Ka band multi-chip modulator

• US 9,844,169 B2
• Filed: 09/01/2015
• Issued: 12/12/2017
• Est. Priority Date: 10/31/2014
• Status: Active Grant

• Current Assignee: Johns Hopkins University
• Original Assignee: Johns Hopkins University
• Inventors: Matlin, Daniel E., Cheng, Sheng, Lehtonen, Seppo J., Penn, John E., Malouf, Perry M., Angert, Matthew P., Haskins, Christopher B., Sharma, Avinash, Treadway, Jacob P., Wallis, Robert E.
• Primary Examiner(s): Tan, Richard
• Application Number:
  US14/842,004
• Publication Number:
  US 20160126891A1
• Time in Patent Office: 833 Days
• Field of Search: 332103, 332117, 332123, 332125
• CPC Class Codes: H03C 3/02 Details
• CPC Class Codes: H03H 11/24 Frequency-independent attenuators
• CPC Class Codes: H05K 9/0056 specially adapted for microwave applications

Abstract

A multi-chip module is provided including a multiplier configured to multiply a frequency of an input signal into a predetermined Ka-band frequency center channel, a modulator configured to modulate the center channel, and an amplifier configured to amplify a modulated signal for output.

Claims

1. A multi-chip module comprising:

an input configured to receive an input signal;

a multiplier configured to multiply a frequency of the input signal and output a Ka-band frequency center channel;

a modulator configured to directly modulate the Ka-band frequency center channel via I/O baseband modulation, wherein modulation of the Ka-band frequency center channel comprises receiving modulation data including in-phase and quadrature data and modulating the in-phase and quadrature data directly into the Ka-band frequency center channel;

a filter configured to smooth the Ka-band frequency center channel and filter out unwanted harmonics;

an amplifier configured to amplify a modulated signal for output;

a first attenuator disposed between the filter and the modulator; and

a second attenuator disposed between the modulator and the amplifier, wherein the first attenuator and the second attenuator are configured to flatten a total gain of the modulator, filter, or multiplier across a predetermined temperature range.

2. The multi-chip module of claim 1, wherein the amplifier is a buffer amplifier.

3. The multi-chip module of claim 1 further comprising:

a waveguide channel configured to suppress waveguide mode propagation.

4. The multi-Chip module of claim 3, wherein the multiplier, modulator, and amplifier are disposed within the waveguide channel.

5. The multi-chip module of claim 1 further comprising:

a hermetically sealable case,

wherein the multiplier, modulator, and amplifier are disposed within the hermetically sealable case.

6. The multi-chip module of claim 5 further comprising:

at least one getter disposed within the hermetically sealable case.

7. The multi-chip module of claim 6, wherein the at least one getter is a hydrogen getter, a moisture getter, or a particle getter.

8. The multi-chip module of claim 5, wherein the hermetically sealable case comprises:

a waveguide channel configured to suppress waveguide mode propagation, and

an internal cover sealing the wave guide channel, and

wherein the multiplier, modulator, and amplifier are disposed within the wave guide channel.

9. The multi-Chip module of claim 5, wherein the hermetically sealable casing is fabricated from Kovar.

10. The multi-chip module of claim 1, wherein the Ka-band frequency center channel is about 23-33 GHz.

11. The multi-chip module of claim 1, wherein the input signal is X-band.

12. The multi-chip module of claim 1, wherein the modulator includes a lange coupler configured to separate the in-phase data and the quadrature data from the Ka-band frequency center channel.

13. A multi-chip module comprising:

an input configured to receive an input signal;

a multiplier configured to multiply a frequency of the input signal and output a Ka-band frequency center channel;

a modulator configured to directly modulate the Ka-band frequency center channel via I/Q baseband modulation, wherein modulation of the Ka-band frequency center channel comprises receiving modulation data including in-phase and quadrature data and modulating the in-phase and quadrature data directly into the Ka-band frequency center channel;

a filter configured to smooth the Ka-band frequency center channel and filter out harmonics;

an amplifier configured to amplify a modulated signal for output;

a hermetically sealable case, wherein the hermetically sealable case comprises;

a waveguide channel configured to suppress waveguide mode propagation, and

an internal cover sealing the wave guide channel, and

wherein the multiplier, modulator, filter, and amplifier are disposed within the wave guide channel;

a first attenuator disposed between the filter and the modulator; and

a second attenuator disposed between the modulator and the amplifier, wherein the first attenuator and the second attenuator are configured to flatten a total gain of the modulator, filter, or multiplier across a predetermined temperature range.

14. The multi-chip module of claim 13 further comprising:

at least one getter disposed within the hermetically sealable case,

wherein the at least one getter comprises a hydrogen getter, a moisture getter, or a particle getter.

15. The multi-chip module of claim 13, wherein the Ka-band frequency center channel is about 23-33 GHz.