Mounting and environmental protection device for an IGBT module
First Claim
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1. A semiconductor module, comprising:
- a housing having a sidewall portion;
a housing support plate coupled to a bottom surface of the sidewall portion, the housing support plate and the sidewall portion defining an interior space of the housing of the semiconductor module;
a semiconductor device disposed within the interior space and fixedly coupled to the housing; and
a cover member fixedly attached to a top surface of the sidewall portion, such that the cover member, the housing, and the housing support plate form a protective enclosure for the semiconductor device,wherein;
the cover member includes a first set of holes extending from a top surface of the cover member to a bottom surface of the cover member,the housing includes a second set of holes extending from the top surface of the sidewall portion to the bottom surface of the sidewall portion,the housing support plate includes a third set of holes formed in a top surface of the housing support plate, andthe first set of holes, the second set of holes and the third set of holes are aligned such that a fastening device being inserted into each of the first set of holes, the second set of holes, and the third set of holes fixedly attaches the cover member, the housing, and the housing support plate together.
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Abstract
A semiconductor module is disclosed. The semiconductor module may include a housing having a sidewall portion, a housing support plate coupled to a bottom surface of the sidewall portion such that the housing support plate and the sidewall portion define an interior space of the housing of the semiconductor module, and a semiconductor device disposed within the interior space and fixedly coupled to the housing. The semiconductor module may further include a cover member fixedly attached to a top surface of the sidewall portion such that the cover member, the housing and the housing support plate form a protective enclosure for the semiconductor device.
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Citations
19 Claims
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1. A semiconductor module, comprising:
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a housing having a sidewall portion; a housing support plate coupled to a bottom surface of the sidewall portion, the housing support plate and the sidewall portion defining an interior space of the housing of the semiconductor module; a semiconductor device disposed within the interior space and fixedly coupled to the housing; and a cover member fixedly attached to a top surface of the sidewall portion, such that the cover member, the housing, and the housing support plate form a protective enclosure for the semiconductor device, wherein; the cover member includes a first set of holes extending from a top surface of the cover member to a bottom surface of the cover member, the housing includes a second set of holes extending from the top surface of the sidewall portion to the bottom surface of the sidewall portion, the housing support plate includes a third set of holes formed in a top surface of the housing support plate, and the first set of holes, the second set of holes and the third set of holes are aligned such that a fastening device being inserted into each of the first set of holes, the second set of holes, and the third set of holes fixedly attaches the cover member, the housing, and the housing support plate together. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A power converter system, comprising:
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a plurality of semiconductor modules, each semiconductor module, of the plurality of semiconductor modules, including a housing and a semiconductor device, the housing, of each semiconductor module of the plurality of semiconductor modules, having a sidewall portion which includes a top surface and a bottom surface; a semiconductor module heat sink having a plurality of module mounting locations arranged on a top surface of the semiconductor module heat sink, each semiconductor module, of the plurality of semiconductor modules, being positioned at one of the plurality of module mounting locations and coupled to the semiconductor module heat sink along the bottom surface of the sidewall portion, the sidewall portion of each semiconductor module of the plurality of semiconductor modules, and the top surface of the semiconductor module heat sink defining an interior space of each semiconductor module of the plurality of semiconductor modules; a plurality of attachment structures integrated with the sidewall portion of each semiconductor module, of the plurality of semiconductor modules, and adapted to secure the semiconductor device, of each semiconductor module, within the interior space of the semiconductor module; and a cover member attached to the top surface of the sidewall portion, of the semiconductor module, such that the cover member, the housing of the semiconductor module, and the semiconductor module heat sink form a protective enclosure for the semiconductor device of the semiconductor module. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A power converter system, comprising:
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a plurality of semiconductor modules, each semiconductor module, of the plurality of semiconductor modules, including a housing, a semiconductor device, and a cover member, the housing, of each semiconductor module of the plurality of semiconductor modules, having a sidewall portion with a top surface and a bottom surface; a semiconductor module heat sink having a plurality of module mounting locations and a plurality of auxiliary mounting locations arranged on a top surface of the semiconductor module heat sink, the bottom surface of the sidewall portion, of each semiconductor module of the plurality of semiconductor modules, being positioned at one of the plurality of module mounting locations, and the top surface of the semiconductor module heat sink and the sidewall portion, of each semiconductor module of the plurality of semiconductor modules, defining an interior space of each semiconductor module of the plurality of semiconductor modules; a plurality of attachment structures integrated with the sidewall portion of each semiconductor module, of the plurality of semiconductor modules, the plurality of attachment structures, of each semiconductor module of the plurality of semiconductor modules, including a first set of attachment holes, the semiconductor device, of each semiconductor module, of the plurality of semiconductor modules, including a second set of attachment holes, and the first set of attachment holes aligning with the second set of attachment holes such that a pressure fastening device, inserted into each of the first set of attachment holes and the second set of attachment holes, exerts a pressure on the semiconductor device such that; a bottom surface of the semiconductor device maintains contact with the top surface of the semiconductor module heat sink, and the semiconductor device, of each semiconductor module of the plurality of semiconductor modules, is secured between the plurality of attachment structures and the top surface of the semiconductor module heat sink; a first set of holes being formed in the cover member, of each of the plurality of semiconductor modules, the first set of holes extending from a top surface of the cover member to a bottom surface of the cover member; a second set of holes being formed in the housing, of each of the plurality of semiconductor modules, the second set of holes extending from the top surface of the sidewall portion to the bottom surface of the sidewall portion; a third set of holes formed in the top surface of the semiconductor module heat sink, the third set of holes being arranged around each of the plurality of module mounting locations, and the first set of holes, the second set of holes, and the third set of holes being aligned such that a fastening device fixedly attaches the cover member, the housing, and the semiconductor module heat sink together, the fastening device being inserted into each of the first set of holes, the second set of holes and the third set of holes. - View Dependent Claims (19)
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Specification