Intermediate structure for transfer, method for preparing micro-device for transfer, and method for processing array of semiconductor device

• US 9,842,782 B2
• Filed: 03/25/2016
• Issued: 12/12/2017
• Est. Priority Date: 03/25/2016
• Status: Active Grant

• Current Assignee: Mikro Mesa Technology Co., Ltd.
• Original Assignee: Mikro Mesa Technology Co., Ltd.
• Inventors: Chen, Li-Yi, Chang, Pei-Yu, Chan, Chih-Hui, Chang, Chun-Yi, Lin, Shih-Chyn, Lee, Hsin-Wei
• Primary Examiner(s): Lee, Cheung
• Application Number:
  US15/080,607
• Publication Number:
  US 20170278760A1
• Time in Patent Office: 627 Days
• Field of Search: None
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/67271 Sorting devices
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
• CPC Class Codes: H01L 22/22 Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement testing and repair of stores after manufacture including at wafer scale G11C29/00; fuses per se H01L23/525
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other

Abstract

A method for preparing a plurality of micro-devices for transfer includes temporarily bonding the micro-devices onto a carrier substrate; testing the micro-devices on the carrier substrate to determine if there is at least one first failed micro-device in the micro-devices; and removing the first failed micro-device from the carrier substrate.

Claims

1. A method for preparing a plurality of micro-devices for transfer, the method comprising:

temporarily bonding the micro-devices onto a carrier substrate;

testing the micro-devices on the carrier substrate to determine if there is at least one first failed micro-device in the micro-devices;

removing the first failed micro-device from the carrier substrate;

transferring remaining micro-devices from the carrier substrate to a receiving substrate after the removing;

acquiring at least one location of at least one micro-device void on the receiving substrate; and

patching the micro-device void on the receiving substrate with at least one patching micro-device.

2. The method of claim 1, wherein the removing comprises:

reducing a bonding force of a bonding layer used to bond the micro-devices; and

addressably removing the first failed micro-device from the carrier substrate.

3. The method of claim 1, wherein the removing comprises:

reducing a bonding force of a bonding layer used to bond the first failed micro-device while leaving the other micro-device bonded on the carrier substrate; and

removing the first failed micro-device.

4. The method of claim 1, wherein the transferring is performed by at least one transfer head capable of addressably picking at least one of the remaining micro-devices.

5. The method of claim 1, wherein the transferring is performed by at least one transfer head capable of non-addressably picking the remaining micro-devices.

6. The method of claim 1, wherein the transferring is performed by electrostatic chucking, adhesive chucking, or any combination thereof.

7. The method of claim 1, wherein the transferring comprises:

addressably transferring at least one of the remaining micro-devices from the carrier substrate to the receiving substrate; and

addressably transferring at least another of the remaining micro-devices from the carrier substrate to the receiving substrate.

8. The method of claim 1, further comprising:

storing at least one location of the first failed micro-device on the carrier substrate; and

determining the location of the micro-device void on the receiving substrate according to the location of the first failed micro-device on the carrier substrate.

9. The method of claim 1, further comprising:

testing the micro-devices on the receiving substrate to determine if there is at least one pixel having a second failed micro-device on the receiving substrate; and

disposing at least one repairing micro-device onto the pixel having the second failed micro-device on the receiving substrate.