Integrated CMOS back cavity acoustic transducer and the method of producing the same
First Claim
Patent Images
1. A method of fabricating a MEMS device comprising:
- bonding a MEMS substrate to a CMOS substrate, the MEMS substrate including a movable element;
forming a cavity in the CMOS substrate;
forming a back cavity, the back cavity being connected to the CMOS substrate and formed at least partially by the cavity in the CMOS substrate thereby acoustically coupling the movable element to the back cavity;
forming at least one metal pad on the CMOS substrate; and
forming at least one stud bump on the at least one metal pad,wherein the at least one stud bump protrudes above a top surface of the MEMS substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
A MEMS device includes a MEMS substrate with a movable element. Further included is a CMOS substrate with a cavity, the MEMS substrate disposed on top of the CMOS substrate. Additionally, a back cavity is connected to the CMOS substrate, the back cavity being formed at least partially by the cavity in the CMOS substrate and the movable element being acoustically coupled to the back cavity.
-
Citations
21 Claims
-
1. A method of fabricating a MEMS device comprising:
-
bonding a MEMS substrate to a CMOS substrate, the MEMS substrate including a movable element; forming a cavity in the CMOS substrate; forming a back cavity, the back cavity being connected to the CMOS substrate and formed at least partially by the cavity in the CMOS substrate thereby acoustically coupling the movable element to the back cavity; forming at least one metal pad on the CMOS substrate; and forming at least one stud bump on the at least one metal pad, wherein the at least one stud bump protrudes above a top surface of the MEMS substrate. - View Dependent Claims (2, 3, 9, 10, 11, 12, 13, 14, 15, 16, 18, 19, 20, 21)
-
- 4. The method of fabricating a MEMS device, as recited 1, further including covering the back cavity with a cap layer.
-
17. A method of fabricating a MEMS device comprising:
-
forming the at least one stud bump inside at least one underfill; bonding a MEMS substrate to a CMOS substrate, the MEMS substrate including a movable element; forming a cavity in the CMOS substrate; forming a back cavity, the back cavity being connected to the CMOS substrate and formed at least partially by the cavity in the CMOS substrate thereby acoustically coupling the movable element to the back cavity; forming at least one metal pad on the CMOS substrate; and forming at least one stud bump on the at least one metal pad.
-
Specification