Water resistant surface mount device package
First Claim
1. An emitter package, comprising:
- a casing comprising a cavity extending into an interior of the casing from a top surface of the casing;
an electrically conductive lead frame coupled to the casing and comprising a plurality of leads, each lead of the plurality of leads comprising a package mounting portion in a first plane, a device mounting portion in a plane other than the first plane, and an intermediate portion between the first plane and the second plane, at least one lead in the plurality of leads having a first surface, and a second surface opposite the first surface, in which the plurality of leads comprises a plurality of electrically conductive cathode parts and a plurality of electrically conductive anode parts, in which the plurality of electrically conductive anode parts are separated by a gap from the plurality of electrically conductive cathode parts;
at least one lead of the plurality of leads comprising at least one feature in a first portion of the electrically conductive lead frame, wherein the at least one feature comprises at least one of a through-hole, a cut, a spot punch, a U-bend, a projection, and an indentation, in which a material of the casing contacts the at least one feature, wherein the at least one feature is distinct from the gap and in at least the first surface and the second surface, in which a portion of the first surface and a portion of the second surface comprising the at least one feature is entirely inside the casing; and
a plurality of light emitting devices coupled to the electrically conductive lead frame, in which the plurality of light emitting devices and at least a second portion of the electrically conductive lead frame distinct from the first portion of the electrically conductive lead frame are exposed through the cavity.
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Accused Products
Abstract
The present invention is directed to LED packages and LED displays utilizing water resistant packages with improved structural integrity and customizable attributes. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, water resistant package. Moreover, in some embodiments the improved structural integrity and water resistance is further provided by cavity features that improve adhesion between the cavity and a protective encapsulant. Some embodiments also provide for packages with a greater overall height than the length of their side-exposed solder pins, which improves gel coverage of the side-exposed solder pins between adjacent packages.
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Citations
21 Claims
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1. An emitter package, comprising:
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a casing comprising a cavity extending into an interior of the casing from a top surface of the casing; an electrically conductive lead frame coupled to the casing and comprising a plurality of leads, each lead of the plurality of leads comprising a package mounting portion in a first plane, a device mounting portion in a plane other than the first plane, and an intermediate portion between the first plane and the second plane, at least one lead in the plurality of leads having a first surface, and a second surface opposite the first surface, in which the plurality of leads comprises a plurality of electrically conductive cathode parts and a plurality of electrically conductive anode parts, in which the plurality of electrically conductive anode parts are separated by a gap from the plurality of electrically conductive cathode parts; at least one lead of the plurality of leads comprising at least one feature in a first portion of the electrically conductive lead frame, wherein the at least one feature comprises at least one of a through-hole, a cut, a spot punch, a U-bend, a projection, and an indentation, in which a material of the casing contacts the at least one feature, wherein the at least one feature is distinct from the gap and in at least the first surface and the second surface, in which a portion of the first surface and a portion of the second surface comprising the at least one feature is entirely inside the casing; and a plurality of light emitting devices coupled to the electrically conductive lead frame, in which the plurality of light emitting devices and at least a second portion of the electrically conductive lead frame distinct from the first portion of the electrically conductive lead frame are exposed through the cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. An emitter package, comprising:
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a casing comprising a cavity extending into the interior of the casing from a top surface of the casing; an electrically conductive lead frame comprising a package mounting portion at a first level and a device mounting portion at a level other than the first level, and a first surface and a second surface opposite the first surface, the electrically conductive lead frame being coupled to said casing, wherein the electrically conductive lead frame comprises an S-leg configuration or comprises an L-leg configuration in which the electrically conductive lead frame extends outside of the casing only at a bottom surface of the casing, and wherein a portion of the electrically conductive lead frame inside the casing comprises one or more bends, wherein a portion of said lead frame inside said casing comprises one or more U-bends, at least one of said U-bends being entirely in said casing; and a plurality of light emitting devices coupled to the electrically conductive lead frame, the plurality of light emitting devices and portions of the electrically conductive lead frame exposed through the cavity; wherein the electrically conductive lead frame comprises a plurality of electrically conductive cathode parts and a plurality of electrically conductive anode parts, in which the plurality of electrically conductive anode parts are separated by a gap from the plurality of electrically conductive cathode parts; the electrically conductive lead frame comprising at least one feature in at least the first surface and the second surface such that a portion of the first surface and a portion of the second surface comprising the at least one feature is entirely encased by the casing. - View Dependent Claims (21)
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Specification