Method of manufacturing ceramic LED packages with higher heat dissipation

• US 9,842,973 B2
• Filed: 07/22/2014
• Issued: 12/12/2017
• Est. Priority Date: 10/29/2004
• Status: Active Grant

• Current Assignee: Ledengin, Inc. (Ams-Osram AG)
• Original Assignee: Ledengin, Inc. (Ams-Osram AG)
• Inventors: Yan, Xiantao
• Primary Examiner(s): Chang, Jay C
• Application Number:
  US14/338,307
• Publication Number:
  US 20140335636A1
• Time in Patent Office: 1,239 Days
• Field of Search: 438106-127
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements

Abstract

Methods of fabricating a light-emitting device are provided. A light-emitting device can be formed from bonding a lens including a plug and a cap to an LED package including a socket configured to receive the plug. The lens can be fabricated using an injection mold formed from a well secured to the LED package and injecting a material into the injection mold to cure into a shape of the lens. The lens can also be fabricated using a blank about the shape of the lens and machining the blank to produce the plug and the cap of the lens. The lens can be bonded to the LED package using a convex bead of adhesive deposited on the surface of the LED package and spreading the adhesive between the lens and the LED package.

Claims

1. A method of fabricating a light-emitting device, the method comprising:

providing a package including;

a light-emitting side, a top surface,

a socket including a socket sidewall and a bottom surface, the socket sidewall disposed between the top surface and a bottom surface of the package, the socket disposed on the light-emitting side of the package; and

a cavity having a floor and configured to transmit light to the light emitting side of the package via the socket;

disposing an LED (light emitting diode) within the cavity and bonded to the floor of the cavity;

disposing a thermal insulation layer within the cavity between the LED and the top surface of the package;

disposing a luminescent layer within the cavity between the thermal insulation layer and the top surface of the package;

providing a glass lens including a cap and a plug, the cap including an upper surface and a lower surface, the plug including a lower surface and a plug sidewall between the lower surface of the plug and the lower surface of the cap, wherein the plug is configured to be disposed within the socket and the lower surface of the cap is configured to be disposed adjacent the top surface of the package; and

disposing an adhesive layer to attach the lower surface of the cap to the top surface of the package, wherein a portion of the adhesive layer is disposed between the luminescent layer and the lower surface of the plug.

2. The method of claim 1, wherein an angle defined between the socket sidewall and the bottom surface of the socket is less than 90 degrees.

3. The method of claim 1, wherein an angle defined between the plug sidewall and the lower surface of the plug is different from an angle defined between the socket sidewall and the bottom surface of the socket.

4. The method of claim 1, wherein the thermal insulation layer does not include luminescent material.

5. The method of claim 1, wherein the cavity further includes a protective capping layer between the luminescent layer and the top surface of the package.

6. The method of claim 1, wherein an angle defined between the plug sidewall and the lower surface of the plug is greater than 90 degrees, the lower surface of the plug has a first width, and a top of the socket sidewall has a second width greater than the first width for guiding the lens into the socket.