Production method for group III nitride semiconductor and group III nitride semiconductor
First Claim
1. A method for producing a Group III nitride semiconductor comprising:
- forming mesas and dents on a main surface of a substrate by processing the substrate, the mesas and dents being made of material of the substrate as one body; and
growing Group III nitride semiconductor in a c-axis direction of the Group III nitride semiconductor on the top surfaces of the mesas and the bottom surfaces of the dents, whereinthe substrate consists of one member selected from a group consisting of sapphire, SiC, Si and ZnO, andside surfaces of the mesas and the dents are formed so as to satisfy the following conditions;
a plane, which is most parallel to the side surfaces among low-index planes of the growing Group III nitride semiconductor, is a m-plane (1-100); and
when a projected vector obtained by orthogonally projecting a normal vector of the side surface to the main surface is defined as a lateral vector, an angle formed by the lateral vector and a projected vector obtained by orthogonally projecting a normal vector of the m-plane of the growing Group III nitride semiconductor to the main surface is 0.5°
or more and 6°
or less.
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Abstract
A method for producing a Group III nitride semiconductor comprising forming mesas on a main surface of a substrate, and growing Group III nitride semiconductor in a c-axis direction thereof, wherein the plane most parallel to the side surfaces of the mesas or the dents among the low-index planes of growing Group III nitride semiconductor is a m-plane (1-100), and when a projected vector obtained by orthogonally projecting a normal vector of the processed side surface to the main surface is defined as a lateral vector, an angle between the lateral vector and a projected vector obtained by orthogonally projecting a normal vector of the m-plane of the growing Group III nitride semiconductor to the main surface is 0.5° or more and 6° or less.
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Citations
34 Claims
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1. A method for producing a Group III nitride semiconductor comprising:
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forming mesas and dents on a main surface of a substrate by processing the substrate, the mesas and dents being made of material of the substrate as one body; and growing Group III nitride semiconductor in a c-axis direction of the Group III nitride semiconductor on the top surfaces of the mesas and the bottom surfaces of the dents, wherein the substrate consists of one member selected from a group consisting of sapphire, SiC, Si and ZnO, and side surfaces of the mesas and the dents are formed so as to satisfy the following conditions; a plane, which is most parallel to the side surfaces among low-index planes of the growing Group III nitride semiconductor, is a m-plane (1-100); and when a projected vector obtained by orthogonally projecting a normal vector of the side surface to the main surface is defined as a lateral vector, an angle formed by the lateral vector and a projected vector obtained by orthogonally projecting a normal vector of the m-plane of the growing Group III nitride semiconductor to the main surface is 0.5°
or more and 6°
or less. - View Dependent Claims (7, 10, 11, 12, 13, 14)
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2. A method for producing a Group III nitride semiconductor comprising:
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forming mesas and dents on a main surface of a substrate by processing the substrate, the mesas and dents being made of material of the substrate as one body; and growing Group III nitride semiconductor in a c-axis direction of the Group III nitride semiconductor on the top surfaces of the mesas and the bottom surfaces of the dents, wherein the substrate comprises a hexagonal crystal structure comprising different material from the Group III nitride semiconductor, the main surface of the substrate is a c-plane (0001) of hexagonal crystal, and side surfaces of the mesas and the dents are formed so as to satisfy the following conditions; a plane, which is most parallel to the side surfaces among low-index planes of the growing Group III nitride semiconductor, is a m-plane (1-100); and when a projected vector obtained by orthogonally projecting a normal vector of the side surface to the main surface is defined as a lateral vector, an angle formed by the lateral vector and a projected vector obtained by orthogonally projecting a normal vector of an a-plane (11-20) of the hexagonal crystal structure of the substrate to the main surface is 0.5°
or more, and 6°
or less. - View Dependent Claims (5, 8)
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3. A method for producing a Group III nitride semiconductor comprising:
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forming mesas and dents on a main surface of a substrate by processing the substrate, the mesas and dents being made of material of the substrate as one body; and growing Group III nitride semiconductor in a c-axis direction of the Group III nitride semiconductor on the top surfaces of the mesas and the bottom surfaces of the dents, wherein the substrate comprises a hexagonal crystal structure comprising different material from the Group III nitride semiconductor, the main surface of the substrate is an a-plane (11-20) of hexagonal crystal, and side surfaces of the mesas and the dents are formed so as to satisfy the following conditions; a plane, which is most parallel to the side surfaces among low-index planes of the growing Group III nitride semiconductor, is a m-plane (1-100); and when a projected vector obtained by orthogonally projecting a normal vector of the side surface to the main surface is defined as a lateral vector, an angle formed by the lateral vector and a projected vector obtained by orthogonally projecting a normal vector of a c-plane (0001) of the hexagonal crystal structure of the substrate to the main surface is 0.5°
or more, and 6°
or less. - View Dependent Claims (6, 9)
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4. A method for producing a Group III nitride semiconductor comprising:
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forming mesas and dents on a main surface of a substrate by etching the substrate, the mesas and dents being made of material of the substrate as one body; and growing Group III nitride semiconductor in a c-axis direction of the Group III nitride semiconductor on the top surfaces of the mesas and the bottom surfaces of the dents, wherein at least a portion on which the mesas and the dents are formed on the main surface of the substrate comprises a Group III nitride semiconductor, the main surface of the substrate is a c-plane (0001) of the Group III nitride semiconductor, and side surfaces of the mesas and the dents are formed so as to satisfy the following conditions; a plane, which is most parallel to the side surfaces among low-index planes of the growing Group III nitride semiconductor, is a m-plane (1-100); and when a projected vector obtained by orthogonally projecting a normal vector of the side surface to the main surface is defined as a lateral vector, an angle formed by the lateral vector and a projected vector obtained by orthogonally projecting a normal vector of a m-plane (1-100) of the Group III nitride semiconductor of the substrate to the main surface is 0.5°
or more, and 6°
or less, andwherein the growing of the Group III nitride semiconductor comprises facet growing the Group III nitride semiconductor on the substrate on the top surface of the mesa and the bottom surface of the dent and burying a space among the facets.
