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Cap and substrate electrical connection at wafer level

  • US 9,834,436 B2
  • Filed: 12/14/2015
  • Issued: 12/05/2017
  • Est. Priority Date: 07/15/2009
  • Status: Active Grant
First Claim
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1. A device comprising:

  • an electrically conductive ground structure disposed in a first substrate, wherein the electrically conductive ground structure extends completely through the first substrate to a second substrate such that the electrically conductive ground structure physically contacts the second substrate;

    a conductive layer interposed between the first substrate and the second substrate, wherein the conductive layer physically contacts the electrically conductive ground structure;

    a third substrate electrically coupled to the second substrate through the electrically conductive ground structure; and

    a conductive plug extending through the first substrate to the conductive layer, wherein the conductive layer extends continuously from the conductive plug to the electrically conductive ground structure.

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