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Semiconductor die mount by conformal die coating

  • US 9,824,999 B2
  • Filed: 12/15/2015
  • Issued: 11/21/2017
  • Est. Priority Date: 09/10/2007
  • Status: Active Grant
First Claim
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1. A method for affixing a die onto a support, comprising:

  • placing the die onto the support;

    providing a standoff between a die attach surface of the die and a die mount surface of the support; and

    conformally coating to coat at least the die attach surface of the die and the die mount surface of the support including forming a polymer in situ with vapor deposition in a space between the die attach surface of the die and the die mount surface of the support.

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