Package-on-package using through-hole via die on saw streets
First Claim
Patent Images
1. A semiconductor device, comprising:
- a first semiconductor die singulated from a semiconductor wafer as a first singulated semiconductor die, the first singulated semiconductor die including a plurality of first contact pads;
a first organic material deposited in a peripheral region outside a footprint of the first singulated semiconductor die over a side surface remaining from singulation and extending from a first surface of the first singulated semiconductor die to a second surface of the first singulated semiconductor die opposite the first surface;
a plurality of first conductive vias formed through the first organic material in the peripheral region outside the footprint of the first singulated semiconductor die;
a plurality of conductive traces formed over the first singulated semiconductor die respectively between the first conductive vias and first contact pads;
a plurality of first bumps formed over the first conductive vias or the first singulated semiconductor die; and
a second semiconductor die disposed over the first singulated semiconductor die and electrically connected to the first bumps.
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Abstract
A semiconductor package-on-package (PoP) device includes a first die incorporating a through-hole via (THV) disposed along a peripheral surface of the first die. The first die is disposed over a substrate or leadframe structure. A first semiconductor package is electrically connected to the THV of the first die, or electrically connected to the substrate or leadframe structure. An encapsulant is formed over a portion of the first die and the first semiconductor package.
56 Citations
30 Claims
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1. A semiconductor device, comprising:
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a first semiconductor die singulated from a semiconductor wafer as a first singulated semiconductor die, the first singulated semiconductor die including a plurality of first contact pads; a first organic material deposited in a peripheral region outside a footprint of the first singulated semiconductor die over a side surface remaining from singulation and extending from a first surface of the first singulated semiconductor die to a second surface of the first singulated semiconductor die opposite the first surface; a plurality of first conductive vias formed through the first organic material in the peripheral region outside the footprint of the first singulated semiconductor die; a plurality of conductive traces formed over the first singulated semiconductor die respectively between the first conductive vias and first contact pads; a plurality of first bumps formed over the first conductive vias or the first singulated semiconductor die; and a second semiconductor die disposed over the first singulated semiconductor die and electrically connected to the first bumps. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor device, comprising:
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a first semiconductor die including an opening in a peripheral region adjacent to the first semiconductor die; an organic material deposited in the opening in the peripheral region to cover a side surface of the first semiconductor die; a plurality of first conductive vias formed through the organic material in the peripheral region adjacent to the first semiconductor die; a first interconnect structure formed over the first conductive vias or the first semiconductor die; and a first encapsulant deposited over the first interconnect structure. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A semiconductor device, comprising:
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a first semiconductor die singulated from a semiconductor wafer; a first organic material deposited in a peripheral region of the first semiconductor die; a first conductive via formed through the first organic material in the peripheral region of the first semiconductor die; a first interconnect structure formed over the first conductive via or the first semiconductor die; and a second semiconductor die disposed over the first semiconductor die. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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21. A semiconductor device, comprising a plurality of stacked semiconductor die each including:
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an organic material deposited around a peripheral region of the semiconductor die; a plurality of conductive vias formed through the organic material; and an interconnect structure formed over the conductive vias or the semiconductor die. - View Dependent Claims (22, 23, 24, 25)
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26. A semiconductor device, comprising:
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a first semiconductor die; a first organic material deposited in a peripheral region of the first semiconductor die; a first conductive via formed through the first organic material; and a first interconnect structure formed over the first conductive via. - View Dependent Claims (27, 28, 29, 30)
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Specification