Micromechanical component
First Claim
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1. A method for manufacturing a micromechanical component, the method comprising:
- providing a micro-electro-mechanical system (MEMS) wafer;
structuring the MEMS wafer proceeding from a surface of a second substrate layer of the MEMS wafer to form a second movable MEMS structure, the surface of the second substrate layer facing in a second direction, at least one electrically conducting connection being formed between a first substrate layer and the second substrate layer of the MEMS wafer;
providing a cap wafer;
joining the MEMS wafer to the cap wafer;
structuring the MEMS wafer proceeding from a surface of the first substrate layer of the MEMS wafer to form a first movable MEMS structure, the first movable MEMS structure and the second movable MEMS structure situated on top of one another at least in sections, the surface of the first substrate layer facing in a first direction substantially opposite to the second direction;
providing an application-specific integrated circuit (ASIC) wafer; and
joining the ASIC wafer to the joint of the MEMS wafer and the cap wafer.
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Abstract
A method for manufacturing a micromechanical component, including: providing a MEMS wafer; structuring the MEMS wafer proceeding from a surface of a second substrate layer of the MEMS wafer, at least one electrically conducting connection being formed between a first substrate layer and the second substrate layer of the MEMS wafer; providing a cap wafer; joining the MEMS wafer to the cap wafer; structuring the MEMS wafer proceeding from a surface of the first substrate layer of the MEMS wafer; providing an ASIC wafer; and joining the ASIC wafer to the joint of the MEMS wafer and the cap wafer.
7 Citations
17 Claims
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1. A method for manufacturing a micromechanical component, the method comprising:
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providing a micro-electro-mechanical system (MEMS) wafer; structuring the MEMS wafer proceeding from a surface of a second substrate layer of the MEMS wafer to form a second movable MEMS structure, the surface of the second substrate layer facing in a second direction, at least one electrically conducting connection being formed between a first substrate layer and the second substrate layer of the MEMS wafer; providing a cap wafer; joining the MEMS wafer to the cap wafer; structuring the MEMS wafer proceeding from a surface of the first substrate layer of the MEMS wafer to form a first movable MEMS structure, the first movable MEMS structure and the second movable MEMS structure situated on top of one another at least in sections, the surface of the first substrate layer facing in a first direction substantially opposite to the second direction; providing an application-specific integrated circuit (ASIC) wafer; and joining the ASIC wafer to the joint of the MEMS wafer and the cap wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A micromechanical component, comprising:
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a micro-electro-mechanical system (MEMS) wafer including at least two movable MEMS structures situated on top of one another at least in sections, a first of the MEMS structures being formed from a first substrate layer of the MEMS wafer and a second of the MEMS structures being formed from a second substrate layer of the MEMS wafer, the first substrate layer and the second substrate layer of the MEMS wafer being separated from each other by an insulating layer at least in sections and electrically conductively connected to one another at least in sections; an application-specific integrated circuit (ASIC) wafer, the MEMS wafer being functionally joined to the ASIC wafer; and a cap wafer to cap the ASIC wafer and the MEMS wafer. - View Dependent Claims (13, 14, 15, 16, 17)
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Specification