Systems and methods for creating fluidic assembly structures on a substrate
First Claim
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1. An assembly panel, the panel comprising:
- a substrate having a top surface;
an electronics structure layer disposed over the top layer of the substrate;
a sol-gel based structural layer disposed over the top layer of the substrate and the electronics structure layer, wherein the sol-gel based structural layer includes openings exposing at least a part of the electronics structure layer; and
wherein the sol-gel based structural layer is formed of a material including at least two materials selected from a group consisting of;
hydroxy(polydimethylsiloxane), methyltriethoxysilane, phenyltriethoxysilane, tetraethylorthosilicate, water, and octyltrichlorosilane.
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Abstract
Embodiments are related to fluidic assembly and, more particularly, to systems and methods for forming physical structures on a substrate.
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Citations
42 Claims
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1. An assembly panel, the panel comprising:
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a substrate having a top surface; an electronics structure layer disposed over the top layer of the substrate; a sol-gel based structural layer disposed over the top layer of the substrate and the electronics structure layer, wherein the sol-gel based structural layer includes openings exposing at least a part of the electronics structure layer; and wherein the sol-gel based structural layer is formed of a material including at least two materials selected from a group consisting of;
hydroxy(polydimethylsiloxane), methyltriethoxysilane, phenyltriethoxysilane, tetraethylorthosilicate, water, and octyltrichlorosilane. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for manufacturing a device, the method comprising:
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providing a substrate; and forming a sol-gel based structural layer over the substrate using a solution-based process, wherein the sol-gel structural layer includes features having varying feature depths. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. An electronic display device, the display device comprising:
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a substrate; an electronics structure layer formed over the substrate and including a first electrically conductive trace; a sol-gel based structural layer formed over the substrate such that the sol-gel based structural layer covers a first portion of the electronics structure layer, wherein the sol-gel structural layer includes openings though which a second portion of the electronics structure layer is exposed, and wherein the first electrically conductive trace electrically connects the bottom of at least two of the openings; light emitting diodes each within a respective one of the openings, wherein the light emitting diodes each include an upper electrical contact and a lower electrical contact, and wherein the lower electrical contact of a subset of the light emitting diodes is electrically connected to the first electrically conductive trace; an encapsulation layer covering at least a portion of the sol-gel based structural layer and micro-devices; and a second electrically conductive trace electrically connecting the upper electrical contacts of two or more of the light emitting diodes. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28)
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29. An assembly panel, the panel comprising:
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a substrate having a top surface; a sol-gel based structural layer disposed adjacent to the top surface of the substrate; an electronics structure layer disposed over the sol-gel based structural layer such that the electronics structure layer is separated from the substrate by the sol-gel structural layer; and wherein no electronics exist between the sol-gel based structural layer and the top surface of the substrate. - View Dependent Claims (30, 31, 32, 33)
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34. An assembly panel, the assembly panel comprising:
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a substrate; and a solution-based structural layer disposed over the substrate having a thermal excursion capability of greater than three hundred degrees Celsius, an optical transmission of greater than eighty percent, a thickness of greater than two micrometers, and a Youngs modulus of greater than 20 GPa. - View Dependent Claims (35, 36, 37)
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38. An assembly panel, the panel comprising:
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a substrate having a top surface; an electronics structure layer disposed over the top layer of the substrate; a sol-gel based structural layer disposed over the top layer of the substrate and the electronics structure layer, wherein the sol-gel based structural layer includes openings exposing at least a part of the electronics structure layer; and wherein the sol-gel based structural layer is formed of a material including at least two materials selected from a group consisting of;
a silane, a silicate, and water. - View Dependent Claims (39)
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40. An assembly panel, the panel comprising:
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a substrate having a top surface; an electronics structure layer disposed over the top layer of the substrate; a sol-gel based structural layer disposed over the top layer of the substrate and the electronics structure layer, wherein the sol-gel based structural layer includes openings exposing at least a part of the electronics structure layer; and wherein vias extend through the substrate from the bottom of a subset of the openings. - View Dependent Claims (41, 42)
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Specification