Semiconductor device
First Claim
Patent Images
1. A semiconductor device comprising:
- a semiconductor layer made of SiC, the semiconductor layer having a front surface and a back surface;
a transistor element having an impurity region formed in a front surface portion of the semiconductor layer;
a first contact wiring formed on a back surface portion of the semiconductor layer, the first contact wiring defining one electrode electrically connected to the transistor element; and
a second contact wiring formed on the front surface portion of the semiconductor layer, the second contact wiring defining another electrode electrically connected to the transistor element;
whereinthe first contact wiring has a first wiring layer forming an ohmic contact with the semiconductor layer without a silicide contact and a second wiring layer formed on the first wiring layer, the second wiring layer having no silicide portion and having a resistivity lower than that of the first wiring layer, andthe second contact wiring has a third wiring layer forming an ohmic contact with the semiconductor layer without a silicide contact and a fourth wiring layer formed on the third wiring layer and having a resistivity lower than that of the third wiring layer.
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Abstract
A semiconductor device includes a semiconductor layer made of SiC. A transistor element having an impurity region is formed in a front surface portion of the semiconductor layer. A first contact wiring is formed on a back surface portion of the semiconductor layer, and defines one electrode electrically connected to the transistor element. The first contact wiring has a first wiring layer forming an ohmic contact with the semiconductor layer without a silicide contact and a second wiring layer formed on the first wiring layer and having a resistivity lower than that of the first wiring layer.
90 Citations
18 Claims
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1. A semiconductor device comprising:
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a semiconductor layer made of SiC, the semiconductor layer having a front surface and a back surface; a transistor element having an impurity region formed in a front surface portion of the semiconductor layer; a first contact wiring formed on a back surface portion of the semiconductor layer, the first contact wiring defining one electrode electrically connected to the transistor element; and a second contact wiring formed on the front surface portion of the semiconductor layer, the second contact wiring defining another electrode electrically connected to the transistor element; wherein the first contact wiring has a first wiring layer forming an ohmic contact with the semiconductor layer without a silicide contact and a second wiring layer formed on the first wiring layer, the second wiring layer having no silicide portion and having a resistivity lower than that of the first wiring layer, and the second contact wiring has a third wiring layer forming an ohmic contact with the semiconductor layer without a silicide contact and a fourth wiring layer formed on the third wiring layer and having a resistivity lower than that of the third wiring layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification