Array substrate for mounting chip and method for manufacturing the same

• US 9,847,462 B2
• Filed: 10/28/2014
• Issued: 12/19/2017
• Est. Priority Date: 10/29/2013
• Status: Active Grant

• Current Assignee: Point Engineering Co. Ltd.
• Original Assignee: Point Engineering Co. Ltd.
• Inventors: Nam, Ki Myung, Park, Seung Ho, Jun, Young Chul
• Primary Examiner(s): Whalen, Daniel
• Assistant Examiner(s): CHI, SUBERR L
• Application Number:
  US14/525,478
• Publication Number:
  US 20150115310A1
• Time in Patent Office: 1,148 Days
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/486 adapted for surface mounting

Abstract

Provided is an array substrate for mounting a chip. The array substrate includes a plurality of conductive layers unidirectionally stacked with respect to an original chip substrate; a plurality of insulating layers alternately stacked with the plurality of conductive layers, and electrically separate the plurality of conductive layers; and a cavity having a groove of a predetermined depth with respect to a region including the plurality of insulating layers in an upper surface of the original chip substrate. Accordingly, since the optical device array of a single structure is used as a line source of light, an emission angle emitted from the optical device is great, it is not necessary to form an interval for supplying an amount of light, and a display device can be simply constructed. Further, since it is not necessary to perform soldering a plurality of LED packages on a printed circuit board, a thickness of a back light unit can be reduced.

Claims

1. An array substrate for mounting a chip to a circuit board, the array substrate comprising:

a plurality of conductive parts arranged in one direction, whereon a plurality of chips are mounted in the one direction, each of the plurality of conductive parts having a chip-mounting surface, and a back surface opposite the chip-mounting surface for mounting the array substrate to the circuit board;

one or more insulating parts alternately arranged with the plurality of conductive parts for electrically separating the plurality of conductive parts,

protrusion parts whose heights are different from that of a surface of the conductive parts whereon the chip is mounted, the protrusion parts being arranged at both ends and a central portion of the array substrate; and

concave parts depressed in a lateral direction with respect to side surfaces of the array substrate, the concave parts being arranged only at the both ends and the central portion where the protrusion parts are arranged.

2. The array substrate according to claim 1, further comprising a plating layer formed on a surface of the concave parts.

3. The array substrate according to claim 1, wherein the protrusion parts comprise an inclined surface extending to and having an angle with respect to the surface of the conductive part.