Heat sink for semiconductor modules

• US 9,831,151 B1
• Filed: 08/03/2016
• Issued: 11/28/2017
• Est. Priority Date: 08/03/2016
• Status: Active Grant

• Current Assignee: Elpis Technologies Inc. (Wi-LAN Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Schultz, Mark D.
• Primary Examiner(s): Tobergte, Nicholas
• Application Number:
  US15/226,971
• Time in Patent Office: 482 Days
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/33181 On opposite sides of the body
• CPC Class Codes: H01L 23/00 Details of semiconductor or other solid state devices H01L25/00 takes precedence ; structural arrangements for testing or measuring during manufacture or treatment, or for reliability measurements H01L22/00; arrangements for connecting or disconnecting semiconductor or solid-state bodies, or methods related thereto H01L24/00; finger print sensors G06V40/12
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 24/32 of an individual layer connector

Abstract

A thermal interface includes a first thermal interface material (TIM) layer and a lid disposed on the first TIM layer. A second TIM layer is disposed on a surface of the lid opposite the first TIM layer. The second TIM layer is from about 75% to about 25% as wide as a width of the lid in at least one direction. A heat sink disposed on a surface of the second TIM layer opposite the lid.

Claims

1. A thermal interface, comprising:

a first thermal interface material (TIM) layer;

a lid disposed on the first TIM layer;

a second TIM layer disposed on a surface of the lid opposite the first TIM layer, wherein the second TIM layer is from about 75% to about 25% as wide as a width of the lid in at least one direction; and

a heat sink disposed on a surface of the second TIM layer opposite the lid,

wherein the second TIM layer has substantially a same width as a width of an active area of the heat sink.

2. The thermal interface of claim 1, wherein the second TIM layer is about 50% as wide as a width of the lid in at least one direction.

3. The thermal interface of claim 1, wherein the heat sink is a rigid heat sink, or a compliant heat sink.

4. The thermal interface of claim 1, wherein the heat sink is an air cooled heat sink, or a liquid cooled heat sink.

5. The thermal interface of claim 1, wherein a thermal interface material included in the second TIM layer is loaded at an operating pressure of from about 75 psi to about 150 psi.

6. A thermal interface, comprising:

a first thermal interface material (TIM) layer;

a lid disposed on the first TIM layer;

a second TIM layer disposed on a surface of the lid opposite the first TIM layer;

a heat sink disposed on a surface of the second TIM layer opposite the lid,

wherein the heat sink comprises a first projection in contact with the surface of the lid at a first outer edge of the lid,

wherein the first projection forms a first recess between the first projection and the second TIM layer,

wherein the heat sink comprises a second projection in contact with the surface of the lid at a second outer edge of the lid opposite the first outer edge,

wherein the second projection forms a second recess between the second projection and the second TIM layer, and

wherein the second TIM layer has substantially a same width as a width of an active area of the heat sink.

7. The thermal interface of claim 6, wherein the second TIM layer is from about 75% to about 25% as wide as a width of the lid.

8. The thermal interface of claim 7, wherein the second TIM layer is about 50% as wide as a width of the lid.

9. The thermal interface of claim 6, wherein at least one of the first and second projections comprises a same thermal interface material as a thermal interface material included in the second TIM layer.

10. The thermal interface of claim 6, wherein the heat sink is a rigid heat sink.

11. The thermal interface of claim 6, wherein the heat sink is a compliant heat sink.

12. The thermal interface of claim 6, wherein the heat sink is an air cooled heat sink.

13. The thermal interface of claim 6, wherein the heat sink is a liquid cooled heat sink.

14. The thermal interface of claim 6, wherein a thermal interface material included in the second TIM layer is loaded at an operating pressure of from about 75 psi to about 150 psi.

15. A semiconductor device, comprising;

a substrate;

a semiconductor chip disposed on the substrate; and

a thermal interface disposed on a surface of the semiconductor chip opposite the substrate,

wherein the thermal interface comprises;

a first thermal interface material (TIM) layer disposed on the surface of the semiconductor chip opposite the substrate;

a lid disposed on the first TIM layer;

a second TIM layer disposed on a surface of the lid opposite the first TIM layer, wherein the second TIM layer is from about 75% to about 25% as wide as a width of an upper surface of the lid, wherein the second TIM layer is about 50% as wide as a width of the lid in at least one direction; and

a heat sink disposed on a surface of the second TIM layer opposite the lid.

16. The thermal interface of claim 15, wherein the heat sink is a rigid heat sink or a compliant heat sink.

17. The thermal interface of claim 15, wherein the heat sink is an air cooled heat sink or a liquid cooled heat sink.

18. The thermal interface of claim 15, wherein a thermal interface material included in the second TIM layer is loaded at an operating pressure of from about 75 psi to about 150 psi.