Touch panel and touch device including the same

• US 9,841,856 B2
• Filed: 05/12/2015
• Issued: 12/12/2017
• Est. Priority Date: 05/14/2014
• Status: Active Grant

• Current Assignee: LG Innotek Company Limited (LG Corporation)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Lee, Tae Jin
• Primary Examiner(s): Dharia, Prabodh M
• Application Number:
  US14/709,720
• Publication Number:
  US 20150331513A1
• Time in Patent Office: 945 Days
• Field of Search: 345156-184, 178 1806, 361749, 349 12
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 2203/04112 Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Abstract

A touch panel may include a substrate including a sensing area and a connecting area, a circuit pattern integrally formed on the substrate, and a driving chip on the connecting area of the substrate. The circuit pattern may include a sensing circuit pattern in the sensing area and a connecting circuit pattern in the connecting area. A width of the sensing area measured may be greater than a width of the connection area and the circuit pattern may extend from the sensing area to the connecting area. Moreover, the substrate may be a flexible substrate having a flexible characteristic.

Claims

1. A touch panel comprising:

a substrate comprising a sensing area and a connecting area;

a circuit pattern formed on the substrate; and

a driving chip on the connecting area of the substrate,

wherein the sensing area and the connecting area are provided on a same surface of the substrate,

wherein the connection area extends from one edge of the substrate and a width of the connection area is smaller than a width of the sensing area,

wherein the circuit pattern comprises;

a sensing circuit pattern in the sensing area; and

a connecting circuit pattern in the connecting area,

wherein the circuit pattern extends from the sensing area to the connecting area, and wherein the connecting circuit pattern is integrally formed with the sensing circuit pattern to extend from the sensing area to the connection area, tracing a distal side of the sensing area,

wherein the substrate is a flexible substrate including flexible plastic, and

wherein the circuit pattern and the driving chip are disposed on a same surface of the substrate.

2. The touch panel of claim 1, wherein the connecting area comprises:

a first connecting area adjacent to the sensing area;

arid

a second connecting area adjacent to the first connecting area, and

wherein the connecting circuit pattern is provided on the first connecting area, and the driving chip is provided on the second connecting area.

3. The touch panel of claim 2, wherein the driving circuit is mounted on the second connecting area.

4. The touch panel of claim 1, wherein the circuit pattern and the driving chip are provided on a same surface of the substrate.

5. The touch panel of claim 1, wherein the sensing circuit pattern, the connecting circuit pattern, and the driving chip are electrically connected with each other.

6. The touch panel of claim 5, wherein the connecting circuit pattern is directly connected with the driving chip.

7. The touch panel of claim 1, wherein one end of the connecting circuit pattern is connected with the sensing circuit pattern, and an opposite end to the one end is connected with the driving chip.

8. The touch panel of claim 1, wherein the sensing circuit pattern and the connecting circuit pattern include a same material.

9. The touch panel of claim 1, wherein the sensing circuit pattern includes a material different from a material of the connecting circuit pattern.

10. The touch panel of claim 9, wherein the sensing circuit pattern is transparent, and wherein the connecting circuit pattern includes an opaque material.

11. The touch panel of claim 1, wherein the sensing circuit pattern comprises a first sensing circuit pattern and a second sensing circuit pattern extending in mutually different directions.

12. The touch panel of claim 11, wherein at least one of the first and second sensing circuit patterns comprises a mesh-shaped pattern,

wherein the mesh-shaped pattern includes a line part and an opening part, and

wherein a line width of the line part is in the range of 0.1 μ

m to 10 μ

m.

13. The touch panel of claim 11, wherein the substrate comprises:

a first substrate on the cover substrate; and

a second substrate on the first substrate, and

wherein the first sensing circuit pattern is provided on the first substrate, and the second sensing circuit pattern is provided on the second substrate.

14. The touch panel of claim 1, further comprising a cover substrate on the substrate,

wherein the cover substrate includes a material the same as that of the substrate.

15. The touch panel of claim 14, wherein the substrate has an area wider than an area of the cover substrate,

wherein the sensing area overlaps with the cover substrate, and

wherein the connecting area is non-overlapping with the cover substrate.

16. A touch device comprising the touch panel according to claim 1;

and a display on the touch panel.

17. The touch device of claim 16, further comprising a clock.

18. The touch device of claim 16, wherein the display is provided on the sensing area.

19. The touch device of claim 16, wherein a touch is sensed in the display and at a peripheral portion of the display.

20. The touch panel of clam 2, wherein a width of the first connection area measured in one direction of the substrate is larger than a width of the second connecting area.