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Method for manufacturing a semiconductor device at low temperature

  • US 9,831,275 B2
  • Filed: 01/29/2016
  • Issued: 11/28/2017
  • Est. Priority Date: 02/04/2015
  • Status: Expired due to Fees
First Claim
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1. A method for manufacturing a semiconductor device, comprising the steps of:

  • forming an oxide semiconductor film at a first temperature;

    processing the oxide semiconductor film into an island shape;

    then, depositing a material to be a source electrode and a drain electrode by a sputtering method over the oxide semiconductor film;

    processing the material to form the source electrode and the drain electrode;

    then, forming a protective insulating film over the oxide semiconductor film, the source electrode and the drain electrode,then forming a first barrier film over the protective insulating film;

    adding excess oxygen or an oxygen radical to the protective insulating film through the first barrier film;

    performing heat treatment at a second temperature lower than 400°

    C. to diffuse the excess oxygen or the oxygen radical into the oxide semiconductor film;

    removing the first barrier film or a part of the first barrier film, and a part of the protective insulating film by wet etching; and

    then forming a second barrier film over the protective insulating film,wherein temperatures of processes after processing the oxide semiconductor film into the island shape and before depositing the material to be the source electrode and the drain electrode are lower than or equal to the first temperature.

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