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Debonding a glass substrate from carrier using ultrasonic wave

  • US 9,847,243 B2
  • Filed: 08/27/2009
  • Issued: 12/19/2017
  • Est. Priority Date: 08/27/2009
  • Status: Active Grant
First Claim
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1. A process for making a device comprising a thin functional glass substrate having a first surface, a second surface opposite the first surface, and a thickness T1 between the first surface and the second surface, wherein T1

  • 500 μ

    m, comprising the following steps;

    (A) bonding the first surface of the functional glass substrate to a carrier substrate having a thickness T2 that is greater than T1 by using a layer of elastomer bonding agent at a bonding interface including an outer periphery circumscribing a bonding area positioned between the first surface of the functional substrate and a bonding surface of the carrier substrate;

    then(B) processing the second surface of the functional substrate; and

    then(C) targeting an ultrasonic wave at a peripheral area of the outer periphery of the bonding interface to initiate debonding at the peripheral area of the bonding interface to achieve a preferential debonding of the layer of elastomer bonding agent from one of the functional glass substrate and the carrier substrate to release the carrier substrate from the functional substrate.

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