Optoelectronic component and method for the production thereof

• US 9,835,303 B2
• Filed: 12/17/2013
• Issued: 12/05/2017
• Est. Priority Date: 12/21/2012
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Herrmann, Siegfried, Wegleiter, Walter, Pll, Andreas
• Primary Examiner(s): Haupt, Kristy A
• Application Number:
  US14/654,538
• Publication Number:
  US 20150345727A1
• Time in Patent Office: 1,449 Days
• Field of Search: None
• CPC Class Codes: F21S 41/151 arranged in one or more lines
• CPC Class Codes: F21S 41/192 Details of lamp holders, terminals or connectors
• CPC Class Codes: F21S 43/14 Light emitting diodes [LED]
• CPC Class Codes: F21S 43/195 Details of lamp holders, terminals or connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/1034 Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB tab H05K2201/0397
• CPC Class Codes: H05K 2201/10409 Screws
• CPC Class Codes: H05K 2201/10924 Leads formed from a punched metal foil affixing a prefabricated self-supporting metal foil pattern H05K3/202
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: Y10T 29/49131 by utilizing optical sighting device

Abstract

An optoelectronic device and a method for producing an optoelectronic device are disclosed. An embodiment of an optoelectronic device includes a carrier, an electrically conductive layer arranged on the carrier, at least one semiconductor chip comprising an active layer for generating electromagnetic radiation, wherein the semiconductor chip is electrically conductively and mechanically connected with the carrier via the electrically conductive layer. The device further comprises a holder, wherein a surface of the carrier remote from the semiconductor chip is arranged on the holder, wherein the carrier is mechanically connected with the holder by at least one fastening element and is fastened to the holder, wherein the fastening element passes completely through the carrier, and wherein the semiconductor chip is electrically conductively connected to the holder by the fastening element.

Claims

1. An optoelectronic device comprising:

a carrier;

an electrically conductive layer with an n-conductive region and a p-conductive region arranged on the carrier;

at least one semiconductor chip comprising an active layer for generating electromagnetic radiation, wherein the semiconductor chip is electrically conductively and mechanically connected with the carrier via the electrically conductive layer; and

a holder comprising at least one n-side contact region, at least one p-side contact region and a main body,

wherein both the contact regions are electrically insulated from the main body and from another,

wherein the main body is in direct contact with the carrier,

wherein a surface of the carrier remote from the semiconductor chip is arranged on the holder,

wherein the carrier is mechanically connected with the holder by at least two fastening elements and is fastened to the holder,

wherein the fastening elements pass completely through the carrier, and

wherein the n-conductive region is electrically connected to the n-side contact region via a first fastening element and the p-conductive region is electrically connected to the p-side contact region via a second fastening element.

2. The device according to claim 1, wherein the device comprises a connection between the at least one semiconductor chip and the carrier, wherein the connection proceeds between spatially insulated contact regions of the same polarity of the device solely at the surface of the carrier facing the semiconductor chip.

3. The device according to claim 1, wherein the device comprises two or more fastening elements, wherein the carrier comprises openings, wherein the openings pass completely through the carrier, wherein the openings are electrically insulated from one another, and wherein the respective fastening element is introduced at least partly into the respective opening.

4. The device according to claim 1, wherein a first end region of the fastening element projects out of the carrier at a surface of the carrier remote from the holder, and wherein a second end region of the fastening element projects out of the carrier at a surface of the carrier facing the holder.

5. The device according to claim 4, wherein the second end region of the fastening element passes at least partly through the holder.

6. The device according to claim 5, wherein the holder comprises a contact region, into which the second end region of the fastening element projects.

7. The device according to claim 4, wherein the holder comprises at least one n-side contact region, at least one p-side contact region and a main body, wherein the n-side contact region and the p-side contact region are electrically insulated from the main body and from one another, and wherein the second end region of the fastening element is electrically conductively connected with the respective contact region.

8. The device according to claim 7, wherein the electrically conductive layer comprises an n-conductive region which is connected to the n-side contact region via the fastening element, wherein the electrically conductive layer comprises a p-conductive region which is connected to the p-side contact region via a further fastening element, and wherein the n-conductive region and the p-conductive region of the electrically conductive layer are electrically insulated from one another.

9. The device according to claim 1, wherein the fastening element comprises a screw, a nail, a retaining pin or a rivet.

10. The device according to claim 1, wherein the fastening element comprises an insulation at least in a sub-region.

11. The device according to claim 1, wherein the fastening element consists of a metal or comprises at least one metal.

12. The device according to claim 1, wherein the carrier contains a silicon nitride ceramic or consists thereof.

13. A method for producing the optoelectronic device according to claim 1, the method comprising:

providing the carrier with openings;

forming the electrically conductive layer on the carrier;

arranging the at least one semiconductor chip on the carrier, wherein the semiconductor chip is electrically conductively connected with the electrically conductive layer;

arranging the carrier on the holder; and

fastening the carrier on the holder with fastening elements for mechanical connection of the carrier to the holder and for electrical contacting of the semiconductor chip.

14. The method according to claim 13, wherein fastening the carrier on the holder comprises guiding the fastening elements through the openings.

15. The method according to claim 13, further comprising removing a growth substrate from a surface of the semiconductor chip remote from the carrier.

16. A headlamp comprising:

an optoelectronic device according to claim 1; and

an optical element arranged downstream of the optoelectronic device in an emission direction.

17. The device according to claim 1, wherein a surface of the holder facing the carrier is of convex construction thereby providing thermal coupling to the carrier through pretension.

18. The device according to claim 1, wherein the holder comprises a metal, and wherein the holder is a heat sink for the device.

19. An optoelectronic device comprising:

a carrier;

an electrically conductive layer with an n-conductive region and a p-conductive region arranged on the carrier;

at least one semiconductor chip comprising an active layer for generating electromagnetic radiation, wherein the semiconductor chip is electrically conductively and mechanically connected with the carrier via the electrically conductive layer; and

a holder comprising at least one n-side contact region, at least one p-side contact region and a main body,

wherein both the contact regions are electrically insulated from the main body and from another,

wherein the main body is arranged between the contact regions and mechanically connects the contact regions,

wherein the main body is in direct contact with the carrier so that there is no gap between the main body and the carrier,

wherein a surface of the carrier remote from the semiconductor chip is arranged on the holder,

wherein the carrier is mechanically connected with the holder by at least two fastening elements and is fastened to the holder,

wherein the fastening elements pass completely through the carrier, and

wherein the n-conductive region is electrically connected to the n-side contact region via a first fastening element and the p-conductive region is electrically connected to the p-side contact region via a second fastening element.

20. The device according to claim 19, wherein a surface of the holder facing the carrier is of convex construction.

21. The device according to claim 20, wherein the holder comprises a metal, and wherein the holder is a heat sink for the device.