Cap and substrate electrical connection at wafer level
First Claim
Patent Images
1. A device comprising:
- an electrically conductive ground structure disposed in a first substrate, wherein the electrically conductive ground structure extends completely through the first substrate to a second substrate such that the electrically conductive ground structure physically contacts the second substrate;
a conductive layer interposed between the first substrate and the second substrate, wherein the conductive layer physically contacts the electrically conductive ground structure;
a third substrate electrically coupled to the second substrate through the electrically conductive ground structure; and
a conductive plug extending through the first substrate to the conductive layer, wherein the conductive layer extends continuously from the conductive plug to the electrically conductive ground structure.
1 Assignment
0 Petitions
Accused Products
Abstract
A cap and substrate having an electrical connection at a wafer level includes providing a substrate and forming an electrically conductive ground structure in the substrate and electrically coupled to the substrate. An electrically conductive path to the ground structure is formed in the substrate. A top cap is then provided, wherein the top cap includes an electrically conductive surface. The top cap is bonded to the substrate so that the electrically conductive surface of the top cap is electrically coupled to the path to the ground structure.
16 Citations
20 Claims
-
1. A device comprising:
-
an electrically conductive ground structure disposed in a first substrate, wherein the electrically conductive ground structure extends completely through the first substrate to a second substrate such that the electrically conductive ground structure physically contacts the second substrate; a conductive layer interposed between the first substrate and the second substrate, wherein the conductive layer physically contacts the electrically conductive ground structure; a third substrate electrically coupled to the second substrate through the electrically conductive ground structure; and a conductive plug extending through the first substrate to the conductive layer, wherein the conductive layer extends continuously from the conductive plug to the electrically conductive ground structure. - View Dependent Claims (2, 3, 4, 5, 13, 14)
-
-
6. A device comprising:
-
a conductive ground structure disposed in a first semiconductor substrate, wherein the conductive ground structure extends through the first semiconductor substrate to a second semiconductor substrate such that the conductive ground structure physically contacts the second semiconductor substrate; a conductive layer disposed between the first and second semiconductor substrates; a conductive plug extending through the first substrate to the conductive layer such that the conductive plug physically contacts the conductive layer; another conductive plug extending through the first semiconductor substrate to the conductive layer such that the another conductive plug physically contacts the conductive layer; and a microelectromechanical system disposed within the first semiconductor substrate between the conductive plug and the another conductive plug. - View Dependent Claims (7, 8, 9, 10, 11, 12)
-
-
15. A device comprising:
-
a conductive ground structure disposed in a first substrate, wherein the conductive ground structure extends through the first substrate to a second substrate such that the conductive ground structure physically contacts the second substrate; a conductive layer interposed between the first substrate and the second substrate, wherein the conductive layer physically contacts the conductive ground structure; a third substrate electrically coupled to the second substrate through the conductive ground structure; a first conductive plug extending through the first substrate to the conductive layer such that the first conductive plug physically contacts the conductive layer; a microelectromechanical system disposed within the first semiconductor substrate between the first conductive plug and the conductive ground structure. - View Dependent Claims (16, 17, 18, 19, 20)
-
Specification