Implantable lead having multi-planar spiral inductor filter

• US 9,827,415 B2
• Filed: 06/27/2014
• Issued: 11/28/2017
• Est. Priority Date: 11/09/2006
• Status: Active Grant

• Current Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Original Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Inventors: Stevenson, Robert A., Dabney, Warren S., Frysz, Christine A., Brendel, Richard L.
• Primary Examiner(s): Hankins, Lindsey G.
• Application Number:
  US14/316,896
• Publication Number:
  US 20140330355A1
• Time in Patent Office: 1,250 Days
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/08 Arrangements or circuits for monitoring, protecting, controlling or indicating for external stimulators A61N1/3603; for implantable neurostimulators A61N1/36128; for heart stimulators A61N1/37; for defibrillators A61N1/3925
• CPC Class Codes: A61N 1/086 Magnetic resonance imaging [MRI] compatible leads
• CPC Class Codes: H01F 17/02 without magnetic core
• CPC Class Codes: H03H 1/0007 of radio frequency interference filters

Abstract

A multilayer helical wave filter having a primary resonance at a selected RF diagnostic or therapeutic frequency or frequency range, includes an elongated conductor forming at least a portion of an implantable medical lead. The elongated conductor includes a first helically wound segment having at least one planar surface, a first end and a second end, which forms a first inductive component, and a second helically wound segment having at least one planar surface, a first end and a second end, which forms a second inductive element. The first and second helically wound segments are wound in the same longitudinal direction and share a common longitudinal axis. Planar surfaces of the helically wound segments face one another, and a dielectric material is disposed between the facing planar surfaces of the helically wound segments and between adjacent coils of the helically wound segments, thereby forming a capacitance.

Claims

1. An implantable lead, comprising:

a) at least one implantable lead wire extending from a proximal electrical connector configured for electrical connection to an implantable medical device to a distal electrode, wherein the electrode is configured for contact with biological cells inside a body;

b) a first dielectric substrate comprising spaced apart first and second substrate sides;

c) at least a first conductive circuit trace in the shape of a first planar spiral inductor and a second conductive circuit trace in the shape of a second planar spiral inductor, wherein the first and second conductive circuit traces are series portions of the lead wire supported in an overlaid and stacked relationship on the respective first and second substrate sides; and

d) wherein a center of the first spiral inductor is electrically coupled to a center of the second spiral inductor so that a first multi-turn loop current of the first spiral inductor is in the same direction as a second multi-turn loop current of the second spiral inductor,

e) wherein a bandstop filter inductance is formed by the first and second spiral inductors and wherein a bandstop filter capacitance comprising parasitic capacitance is formed between adjacent turns of each of the first and second spiral inductors and between the overlaid turns of the first and second spiral inductors, and

f) wherein the combined inductance and capacitance of the bandstop filter provide an equivalent circuit bandstop filter that is configured to attenuate at least one MRI RF pulsed frequency centered at or near an RF resonant frequency.

2. The implantable lead of claim 1 wherein the at least one RF resonant frequency is at or near 64 MHz or 128 MHz.

3. The implantable lead of claim 1 wherein the first and second conductive circuit traces have a cross-section perpendicular to their length that is selected from the group consisting of circular, rectangular, square, oval, pentagon, hexagon, and an irregular shaped.

4. The implantable lead of claim 1 wherein the first dielectric substrate supporting the first and second conductive circuit traces forming the first and second spiral inductors is flexible.

5. The implantable lead of claim 4 wherein the first dielectric substrate supporting the first and second conductive circuit traces forming the first and second spiral inductors is configured to be formed into a roll.

6. The implantable lead of claim 1 including an insulative covering over an outer surface of the first and second conductive circuit traces.

7. The implantable lead of claim 1, further comprising:

a) a second dielectric substrate supporting a third conductive circuit trace in the shape of a third planar spiral inductor that is substantially similar in shape to the first and second spiral inductors,

b) wherein the second and third spiral inductors are in an overlaid and stacked relationship with the second dielectric there between, and

c) wherein an outer end of the second spiral inductor is electrically coupled to an outer end of the third spiral inductor so that the first multi-turn loop current of the first spiral inductor, the second multi-turn loop current of the second spiral inductor, and a third multi-turn loop current of the third spiral inductor are in the same direction.

