Semiconductor die and package jigsaw submount

• US 9,831,144 B2
• Filed: 08/28/2013
• Issued: 11/28/2017
• Est. Priority Date: 08/28/2013
• Status: Active Grant

• Current Assignee: Qubeicon Ltd.
• Original Assignee: Qubeicon Ltd.
• Inventors: Podval, Shimon
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US14/428,376
• Publication Number:
  US 20160163610A1
• Time in Patent Office: 1,553 Days
• Field of Search: 174252, 174255, 257686, 257693, 257696, 257707, 257724, 361761, 361766, 438109, 438202, 438460
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05555 being circular or elliptic
• CPC Class Codes: H01L 2224/06135 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48471 the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49177 Combinations of different arrangements
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/81203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/81205 : Ultrasonic bonding
• CPC Class Codes: H01L 2224/81385 : Shape, e.g. interlocking features
• CPC Class Codes: H01L 23/13 : characterised by the shape
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 23/49855 : for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/15162 : Top view
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H05K 1/0204 : using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/117 : Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/041 : Stacked PCBs, i.e. having neither an empty space nor mounted components in between
• CPC Class Codes: H05K 2201/09063 : Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/09154 : Bevelled, chamferred or tapered edge
• CPC Class Codes: H05K 2201/09163 : Slotted edge
• CPC Class Codes: H05K 2201/0939 : Curved pads, e.g. semi-circular or elliptical pads or lands
• CPC Class Codes: H05K 2201/09472 : Recessed pad for surface mounting recess in pad H05K2201/09745; Recessed electrode of component
• CPC Class Codes: H05K 3/3415 : on both sides of the substrate or combined with lead-in-hole components
• CPC Class Codes: H05K 3/3442 : having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A submount for connecting a semiconductor device to an external circuit, the submount comprising: a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces; at least one recess formed along an edge surface; a layer of a conducting material formed on a surface of each of the at least one recess; a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor device; and electrically conducting connections each of which electrically connects a soldering pad in the first plurality of soldering pads to the layer of conducting material of a recess of the at least one recess.

Claims

1. An apparatus comprising:

a submount for connecting a semiconductor or passive device to an external circuit, the submount comprising;

a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces;

a plurality of recesses formed along an edge surface;

a layer of a conducting material formed on a surface of each of the at least one recess, wherein at least two recesses of the plurality of recesses differ from each other with respect to one or more of;

recess surface shape, recess surface area, and extent of coverage on the surface of the recess by the conducting material layer;

a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor or passive device;

a second plurality of soldering pads on the second face surface configured to make electrical contact with a second semiconductor or passive device; and

electrically conducting connections each of which electrically connects a soldering pad in the first and/or second plurality of soldering pads to the layer of conducting material of a recess of the plurality of recesses; and

a motherboard for mounting the submount, the motherboard comprising;

a face surface configured to be apposed to the second face surface of the planar substrate of the submount when the submount is mounted to the motherboard;

at least one conducting land on the face surface of the motherboard for making electrical contact with the layer of conducting material of a recess of the plurality of recesses formed along the edge surface of the submount when the submount is mounted to the motherboard; and

a recess formed on the face surface of the motherboard and dimensioned to receive the second semiconductor or passive device mounted to the second face surface of the submount when the submount is mounted on the motherboard.

2. The apparatus according to claim 1 wherein the electrically conducting connections comprise a conducting trace on the first or second face surface.

3. The apparatus according to claim 1 wherein the electrically conducting connections comprise an internal conductor located inside the planar substrate.

4. The apparatus according to claim 1 wherein a recess of the plurality of recesses formed along the edge surface of the submount has a circular and/or polyline recess surface.

5. The apparatus according to claim 4 wherein, out of the plurality of recesses formed along the edge surface of the submount, at least one recess has a circular recess surface and at least one recess has a polyline recess surface.

6. The apparatus according to claim 1 further comprising a layer of a conducting material formed on at least one portion along the edge surface of the submount.

7. The apparatus according to claim 1 comprising a layer of conductive material formed on at least one portion along the edge surface of the submount between at least two adjacent recesses.

8. The apparatus according to claim 1 wherein the recess in the face surface is a blind recess having a bottom surface in the substrate of the motherboard.

9. The apparatus according to claim 8, wherein the motherboard comprises a layer of material configured to dissipate heat generated by operation of the semiconductor or passive device.

10. The apparatus according to claim 1, wherein the recess in the face surface of the motherboard passes through the motherboard substrate.

11. The apparatus according to claim 1 wherein an angle between at least a portion of the recess surface of the plurality of recesses formed along the edge surface of the submount is angled at an acute angle with respect to a face surface of the first and second face surfaces.

12. The apparatus according to claim 1 wherein a region of an edge surface of the submount is angled at an acute angle with respect to a face surface of the first and second face surfaces.

13. The apparatus according to claim 12 wherein the edge surface of the submount is a faceted surface comprising first and second facets.

14. The apparatus according to claim 13 wherein a region of the second facet is covered with a layer of conducting material.

15. The apparatus according to claim 14 wherein the substrate comprises an internal conductor that makes electrical contact with the layer of conducting material on the second facet.

16. The apparatus according to claim 14 wherein the substrate comprises an internal conductor that does not make electrical contact with the layer of conducting material on the second facet.

17. The apparatus according to claim 1, wherein, when the submount is mounted to the motherboard, there is no air gap between the first face surface of the insulating substrate of the motherboard and the second face surface of the planar substrate of the submount.

18. The apparatus according to claim 1 wherein, out of the plurality of recesses formed along the edge surface of the submount, at least one recess is fully covered with a conductive layer, and at least one recess is partially covered with a conductive layer.