Chemical sensor with protruded sensor surface

• US 9,835,585 B2
• Filed: 03/05/2014
• Issued: 12/05/2017
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: Life Technologies Corporation (Thermo Fisher Scientific Incorporated)
• Original Assignee: Life Technologies Corporation (Thermo Fisher Scientific Incorporated)
• Inventors: Fife, Keith G., Owens, Jordan, Li, Shifeng, Bustillo, James
• Primary Examiner(s): Kebede, Brook
• Application Number:
  US14/197,741
• Publication Number:
  US 20140264322A1
• Time in Patent Office: 1,371 Days
• Field of Search: 438 49, 257 43, 257414
• CPC Class Codes: G01N 27/4145 specially adapted for biomolecules, e.g. gate electrode with immobilised receptors

Abstract

In one implementation, a chemical sensor is described. The chemical sensor includes a chemically-sensitive field effect transistor including a floating gate conductor having an upper surface. A conductive element protrudes from the upper surface of the floating gate conductor into an opening. A dielectric material defines a reaction region. The reaction region overlies and extends below an upper surface of the conductive element.

Claims

1. A chemical sensor, comprising:

a chemically-sensitive field effect transistor including a floating gate conductor having an upper surface;

a conductive element protruding from the upper surface of the floating gate conductor;

a dielectric material defining a reaction region, the reaction region overlying and extending below an upper surface of the conductive element.

2. The chemical sensor of claim 1, wherein the conductive element has a width less than a width of the reaction region.

3. The chemical sensor of claim 1, wherein the upper surface of the conductive element is below an upper surface of the dielectric material.

4. The chemical sensor of claim 1, wherein the dielectric material includes a first layer and a second layer on the first layer, and the conductive element extends from the upper surface of the floating gate conductor a distance defined by a thickness of the first layer.

5. The chemical sensor of claim 1, wherein the conductive element comprises an electrically conductive material, and an upper surface of the conductive element includes an oxide of the electrically conductive material.

6. The chemical sensor of claim 1, further comprising a layer of sensing material on the conductive element.

7. The chemical sensor of claim 6, wherein the sensing material comprises a metal-oxide.

8. The chemical sensor of claim 6, wherein the sensing material is sensitive to hydrogen ions.

9. The chemical sensor of claim 1, wherein the chemically-sensitive field effect transistor includes a floating gate structure comprising a plurality of conductors electrically coupled to one another and separated by dielectric layers, and the floating gate conductor is an uppermost conductor in the plurality of conductors.

10. The chemical sensor of claim 1, wherein the chemically-sensitive field effect transistor generates a sensor signal in response to a chemical reaction occurring proximate to the conductive element.

11. The chemical sensor of claim 1, further comprising:

a microfluidic structure in fluid flow communication with the chemically-sensitive field effect transistor, and arranged to deliver analytes for sequencing.

12. A method for manufacturing a chemical sensor, the method comprising:

forming a chemically-sensitive field effect transistor including a floating gate conductor having an upper surface;

forming a conductive element protruding from the upper surface of the floating gate conductor; and

forming a dielectric material defining a reaction region overlying and extending below an upper surface of the conductive element.

13. The method of claim 12, wherein forming the dielectric material and forming the conductive element comprise:

forming a first dielectric material on the upper surface of the floating gate, the first dielectric defining a cavity extending to the upper surface of the floating gate conductor;

forming the conductive element within the cavity;

forming a second dielectric material on the conductive element and the first dielectric; and

etching the first and second dielectric material to expose the conductive element and define the reaction region.

14. The method of claim 13, wherein the forming the conductive element within the cavity comprises:

depositing a conductive material on an upper surface of the first dielectric and filling the cavity; and

removing at least a portion of the conductive from the upper surface of the dielectric.

15. The method of claim 14, wherein removing at least the portion of the conductive material comprises performing a planarization process to expose the upper surface of the first dielectric.

16. The method of claim 12, wherein the reaction region surrounds an outer surface of the conductive element.

17. The method of claim 12, wherein the dielectric material contacts a lower portion of an outer surface of the conductive element.