8. The implantable lead of claim 7 further comprising:

a) a third dielectric substrate supporting a fourth conductive circuit trace in the shape of a fourth planar spiral inductor that is substantially similar in shape to the first, second and third spiral inductors,

b) wherein the third and fourth spiral inductors are in an overlaid and stacked relationship with the third dielectric there between, and

c) wherein a center of the third spiral inductor is electrically coupled to a center of the fourth spiral inductor so that the first multi-turn loop current of the first spiral inductor, the second multi-turn loop current of the second spiral inductor, the third multi-turn loop current of the third spiral inductor, and a fourth multi-turn loop current of the fourth spiral inductor are in the same direction.

9. The implantable lead of claim 8 wherein the first, second, and third dielectric substrates are tape-based flexible substrates.

10. The implantable lead of claim 8 wherein the first, second, third and fourth conductive circuit traces are supported on the first, second and third dielectric substrates by at least one of the group consisting of a spin coating, a conventional sputter process, an evaporation technique, a photoresist process, an etching process, a photoresist removal process, a silk-screening process, and an electrically deposited process.

11. The implantable lead of claim 8 wherein the first, second, and third dielectric substrates are of a biocompatible material selected from the group consisting of bioinert or biocompatible polymers including polydimethylsoloxanes (PDMS), polyethyleneterephthalate (PET), teflons, teflons doped with dielectrics, polytetrafluoroethylene (PTFE), ethylenetetrafluoroethylene (ETFE), parylenes, polyether block amide (PEBAX), polyetheretherketone (PEEK), polystyrenes, polysulfones, polypropylenes, polycarbonates, polyvinyl chloride (PVC), polyxylylene polymers, polyamides, polyimides, nylon, epoxies, elastomers, and gels.

12. The implantable lead of claim 8 wherein the first, second, and third dielectric substrates are of a photosensitive material selected from the group consisting of photosensitive polymers and co-polymers, photosensitive or photopatternable polymers, microstructured dielectric rubbers or biocompatible dielectric particles embedded in flexible, stretchable, conformal biocompatible substrates including silicones, urethanes, PDMS or PET, where the biocompatible dielectric particles comprise micron, submicron, nano, and ultranano biocompatible dielectric particles.

13. The implantable lead of claim 8 wherein the first, second, and third dielectric substrates are of a carbonaceous material selected from the group consisting of pyrolitic and vitreous carbons, composites using nano and ultranano carbons, fibers, chopped fibers, ground chopped fibers, submicron fibers, whiskers, nanocrystalline (NCD) and ultrananocrystalline diamond (UNCD), intrinsic diamond, doped diamond, hybrid biocompatible oxide/NCD layered combinations, and hybrid biocompatible oxide/UNCD layered combinations.

14. The implantable lead of claim 8 wherein the first, second, and third dielectric substrates are of a material selected from the group consisting of talcs, calcium carbonate, titanium dioxide, aluminum dioxide, sapphire, mica, silica, vapor deposited, e-beam deposited oxide, atomic layer deposited films including tantalum oxide (Ta₂O₅), anodized tantalum, aluminum oxide (Al₂O₃), titanium oxide (TiO₂), anodized titanium, tantalum nitride (TaN), titanium nitride (TiN), silicon nitride (SiN), barium titanate (BaTiO₃), silicon oxide (SiO₂), and hafnium oxide (HfO₂).

15. The implantable lead of claim 1 wherein the first conductive circuit trace is substantially similar in shape to the second conductive circuit trace.

16. The implantable lead of claim 1 including a first contact pad electrically coupled to an outer end of the first conductive circuit trace.

17. The implantable lead of claim 16 including a second contact pad electrically coupled to an outer end of the second conductive circuit trace.

18. The implantable lead of claim 17 wherein the first and second contact pads are serially connected to the implantable lead wire.

19. The implantable lead of claim 1 wherein the first planar spiral inductor attenuates a first MRI RF pulsed frequency centered at a first RF resonant frequency or range of frequencies.

20. The implantable lead of claim 19 wherein the second planar spiral inductor attenuates a second MRI RF pulsed frequency centered at a second RF resonant frequency or range of frequencies.

