Apparatus for depositing a multilayer coating on discrete sheets

• US 9,839,940 B2
• Filed: 10/09/2013
• Issued: 12/12/2017
• Est. Priority Date: 04/15/2002
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Bonham, Charles C., Burrows, Paul E., Chu, Xi, Graff, Gordon Lee, Gross, Mark Edward, Martin, Peter Maclyn, Moro, Lorenza, Nelson, Kenneth Jeffrey, Pagano, John Chris, Zumhoff, Mac R.
• Primary Examiner(s): Moore, Karla
• Application Number:
  US14/049,560
• Publication Number:
  US 20140037845A1
• Time in Patent Office: 1,525 Days
• Field of Search: None
• CPC Class Codes: B05D 7/50 Multilayers
• CPC Class Codes: C23C 14/58 After-treatment
• CPC Class Codes: C23C 16/54 Apparatus specially adapted for continuous coating
• CPC Class Codes: H01L 21/67236 the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/164 using vacuum deposition
• CPC Class Codes: H10K 71/40 Thermal treatment, e.g. annealing in the presence of a solvent vapour

Abstract

A tool for depositing multilayer coatings onto a substrate. The tool includes a housing defining a vacuum chamber connected to a vacuum source, deposition stations each configured to deposit a layer of multilayer coating on the substrate, a curing station, and a contamination reduction device. At least one of the deposition stations is configured to deposit an inorganic layer, while at least one other deposition station is configured to deposit an organic layer. In one tool configuration, the substrate may travel back and forth through the tool as many times as needed to achieve the desired number of layers of multilayer coating. In another, the tool may include numerous housings adjacently spaced such that the substrate may make a single unidirectional pass. The contamination reduction device may be configured as one or more migration control chambers about at least one of the deposition stations, and further includes cooling devices, such as chillers, to reduce the presence of vaporous layer precursors. The tool is particularly well-suited to depositing multilayer coatings onto flexible substrates, as well as to encapsulating environmentally-sensitive devices placed on the flexible substrate.

Claims

1. A method of encapsulating an object disposed on a substrate, said method comprising:

configuring an encapsulation tool to comprise;

a proximal end configured to accept said substrate;

a distal end opposite said proximal end;

an accumulator cooperative with at least one of said proximal end and said distal end such that said accumulator contains a batch of said substrates at least before, after or between steps of deposition of a multilayer coating;

at least one surface treatment chamber comprising a thermal evaporation device configured to deposit a non-oxide material, said thermal evaporation device disposed in said accumulator and configured to enhance the ability of individual layers of said multilayer coating to adhere to said substrate or an adjacent layer; and

at least one housing disposed substantially between said proximal and distal ends, said housing defining a common vacuum and a substantially linear deposition path therein, said common vacuum configured to be coupled to a vacuum source and said substantially linear deposition path arranged to facilitate transport of said substrate through said housing, said housing comprising;

at least one transport means configured to convey said substrate along said substantially linear deposition path;

at least one organic layer deposition station configured to deposit at least one organic layer of a multilayer coating onto said substrate;

at least one curing station configured to cure an organic layer deposited by said organic layer deposition station;

at least one inorganic layer deposition station configured to deposit at least one inorganic layer of said multilayer coating onto said substrate; and

at least one contamination reduction device to control the migration of material making up said organic layer from said organic layer deposition station in which said material originated;

loading said substrate with said object disposed thereon into said housing;

providing at least a partial vacuum within said housing;

introducing a inorganic material into said inorganic layer deposition station;

depositing at least a portion of said inorganic material onto said substrate while said substrate is in said inorganic layer deposition station;

introducing an organic material into said organic layer deposition station;

depositing at least a portion of said organic material onto said substrate while said substrate is in said organic layer deposition station;

isolating excess said organic material to effect a reduction in organic material contamination; and

curing said deposited organic material.

2. The method according to claim 1, wherein said steps of depositing said organic and inorganic materials are repeated at least once.

3. The method according to claim 2, wherein said steps of depositing said organic and inorganic materials can be performed in any order.

4. The method according to claim 1, wherein said organic material is introduced into said organic layer deposition station in vapor form.

5. The method according to claim 4, wherein isolating excess organic material comprises chilling at least a portion of said organic layer deposition station such that at least a portion of said excess organic material in said vapor form condenses.

6. The method according to claim 4, wherein said organic material is deposited via flash evaporation.

7. The method according to claim 1, wherein said organic material is a polymer precursor.

8. The method according to claim 1, wherein said inorganic material is a ceramic.