured with a conductor,

the plurality of semiconductor modules having an input/output connection, and

the plurality of semiconductor modules being coupled to the conductor through the input/output connection extending into the internal channel through each of the module apertures.