21. The implantable lead of claim 20 wherein the first and second RF resonant frequencies are substantially different frequencies.

22. The implantable lead of claim 21 wherein the first RF resonant frequency comprises 64 MHz and the second RF resonant frequency comprises 128 MHz.

23. A multi-layer and multi-helical Wheeler spiral bandstop filter configured to be connectable in series with an implantable lead of an active implantable medical device, probe or catheter, the bandstop filter comprising:

a) a first dielectric substrate comprising spaced apart first and second substrate sides;

b) at least a first conductive circuit trace in the shape of a first planar Wheeler spiral inductor and a second conductive circuit trace in the shape of a second planar Wheeler spiral inductor, wherein the first and second Wheeler spiral inductors provide respective first and second multi-turn loop currents;

c) wherein the first and second Wheeler spiral inductors are connected in series and supported in an overlaid and stacked relationship on the respective first and second substrate sides;

d) wherein a center of the first Wheeler spiral inductor is electrically coupled to a center of the second Wheeler spiral inductor so that the first multi-turn loop current of the first Wheeler spiral inductor is in the same direction as the second multi-turn loop current of the second Wheeler spiral inductor;

e) wherein a bandstop filter inductance is formed by the first and second Wheeler spiral inductors with there being a bandstop filter capacitance comprising parasitic capacitance between adjacent turns of each of the first and second Wheeler spiral inductors and between the overlaid turns of the first and second Wheeler spiral inductors;

f) wherein the combined inductance and capacitance of the bandstop filter provide an equivalent circuit bandstop filter that is configured to attenuate at least one MRI RF pulsed frequency centered at or near an RF resonant frequency.

24. The filter of claim 23 wherein the at least one RF resonant frequency comprises 64 MHz or 128 MHz.

25. A multi-layer and multi-helical spiral bandstop filter configured to be connectable in series with an implantable lead of an active implantable medical device, probe or catheter, the bandstop filter comprising:

a) a dielectric substrate comprising spaced apart first and second substrate sides;

b) a first conductive circuit trace in the shape of a first planar spiral inductor and a second conductive circuit trace in the shape of a second planar spiral inductor, wherein the first and second spiral inductors provide respective first and second multi-turn loop currents;

c) wherein the first and second spiral inductors are connected in series and supported in an overlaid and stacked relationship on the respective first and second substrate sides;

d) wherein a center of the first spiral inductor is electrically coupled to a center of the second spiral inductor so that the first multi-turn loop current of the first spiral inductor is in the same direction as the second multi-turn loop current of the second spiral inductor; and

e) wherein the dielectric substrate and the first and second conductive circuit traces are flexible.

26. An implantable lead, comprising:

a) at least one implantable lead wire extending from a proximal electrical connector configured for electrical connection to an implantable medical device to a distal electrode, wherein the electrode is configured for contact with biological cells inside a body;

b) n−

1 dielectric substrates;

c) n conductive circuit traces as series portions of the conductive lead wire, wherein one of the n-1 dielectric substrates is intermediate immediately adjacent conductive circuit traces with the circuit traces being in an overlaid and stacked relationship on opposite sides of the intermediate one of the n-1 dielectric substrates, and

c) an insulative covering over at least an outer surface of the first and n conductive circuit traces,

d) wherein the outer ends of immediately adjacent first and second circuit traces are connected together, and the centers of immediately adjacent second and third circuit traces are connected together to thereby provide n multi-turn loop currents of the respective n spiral inductors being in the same direction,

e) wherein a bandstop filter inductance is formed by the n spiral inductors and wherein a bandstop filter capacitance comprising parasitic capacitance is formed between adjacent turns of each of the spiral inductors and between the overlaid turns of immediately adjacent spiral inductors, and

f) wherein the combined inductance and capacitance of the bandstop filter provide an equivalent circuit bandstop filter that is configured to attenuate at least one MRI RF pulsed frequency centered at or near an RF resonant frequency.

27. The implantable lead of claim 26 wherein each circuit trace is in the shape of a Wheeler spiral inductor.

28. The implantable lead of claim 26 wherein the RF resonant frequency comprises 64 MHz or 128 MHz.