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Water resistant surface mount device package

  • US 9,831,393 B2
  • Filed: 07/27/2011
  • Issued: 11/28/2017
  • Est. Priority Date: 07/30/2010
  • Status: Active Grant
First Claim
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1. An emitter package, comprising:

  • a casing comprising a cavity extending into an interior of the casing from a top surface of the casing;

    an electrically conductive lead frame coupled to the casing and comprising a plurality of leads, each lead of the plurality of leads comprising a package mounting portion in a first plane, a device mounting portion in a plane other than the first plane, and an intermediate portion between the first plane and the second plane, at least one lead in the plurality of leads having a first surface, and a second surface opposite the first surface, in which the plurality of leads comprises a plurality of electrically conductive cathode parts and a plurality of electrically conductive anode parts, in which the plurality of electrically conductive anode parts are separated by a gap from the plurality of electrically conductive cathode parts;

    at least one lead of the plurality of leads comprising at least one feature in a first portion of the electrically conductive lead frame, wherein the at least one feature comprises at least one of a through-hole, a cut, a spot punch, a U-bend, a projection, and an indentation, in which a material of the casing contacts the at least one feature, wherein the at least one feature is distinct from the gap and in at least the first surface and the second surface, in which a portion of the first surface and a portion of the second surface comprising the at least one feature is entirely inside the casing; and

    a plurality of light emitting devices coupled to the electrically conductive lead frame, in which the plurality of light emitting devices and at least a second portion of the electrically conductive lead frame distinct from the first portion of the electrically conductive lead frame are exposed through the cavity.

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