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Electronic module and method of manufacturing the same

  • US 9,847,274 B2
  • Filed: 12/12/2016
  • Issued: 12/19/2017
  • Est. Priority Date: 08/12/2013
  • Status: Active Grant
First Claim
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1. An electronic module comprising,an electronic chip comprising at least one electronic component,a spacing element comprising a main surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component;

  • anda mold compound at least partially enclosing the electronic chip and the spacing element;

    wherein the spacing element comprises a lateral surface comprising at least one surface structure which provides an interface with the mold compound,wherein the surface structure comprises a three-dimensional form.

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