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15. A Group III nitride semiconductor having a substrate with mesas and dents formed on a main surface thereof by processing the substrate, and grown on the top surfaces of the mesas and the bottom surfaces of the dents in a c-axis direction of the Group III nitride semiconductor, the mesas and dents being made of material of the substrate as one body, wherein
the substrate consists of one member selected from a group consisting of sapphire, SiC, Si and ZnO, side surfaces of the mesas and the dents are formed so as to satisfy the following conditions: -
a plane, which is most parallel to the side surfaces among low-index planes of the growing Group III nitride semiconductor, is a m-plane (1-100); and when a projected vector obtained by orthogonally projecting a normal vector of the side surface to the main surface is defined as a lateral vector, an angle formed by the lateral vector and a projected vector obtained by orthogonally projecting a normal vector of the m-plane of the growing Group III nitride semiconductor to the main surface is 0.5°
or more and 6°
or less. - View Dependent Claims (19, 20, 21, 22, 23, 24)
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16. A Group III nitride semiconductor having a substrate with mesas and dents formed on a main surface thereof by processing the substrate, the mesas and dents being made of material of the substrate as one body, and grown on the top surfaces of the mesas and the bottom surfaces of the dents in a c-axis direction of the Group III nitride semiconductor, wherein,
the substrate comprises a hexagonal crystal substrate comprising different material from the Group III nitride semiconductor, the main surface of the substrate is a c-plane (0001) of hexagonal crystal, and side surfaces of the mesas and the dents are formed so as to satisfy the following conditions: -
a plane, which is most parallel to the side surfaces among low-index planes of the growing Group III nitride semiconductor, is a m-plane (1-100); and when a projected vector obtained by orthogonally projecting a normal vector of the side surface to the main surface is defined as a lateral vector, an angle formed by the lateral vector and a projected vector obtained by orthogonally projecting a normal vector of an a-plane (11-20) of the hexagonal crystal structure of the substrate to the main surface is 0.5°
or more, and 6°
or less. - View Dependent Claims (25, 27, 30, 33)
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17. A Group III nitride semiconductor having a substrate with mesas and dents formed on a main surface thereof by processing the substrate, the mesas and dents being made of material of the substrate as one body, and grown on the top surfaces of the mesas and the bottom surfaces of the dents in a c-axis direction of the Group III nitride semiconductor, wherein,
the substrate comprises a hexagonal crystal substrate comprising different material from the Group III nitride semiconductor, a main surface of the substrate is an a-plane (11-20) of hexagonal crystal, and side surfaces of the mesas and the dents are formed so as to satisfy the following conditions: -
a plane, which is most parallel to the side surfaces among low-index planes of the growing Group III nitride semiconductor, is a m-plane (1-100); and when a projected vector obtained by orthogonally projecting a normal vector of the side surface to the main surface is defined as a lateral vector, an angle formed by the lateral vector and a projected vector obtained by orthogonally projecting a normal vector of a c-plane (0001) of the hexagonal crystal structure of the substrate to the main surface is 0.5°
or more, and 6°
or less. - View Dependent Claims (26, 28, 31, 34)
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18. A Group III nitride semiconductor having a substrate with mesas and dents formed on a main surface thereof by etching the substrate, the mesas and dents being made of material of the substrate as one body, and grown on the top surfaces of the mesas and the bottom surfaces of the dents in a c-axis direction of the Group III nitride semiconductor, wherein
at least a portion on which the mesas and the dents are formed on the main surface of the substrate comprises a Group III nitride semiconductor, the main surface of the substrate is a c-plane (0001) of the Group III nitride semiconductor of the substrate, and side surfaces of the mesas and the dents are formed so as to satisfy the following conditions: -
a plane, which is most parallel to the side surfaces among low-index planes of the growing Group III nitride semiconductor, is a m-plane (1-100); and when a projected vector obtained by orthogonally projecting a normal vector of the side surface to the main surface is defined as a lateral vector, an angle formed by the lateral vector and a projected vector obtained by orthogonally projecting a normal vector of a m-plane (1-100) of the Group III nitride semiconductor of the substrate to the main surface is 0.5°
or more, and whereinthe Group III nitride semiconductor on the substrate comprises facet parts facet grown on the top surface of the mesa and the bottom surface of the dent and buried parts in a space among the facets. - View Dependent Claims (29, 32)
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Specification