Electronic module and method of manufacturing the same

• US 9,847,274 B2
• Filed: 12/12/2016
• Issued: 12/19/2017
• Est. Priority Date: 08/12/2013
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Winter, Frank, Geitner, Ottmar, Nikitin, Ivan, Hgerl, Jrgen
• Primary Examiner(s): Haughton, Anthony
• Assistant Examiner(s): AHMAD, YAHYA A.
• Application Number:
  US15/375,855
• Publication Number:
  US 20170092563A1
• Time in Patent Office: 372 Days
• Field of Search: 36167946-67954, 361688-723, 361728
• CPC Class Codes: H01L 21/4871 Bases, plates or heatsinks
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 2224/8384 Sintering
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 3/4608 comprising an electrically conductive base or core
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mould compound and comprises surface structures.

Claims

1. An electronic module comprising,

an electronic chip comprising at least one electronic component,

a spacing element comprising a main surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component;

and

a mold compound at least partially enclosing the electronic chip and the spacing element;

wherein the spacing element comprises a lateral surface comprising at least one surface structure which provides an interface with the mold compound,

wherein the surface structure comprises a three-dimensional form.

2. The electronic module according to claim 1

wherein the lateral surface is substantially perpendicular to the main surface of the spacing element.

3. The electronic module according to claim 1,

wherein the lateral surface is in contact with the mold compound.

4. The electronic module according to claim 1, wherein the at least one surface structure comprises at least one structure out of the group consisting of:

a recess,

a protrusion,

a concave structure,

a convex structure, and

a barb.

5. The electronic module according to claim 4,

wherein the at least one surface structure forming the protrusion extends into the mold structure.

6. The electronic module according to claim 4,

wherein the at least one surface structure forming the protrusion has a triangle shape.

7. The electronic module according to claim 1, wherein the spacing element comprises a thermally conductive material.

8. The electronic module according to claim 1, wherein the spacing element comprises an electrically conductive material.

9. The electronic module according to claim 1, further comprising at least one outer heat conductive layer in thermal connection to the spacing element.

10. The electronic module according to claim 9, further comprising a further outer heat conductive layer, wherein the further outer heat conductive layer is arranged on a main surface of the electronic module which is opposite to a further main surface of the electronic module on which the at least one heat conductive surface is arranged.

11. The electronic module according to claim 1, wherein the spacing element is fixed to the electronic chip by one process out of the group consisting of:

soldering;

sintering; and

gluing.

12. The electronic module according to claim 1, wherein the at least one surface structure is configured for increasing the area of the lateral surface in comparison to a planar sidewall extending perpendicular to the main surface.

13. The electronic module according to claim 1, wherein the at least one surface structure constitutes a curved lateral surface.

14. A method of manufacturing an electronic module, the method comprising:

providing an electronic chip comprising at least one electronic component;

forming a spacing element comprising a main surface arranged on the electronic chip and a lateral surface comprising at least one surface structure;

contacting the main surface of the spacing element to the electronic chip in a thermally conductive way;

molding a molding compound at least partially enclosing the spacing element and the electronic chip, so that the molding compound provides an interface with the at least one surface structure of the spacing element,

wherein the surface structure comprises a three-dimensional form.

15. The method according to claim 14, further comprising:

forming the at least one surface structure on a pre-element by at least one process out of the group consisting;

stamping;

pressing;

molding;

sputtering;

milling;

sintering;

peening; and

rolling.

16. The method according to claim 14, wherein the contacting of the main surface of the spacing element to the electronic chip is performed by one process selected out of the group consisting of:

soldering;

sintering; and

glueing.

17. An electronic module, the module comprising:

an electronic arrangement; and

a mold compound at least partially enclosing the electronic arrangement,

wherein the electronic arrangement comprises a substrate, an electronic chip arranged on the substrate, and a spacing element arranged on the electronic chip,

wherein the electronic arrangement further comprises a lateral surface comprising surface structures adapted to increase a surface area of the electronic arrangement,

wherein the surface structures comprise a three-dimensional form,

wherein the mold compound provides an interface with the surface structures.

18. The electronic module of claim 17,

wherein the mold compound is in direct contact with the surface structures.

19. The electronic module of claim 17, wherein the surface structures are formed on the spacing element.

20. The electronic module of claim 17, wherein the electronic module further comprises a plurality of spacing elements.