LED thin-film device partial singulation prior to substrate thinning or removal

• US 9,847,445 B2
• Filed: 03/29/2013
• Issued: 12/19/2017
• Est. Priority Date: 04/05/2012
• Status: Active Grant

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Koninklijke Philips N.V.
• Inventors: Wei, Frank
• Primary Examiner(s): Malek, Maliheh
• Application Number:
  US14/389,780
• Publication Number:
  US 20150064808A1
• Time in Patent Office: 1,726 Days
• Field of Search: 438 25, 438 26, 438 28, 438 33, 438 34, 438106, 438110-114
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Abstract

LED dies are partially singulated while on an unthinned depth growth substrate. Slots are made through the streets separating the LED dies, but not through the growth substrate, leaving the now separated LED dies on the growth substrate. A secondary support is attached to the LED dies on the opposite surface from the growth substrate, and the growth substrate is thinned or removed, leaving the LED dies on the secondary support. Because the LED dies are separated while on the unthinned growth substrate, the likelihood of distortion before slicing is virtually eliminated, and the width of the streets between the LED dies may be correspondingly reduced.

Claims

1. A method comprising:

forming light emitting device (LED) dies on a growth substrate, wherein streets lie between the LED dies and each LED die comprises pads for receiving power at a same surface opposite the substrate;

forming slots through the streets without completely penetrating through the growth substrate; and

,

after forming the slots;

attaching a flexible film to the LED dies on the surface opposite from the growth substrate, wherein flexible film covers the slots so the slots remain unfilled;

while the LED dies are attached to the flexible film, thinning or removing the growth substrate;

after said thinning or removing, stretching the flexible film to provide additional space between the LED dies and applying a wavelength conversion layer over the LED dies; and

after said stretching, singulating the LED dies.

2. The method of claim 1, wherein the wavelength conversion layer is a preformed sheet of wavelength conversion material.

3. The method of claim 2, further comprising testing the LED dies and sorting the LED dies after singulation based on the testing.

4. The method of claim 3, including selecting the wavelength conversion layer material based on the testing of the LED dies.

5. The method of claim 1, wherein forming the slots includes laser cutting, and the singulating includes mechanical sawing.

6. The method of claim 1, wherein singulating the LED dies includes removing the flexible film from the LED dies.

7. The method of claim 1, including finishing a light emitting surface of the LED dies before singulating the LED dies.

8. The method of claim 1, wherein said applying comprises applying a phosphor coating over the LED dies, and said singulating comprises mechanical sawing.

9. The method of claim 8, further comprising, after said singulating, removing the flexible film from the LED dies.