High current, low equivalent series resistance printed circuit board coil for power transfer application
First Claim
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1. A smartphone phone, comprising:
- a housing;
a screen;
an antenna circuit;
a battery; and
a wireless charging circuit including a layered structure of electric conductors on a printed circuit board (PCB), wherein the layered structure comprises;
a first layer of the electric conductors, the first layer of the electric conductors forming an electrically conductive trace comprising a plurality of loops;
a second layer of the electric conductors substantially overlaid with the first layer of the electric conductors; and
a plurality of vias disposed between the first layer and the second layer, wherein the plurality of the vias include a first via, a second via and a third via distributed separately along a length of the trace, each of the first via, the second via and the third via electrically connecting the trace of the first layer and the second layer of the conductors, wherein the second via is positioned between the first via and the third via along the length of the trace, and wherein thickness of the smartphone is less than 1 centimeter.
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Abstract
An apparatus for a multilayer printed circuit board (PCB) coil, comprising: a first coil layer of a PCB; a plurality of vias coupled to and distributed to cover substantially the surface of the first coil layer within the PCB; and a second coil layer of the PCB and coupled to the vias to cover substantially the surface of the second coil layer, wherein the vias are positioned between the first coil layer and the second coil layer and enable substantially high current and low equivalent series resistance (ESR) for the multilayer PCB coil.
22 Citations
12 Claims
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1. A smartphone phone, comprising:
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a housing; a screen; an antenna circuit; a battery; and a wireless charging circuit including a layered structure of electric conductors on a printed circuit board (PCB), wherein the layered structure comprises; a first layer of the electric conductors, the first layer of the electric conductors forming an electrically conductive trace comprising a plurality of loops; a second layer of the electric conductors substantially overlaid with the first layer of the electric conductors; and a plurality of vias disposed between the first layer and the second layer, wherein the plurality of the vias include a first via, a second via and a third via distributed separately along a length of the trace, each of the first via, the second via and the third via electrically connecting the trace of the first layer and the second layer of the conductors, wherein the second via is positioned between the first via and the third via along the length of the trace, and wherein thickness of the smartphone is less than 1 centimeter. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification