Prosthetic component having a compliant surface

• US 9,839,390 B2
• Filed: 01/13/2014
• Issued: 12/12/2017
• Est. Priority Date: 06/30/2009
• Status: Active Grant

• Current Assignee: Howmedica Osteonics Corp. (Stryker Corporation)
• Original Assignee: OrthoSensor, Inc (Stryker Corporation)
• Inventors: Stein, Marc, Chase, Andrew
• Primary Examiner(s): Caputo, Lisa
• Assistant Examiner(s): HERNANDEZ-PREWITT, ROGER G
• Application Number:
  US14/154,011
• Publication Number:
  US 20140135655A1
• Time in Patent Office: 1,429 Days
• Field of Search: 7337901, 600587, 623 1111, 623 1312, D24155
• CPC Class Codes: A61B 2560/0209 adapted for power saving
• CPC Class Codes: A61B 2562/0247 Pressure sensors
• CPC Class Codes: A61B 2562/0252 Load cells
• CPC Class Codes: A61B 5/0031 Implanted circuitry
• CPC Class Codes: A61B 5/01 Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue clinical contact thermometers G01K13/20
• CPC Class Codes: A61B 5/076 Permanent implantations telemetry using implanted circuitry A61B5/0031; implanted stimulators for therapy A61N1/3605, A61N1/362, A61N1/372
• CPC Class Codes: A61B 5/1032 Determining colour for diagnostic purposes measuring colour in general G01J3/46
• CPC Class Codes: A61B 5/1036 Measuring load distribution, e.g. podologic studies
• CPC Class Codes: A61B 5/4509 Bone density determination
• CPC Class Codes: A61B 5/4528 Joints A61B5/4533, A61B5/4538 take precedence
• CPC Class Codes: A61B 5/4571 Evaluating the hip
• CPC Class Codes: A61B 5/4585 Evaluating the knee
• CPC Class Codes: A61B 5/4851 Prosthesis assessment or monitoring
• CPC Class Codes: A61B 5/6846 specially adapted to be brought in contact with an internal body part, i.e. invasive
• CPC Class Codes: A61B 5/686 Permanently implanted devices, e.g. pacemakers, other stimulators, biochips A61B5/6861 takes precedence
• CPC Class Codes: A61B 5/7225 Details of analog processing, e.g. isolation amplifier, gain or sensitivity adjustment, filtering, baseline or drift compensation A61B5/30, A61B5/316 take precedence; transformers for specific applications H01F38/00; amplifiers H03F
• CPC Class Codes: A61F 2/389 Tibial components A61F2/3868 takes precedence
• CPC Class Codes: A61F 2/4657 Measuring instruments used for implanting artificial joints for surgical instruments A61B90/06
• CPC Class Codes: A61F 2/4684 Trial or dummy prostheses
• CPC Class Codes: A61F 2002/4666 for measuring force, pressure or mechanical tension
• CPC Class Codes: G01L 1/255 : using acoustic waves, or acoustic emission G01L1/10 and G01L1/16 take precedence

Abstract

A prosthetic component suitable for long-term implantation is provided. The prosthetic component measures a parameter of the muscular-skeletal system is disclosed. The prosthetic component comprises a first structure having at least one support surface, a second structure having at least one feature configured to couple to bone, and at least one sensor. The prosthetic component is a housing for the at least one sensor and electronic circuitry. The electronic circuitry is hermetically sealed from an external environment. The at least one sensor couples to the support surface of the first structure. The support surface of the first structure is compliant. The first and second structure are coupled together housing the at least one sensor and electronic circuitry.

Claims

1. A prosthetic component configured to measure load and position of load applied by the muscular-skeletal system comprising:

a first support structure;

electronic circuitry wherein the electronic circuitry is configured to control a measurement process and to transmit measurement data;

a plurality of load sensors;

an interconnect coupling the plurality of sensors to the electronic circuitry;

a second support structure coupled to the first support structure to form a hermetically sealed housing to isolate the electronic circuitry and the plurality of load sensors from an external environment wherein the plurality of sensors are integrated with the interconnect, and wherein the plurality of load sensors are configured to measure a load magnitude and position of load applied to the prosthetic component; and

a rigid load plate having a first surface and a second surface wherein the first surface of the rigid load plate is coupled to an interior surface of the second support structure, wherein the second surface of the rigid load plate couples to the plurality of load sensors, and wherein a portion of the interconnect is between the second surface of the rigid load plate and a first surface of the first support structure.

2. The prosthetic component of claim 1 wherein the interconnect comprises two or more dielectric layers and two or more patterned conductive layers.

3. The prosthetic component of claim 2 wherein at least one dielectric layer comprises polyimide.

4. The prosthetic component of claim 1 wherein a shield is formed in the interconnect to shield the plurality of load sensors or the interconnect.

5. The prosthetic component of claim 1 wherein the plurality of load sensors are elastically compressible capacitors.

6. The prosthetic component of claim 1 further including a load pad formed overlying each load sensor of the plurality of load sensors wherein the load pad does not compress under loading.

7. The prosthetic component of claim 6 wherein the load pad is conductive.

8. The prosthetic component of claim 6 wherein a surface of each load pad is approximately co-planar and couple to the second support structure.

9. A prosthetic component for the muscular-skeletal system comprising:

a first support structure;

electronic circuitry wherein the electronic circuitry is configured to control a measurement process and to transmit measurement data;

a plurality of sensors;

interconnect coupling the plurality of sensors to the electronic circuitry wherein the interconnect is flexible and comprises at least one polyimide dielectric layer;

a second support structure coupled to the first support structure to form a sealed housing to isolate the electronic circuitry and the plurality of sensors from an external environment wherein the plurality of sensors are integrated with the interconnect, and wherein the plurality of sensors are configured to measure a parameter; and

a rigid load plate having a first surface and a second surface wherein the first surface of the rigid load plate is coupled to an interior surface of the second support structure, wherein the second surface of the rigid load plate couples to the plurality of load sensors, and wherein a portion of the interconnect is between the second surface of the rigid load plate and a first surface of the first support structure.

10. The prosthetic component of claim 9 wherein the interconnect comprises two or more dielectric layers and two or more patterned conductive layers.

11. The prosthetic component of claim 9 wherein the interconnect comprises at least two dielectric layers of polyimide.

12. The prosthetic component of claim 9 wherein a shield is formed in the interconnect to shield the plurality of sensors or the interconnect.

13. The prosthetic component of claim 9 further including a load pad formed overlying each load sensor of the plurality of sensors wherein the load pad is non-compressible.

14. A tibial prosthetic component

a first support structure configured to couple to an insert;

electronic circuitry wherein the electronic circuitry is configured to control a measurement process and to transmit measurement data;

a plurality of load sensors;

interconnect coupling the plurality of load sensors to the electronic circuitry;

a second support structure configured to couple to a tibia wherein the second support structure is coupled to the first support structure to form a hermetically sealed housing to isolate the electronic circuitry and the plurality of load sensors from an external environment wherein the plurality of load sensors are integrated with the interconnect, and wherein the plurality of load sensors are configured to measure a parameter;

a rigid load plate having a first surface and a second surface wherein the first surface of the rigid load plate is coupled to an interior surface of the second support structure, wherein the second surface of the rigid load plate couples to the plurality of load sensors, and wherein a portion of the interconnect is between the second surface of the rigid load plate and a first surface of the first support structure;

a load pad formed overlying each load sensor of the plurality of load sensors wherein the load pad is non-compressible.

15. The tibial prosthetic component of claim 14 wherein the interconnect comprises two or more dielectric layers and two or more patterned conductive layers.

16. The tibial prosthetic component of claim 14 wherein at least one dielectric layer comprises polyimide.

17. The tibial prosthetic component of claim 14 wherein a shield is formed in the interconnect to shield the plurality of load sensors or the interconnect.