Heat spreading substrate with embedded interconnects

• US 9,842,745 B2
• Filed: 01/20/2015
• Issued: 12/12/2017
• Est. Priority Date: 02/17/2012
• Status: Active Grant

• Current Assignee: Invensas Corporation
• Original Assignee: Invensas Corporation
• Inventors: Mohammed, Ilyas, Beroz, Masud
• Primary Examiner(s): Syadian, Hrayr A
• Application Number:
  US14/600,595
• Publication Number:
  US 20150132894A1
• Time in Patent Office: 1,057 Days
• Field of Search: 438122
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 21/52 Mounting semiconductor bodies in containers
• CPC Class Codes: H01L 21/768 Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/142 Metallic substrates having insulating layers
• CPC Class Codes: H01L 23/49568 specifically adapted to facilitate heat dissipation
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01049 Indium [In]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/19107 : off-chip wires

Abstract

Heat spreading substrate with embedded interconnects. In an embodiment in accordance with the present invention, an apparatus includes a metal parallelepiped comprising a plurality of wires inside the metal parallelepiped. The plurality of wires have a different grain structure than the metal parallelepiped. The plurality of wires are electrically isolated from the metal parallelepiped. The plurality of wires may be electrically isolated from one another.

Claims

1. A method comprising:

wire bonding a plurality of wires to a substrate, said plurality of wires being a plurality of bond wires;

filling a volume with an electrically and thermally conductive material, wherein said volume is in contact with said substrate and comprises said plurality of wires,

wherein said electrically and thermally conductive material comprises a different grain structure from that of said plurality of wires.

2. The method of claim 1 further comprising coating said plurality of wires with a dielectric prior to said bonding.

3. The method of claim 1 further comprising placing a plurality of contacts on said substrate.

4. The method of claim 1 further comprising polishing a surface of said electrically and thermally conductive material to expose ends of said plurality of wires.

5. The method of claim 4 wherein said polishing electrically isolates at least two of said plurality of wires.

6. The method of claim 1 wherein said plurality of wires are electrically isolated from said electrically and thermally conductive material.

7. The method of claim 2 further comprising mounting an electronic device on a surface of said electrically and thermally conductive material.

8. The method of claim 7 wherein said electronic device comprises:

first and second differentiated electrical contacts;

wherein said first differentiated electrical contact is electrically coupled to one of said plurality of wires; and

wherein said second differentiated electrical contact is electrically coupled to said electrically and thermally conductive material.

9. The method of claim 8 further comprising:

wire bonding said first differentiated electrical contact to one of said plurality of wires.

10. The method of claim 8 further comprising:

surface mounting said second differentiated electrical contact to said electrically and thermally conductive material.

11. The method of claim 1 wherein said filling comprises placing an electrically and thermally conductive material on said substrate, wherein said electrically and thermally conductive material has pre-existing holes to accommodate ball bonds of said plurality of wires.