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Light emitting diode package and method of manufacture

  • US 9,837,583 B2
  • Filed: 01/07/2015
  • Issued: 12/05/2017
  • Est. Priority Date: 03/06/2011
  • Status: Active Grant
First Claim
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1. A light emitting device, comprising:

  • an optically transparent cover substrate;

    an optically transparent layer contacting a bottom surface of said optically transparent cover substrate, said optically transparent layer including an optically definable material wherein said optically definable material is disposed in a portion of said optically transparent layer;

    a semiconductor LED including a LED carrier layer, a positively-doped region, an intrinsic region, and a negatively-doped region, wherein said intrinsic region is between said positively-doped region and said negatively-doped region, said LED carrier layer disposed on said negatively-doped region, said LED carrier layer contacting a first portion of a bottom surface of said optically transparent layer;

    a passivation layer disposed on said semiconductor LED and on an exposed portion of said bottom surface of said optically transparent layer;

    a first electrical contact disposed in a first contact hole defined in said passivation layer, said first electrical contact in electrical communication with said positively-doped region; and

    a second electrical contact disposed in a second contact hole defined in said passivation layer and said semiconductor LED, said second electrical contact in electrical communication with said negatively-doped region,wherein a first surface of said semiconductor LED has a first length along a horizontal axis, said horizontal axis parallel to said first surface of said semiconductor LED, andwherein said portion of said optically transparent layer has a second length with respect to said horizontal axis, said second length less than said first length.

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