×

Heat sink for semiconductor modules

  • US 9,831,151 B1
  • Filed: 08/03/2016
  • Issued: 11/28/2017
  • Est. Priority Date: 08/03/2016
  • Status: Active Grant
First Claim
Patent Images

1. A thermal interface, comprising:

  • a first thermal interface material (TIM) layer;

    a lid disposed on the first TIM layer;

    a second TIM layer disposed on a surface of the lid opposite the first TIM layer, wherein the second TIM layer is from about 75% to about 25% as wide as a width of the lid in at least one direction; and

    a heat sink disposed on a surface of the second TIM layer opposite the lid,wherein the second TIM layer has substantially a same width as a width of an active area of the heat sink.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×